Photoelectric module device

• US 6,342,670 B1
• Filed: 09/19/2000
• Issued: 01/29/2002
• Est. Priority Date: 09/19/2000
• Status: Active Grant

• Current Assignee: Lite-On Technology Corporation
• Original Assignee: Lite-On Electronics Company Limited (Lite-On Technology Corporation)
• Inventors: Lin, Ching Kai, Tseng, Hsu Keng
• Primary Examiner(s): DIAMOND, ALAN D
• Application Number:
  US09/664,780
• Time in Patent Office: 497 Days
• Field of Search: 136/244, 136/256, 136/293, 136/251, 257/79, 257/431, 257/443, 257/433, 250/216, 250/239, 438/64, 438/66, 438/127, 438/107, 428/901, 362/800
• US Class Current: 136/251
• CPC Class Codes: G08C 23/04 using light waves, e.g. infrared
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: Y10S 136/293 Circuits
• CPC Class Codes: Y10S 362/80 Light emitting diode
• CPC Class Codes: Y10S 428/901 Printed circuit

Abstract

A photoelectric module device comprising a multiple layer printed circuit board and at least one photoelectric module device is provided. The multiple layer printed circuit board has at least an upper circuit board substrate, a lower circuit board substrate, and a circuit. A plurality of photoelectric elements are installed on the multiple layer printed circuit board and is electrically connected to the circuit. The photoelectric elements are packaged above the multiple layer printed circuit board by injection molding a transparent resin thereon. The lower substrate has a plurality of through holes formed therein and the inner wall of the through holes is plated with metal, as an electric terminal. The upper circuit board substrate serves to seal the through holes and prevent resin from permeating therein during the injection molding process. When the circuit board is cut into separate photoelectric module devices, after packaging, the inner wall of the through holes are partially cut away and the remaining portion thereof becomes a terminal for electrically connecting to external devices.

Claims

1. A photoelectric module device comprising:

a multiple layer printed circuit board having at least an upper circuit board substrate, a lower circuit board substrate, and a circuit;

at least one photoelectric element installed on the multiple layer printed circuit board and electrically connected to the circuit;

a transparent resin injection molded onto the photoelectric element on the multiple layer printed circuit board to form a package therefore;

the photoelectric module device characterized in that;

a lateral surface of the lower circuit board substrate has a plurality of terminals electrically connected to the circuit for electrical connection to external devices;

wherein each of the terminals is formed on a residual portion of an inner wall of a through hole formed on the lower circuit board substrate after a portion of said inner wall is cut away and said upper circuit board substrate serves to seal the through holes for preventing said resin from permeating therein in said injection molding.

2. The photoelectric module device as claimed in claim 1, wherein the photoelectric module device includes at least one light emitter and at least one light receiving element.

3. The photoelectric module device as claimed in claim 1, wherein the photoelectric module device includes at least one light emitter.

4. The photoelectric module device as claimed in claim 3, wherein the light emitter is at least one light emitting diode chip.

5. The photoelectric module device as claimed in claim 1, wherein the photoelectric module device includes at least one light receiving element.

6. The photoelectric module device as claimed in claim 5, wherein the light receiving element is at least one charge coupled device chip.