Method of making electronic equipment

• US 6,341,413 B1
• Filed: 08/05/1999
• Issued: 01/29/2002
• Est. Priority Date: 07/18/1995
• Status: Expired due to Term

• Current Assignee: Omron Corporation
• Original Assignee: Omron Corporation
• Inventors: Noda, Satoshi, Kitani, Toshiki, Kitamura, Kyouji, Uda, Hideo, Shimizu, Takeshi, Hayashi, Kazuhiro, Konishi, Giichi, Niimi, Chikashi
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US09/368,165
• Time in Patent Office: 908 Days
• Field of Search: 296/021, 264/272.16, 264/272.18, 264/272.19, 174/52.2, 174/525.F
• US Class Current: 29/602.1
• CPC Class Codes: G01V 3/10 using induction coils
• CPC Class Codes: H03K 17/9505 Constructional details
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

An electronic equipment such as a proximity sensor. A groove for discharging air is formed at coil casing (7) arranged at a front surface of the proximity sensor. An opening (43) is formed at a clamp portion (9) holding a code (10) behind a metal casing (8). The proximity sensor (1) is held at a low pressure, and resin is supplied through the opening (43) at the clamp portion (9), whereby the casing can be filled with the resin in a short time.

Claims

1. A method of manufacturing an electronic equipment wherein an electronic part is accommodated in a casing filled with resin and having a resin inlet at its one end portion and an opening at the other end portion, the method comprising the steps of:

putting said electronic part into said casing;

attaching a cover over said opening at said casing, said cover forming a gap for an air flow between said casing and said cover;

lowering a pressure in said casing by externally discharging air in said casing through said gap;

said

supplying resin through said resin inlet into said casing;

wherein

said electronic part includes;

a coil, a coil casing for accommodating said coil, and a circuit board; and

supplying primary filler resin into said coil casing already accommodating said coil and a part of said circuit board, and

attaching said coil casing to said casing after hardening of the primary filler resin supplied into said coil casing.

2. The method of manufacturing the electronic equipment according to claim 1, further comprising the step of holding said casing in a die after said step of attaching the cover and wherein the step of lowering pressure is conducted while said casing is being held in said die.