Surface mount coupler device
First Claim
1. A surface mount coupler device comprising a device body having at least four electrical terminations located thereon, said device body including:
- an insulating substrate having a top surface and a bottom surface;
a first insulative layer disposed on said top surface of said substrate and being formed of an insulative polymeric material, said first insulative layer defining first and second conductor channels therein;
a first conductor situated in and substantially filling said first conductor channel, said first conductor electrically connected to first and second terminations on said device body;
a second conductor situated in and substantially filling said second conductor channel, said second conductor being electrically connected to at least a third termination on said device body; and
an insulating cover layer disposed above said first insulative layer.
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Accused Products
Abstract
A surface mount coupler device is provided having a device body with a plurality of terminations located thereon. The coupler device is particularly useful in high frequency circuits to provide coupling between two circuit lines without direct electrical contact. For example, the device may provide coupling between a feedback control loop and an amplifier output section in a RF transmitter. The device body is built up on a rigid insulative substrate. During manufacture, one or more layers of insulative polymer are applied to the insulative substrate. The insulative polymer defines conductor channels in which primary and secondary conductors are located. The primary and secondary conductors are electrically connected to a respective pair of the terminations located on the device body. A sealing cover, preferably glass, is located above the polymeric insulative layers.
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Citations
16 Claims
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1. A surface mount coupler device comprising a device body having at least four electrical terminations located thereon, said device body including:
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an insulating substrate having a top surface and a bottom surface;
a first insulative layer disposed on said top surface of said substrate and being formed of an insulative polymeric material, said first insulative layer defining first and second conductor channels therein;
a first conductor situated in and substantially filling said first conductor channel, said first conductor electrically connected to first and second terminations on said device body;
a second conductor situated in and substantially filling said second conductor channel, said second conductor being electrically connected to at least a third termination on said device body; and
an insulating cover layer disposed above said first insulative layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification