Memory module
First Claim
1. A memory module comprising:
- a circuit board on which memory chips are mounted, a plurality of latching holes being defined on the circuit board; and
a shielding casing comprising a flat plate mated with a face of the circuit board and a plurality of latching arms engaged with latching holes defined in the circuit board, thereby attaching the casing to the circuit board, the shielding casing forming a raised portion for defining a space to accommodate the memory chips therein, a recess being formed in the raised portion with a bottom surface thereof contacting the memory chips.
2 Assignments
0 Petitions
Accused Products
Abstract
A memory module includes a circuit board on which memory chips are mounted and a metal casing attached to the circuit board for shielding the memory chips. Conductive traces are formed on the circuit board for electrically engaging corresponding portions of the casing to ground the casing. The casing forms a raised portion defining a space for accommodating the memory chips. A recess is formed on the raised portion and a bottom surface of the recess contacts the memory chips to conduct and remove heat from the memory chips. Ventilation holes are defined in the raised portion for facilitating heat removal. The casing forms two positioning pins inserted into corresponding positioning holes defined in the circuit board for properly positioning the casing with respect to the circuit board. The casing also forms two latching arms engaging with corresponding latching holes defined in the circuit board for securing the casing to the circuit board.
110 Citations
13 Claims
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1. A memory module comprising:
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a circuit board on which memory chips are mounted, a plurality of latching holes being defined on the circuit board; and
a shielding casing comprising a flat plate mated with a face of the circuit board and a plurality of latching arms engaged with latching holes defined in the circuit board, thereby attaching the casing to the circuit board, the shielding casing forming a raised portion for defining a space to accommodate the memory chips therein, a recess being formed in the raised portion with a bottom surface thereof contacting the memory chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A memory module comprising:
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a circuit board on which a plurality of memory chips are mounted; and
a shielding casing having a similar planar dimension with the circuit board and attached thereto, and defining a raised portion enclosing therein said memory chips;
whereina bottom surface of the shielding casing contacts the chips for heat transfer consideration. - View Dependent Claims (12, 13)
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Specification