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Device and method for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications

  • US 6,339,256 B2
  • Filed: 01/05/1999
  • Issued: 01/15/2002
  • Est. Priority Date: 06/06/1997
  • Status: Expired due to Fees
First Claim
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1. A printed circuit board for chip-on-board applications, the printed circuit board comprising:

  • a first dielectric layer including a top surface;

    a first conductive layer positioned adjacently above the top surface of the first dielectric layer and including an upwardly facing die-mounting surface within a chip-attach area of the first conductive layer for direct conductive attachment to a backside surface of a bare integrated circuit chip to establish at least one of electrical and thermal conduction between the top surface of the first conductive layer and a bare integrated circuit chip;

    a second dielectric layer positioned adjacently above the upwardly facing die-mounting surface of the first conductive layer, the second dielectric layer having an aperture therein to further define the chip-attach area of the first conductive layer and to receive a bare integrated circuit chip;

    a second conductive layer positioned adjacently below the first dielectric layer, the second conductive layer extending laterally underneath at least the chip-attach area of the first conductive layer, the second conductive layer vertically insulated from direct electrical communication with the first conductive layer;

    an insulative substrate positioned adjacently below the second conductive layer; and

    a layer of signal traces superimposed on the second dielectric layer in a substantially parallel relationship therewith, at least some of the signal traces of the layer of signal traces including bond pads for electrical connection to a front-side surface of a bare integrated circuit chip.

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