Capacitive pressure sensor

• US 6,341,527 B1
• Filed: 10/04/2000
• Issued: 01/29/2002
• Est. Priority Date: 10/06/1999
• Status: Expired due to Term

• Current Assignee: Yamatake Corporation
• Original Assignee: Yamatake Corporation
• Inventors: Soeda, Masaru, Masuda, Takashi, Kimura, Shigeo, Ishikura, Yoshiyuki, Kataoka, Toshiyuki
• Primary Examiner(s): OEN, WILLIAM L
• Application Number:
  US09/680,391
• Time in Patent Office: 482 Days
• Field of Search: 737/18, 737/28, 361/283.1, 361/283.2, 361/283.3, 361/283.4
• US Class Current: 73/718
• CPC Class Codes: G01L 9/0075 using a ceramic diaphragm, e.g. alumina, fused quartz, glass

Abstract

A capacitive pressure sensor includes lower and upper wafers, a stationary electrode, first and second pads, a movable electrode, and a plurality of extraction electrodes. The lower wafer has a first capacitor forming portion and a first pad forming portion communicating with it. The upper wafer has a second capacitor forming portion, constituting a capacitor chamber together with the first capacitor forming portion, and a second pad forming portion communicating with it. The stationary electrode is formed on a bottom surface of the first capacitor forming portion. The first pad is formed on a bottom surface of the first pad forming portion and connected to the stationary electrode through a first interconnection. The movable electrode is formed on a bottom surface of the second capacitor forming portion to oppose the stationary electrode. The second pad is formed in the second pad forming portion and connected to the movable electrode through a second interconnection. The extraction electrodes are connected to the first and second pads and extracted outside through holes in the lower wafer. The lower and upper wafers are bonded to each other such that their pad forming portions are covered with their bonding surfaces.

Claims

1. A capacitive pressure sensor comprising:

a first base member with a first main recess and a first sub-recess communicating with said first main recess;

a second base member with a second main recess constituting a capacitor chamber together with said first main recess, and a second sub-recess communicating with said second main recess, said second main recess having a bottom surface that constitutes a diaphragm;

a stationary electrode formed on a bottom surface of said first main recess;

a first pad formed on a bottom surface of said first sub-recess and connected to said stationary electrode through a first interconnection;

a movable electrode formed on a bottom surface of said second main recess to oppose said stationary electrode;

a second pad formed in said second sub-recess and connected to said movable electrode through a second interconnection; and

a plurality of extraction electrodes connected to said first and second pads and extracted outside through through holes formed in said first base member,

wherein said first and second base members are bonded to each other such that said first and second sub-recesses are covered with bonding surfaces of said second and first base members.

2. A sensor according to claim 1, wherein said extraction electrodes are made of molten solder which is filled in said through holes, and is cooled and solidifies to attach to said first and second pads.

3. A sensor according to claim 2, further comprising solder outflow preventive walls in said first and second sub-recesses to constitute bypasses for the solder flowing out into a portion between said first and second sub-recesses and inner walls thereof.

4. A sensor according to claim 3, wherein

said outflow preventive walls are arranged around said first and second pads in a substantially ring-like shape and have notches forming connection paths for said first and second interconnections to said first and second pads, and

said first and second interconnections are arranged in a substantially ring-like shape so as to further surround said outflow preventive walls.

5. A sensor according to claim 4, wherein said notches of said outflow preventive walls are formed in directions different from directions in which said first and second interconnections extend toward said stationary and movable electrodes.

6. A sensor according to claim 5, wherein said notches of said outflow preventive walls are formed in directions to form angles of substantially 180°

with the directions in which said first and second interconnections extend toward said stationary and movable electrodes.

7. A sensor according to claim 5, wherein

said notches in said outflow preventive walls are formed in directions to form angles of 0°

to 180°

with the directions in which said first and second interconnections extend toward said stationary and movable electrodes, and

said first and second interconnections are connected to said stationary and movable electrodes via arcs on sides opposite to the angles formed by said notches of said outflow preventive walls.

8. A sensor according to claim 5, wherein said outflow preventive walls are formed with a C shape.

9. A sensor according to claim 5, wherein said outflow preventive walls are formed with a shape of a question mark, and one end of each of said notches is connected to a corresponding one of said inner walls of said first and second sub-recesses.

10. A sensor according to claim 2, further comprising solder outflow preventive members for prohibiting outflow of the molten solder at a communicating portion of said first main recess and said first sub-recess, and a communicating portion of said second main recess and said second sub-recess.

11. A sensor according to claim 10, wherein said solder outflow preventive members disconnect outflow paths for the molten solder that flows out on said first and second interconnections from said first and second sub-recesses to said first and second main recesses.

12. A sensor according to claim 10, wherein said solder outflow preventive members are made of a material with a solder wettability poorer than those of said first and second interconnections.