×

Means and process for encapsulating electric circuits by means of injection molding

  • US 6,340,791 B1
  • Filed: 08/23/1999
  • Issued: 01/22/2002
  • Est. Priority Date: 08/22/1998
  • Status: Expired due to Fees
First Claim
Patent Images

1. A structure for protecting an electric circuit comprising:

  • a circuit surrounded with a thermoplastic polymer which is applied by injection molding, wherein the thermoplastic polymer is comprised of oriented macromolecules and wherein a majority of the components of the circuit are aligned with their axis most sensitive to alternating tensile loading being parallel to the respective direction of the macromolecules present in the vicinity of the components.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×