Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making

• US 6,343,171 B1
• Filed: 04/20/1999
• Issued: 01/29/2002
• Est. Priority Date: 10/09/1998
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Yoshimura, Tetsuzo, Roman, James J., Lee, Michael G., Wang, Wen-chou Vincent, Chou, William, Beilin, Solomon I., Massingill, Thomas J., Inao, Masaaki, Takahashi, Yashuhito
• Primary Examiner(s): Bovernick, Rodney
• Assistant Examiner(s): Kang, Juliana K.
• Application Number:
  US09/295,813
• Time in Patent Office: 1,015 Days
• Field of Search: 385/14, 385/15, 385/18, 385/24, 385/39, 385/49, 385/50, 385/45, 385/47, 385/130
• US Class Current: 385/50
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 2006/12107 Grating
• CPC Class Codes: G02B 6/06 the relative position of the fibres being the same at both ends, e.g. for transporting images
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/124 Geodesic lenses or integrated gratings
• CPC Class Codes: G02B 6/132 by deposition of thin films
• CPC Class Codes: G02B 6/136 by etching
• CPC Class Codes: G02B 6/42 Coupling light guides with opto-electronic elements
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05611 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05664 : Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/12105 : Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/16225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2224/24137 : the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73267 : Layer and HDI connectors
• CPC Class Codes: H01L 2224/82039 : using a laser
• CPC Class Codes: H01L 2224/92244 : the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/48 : Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/5389 : the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/96 : the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/167 : comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/0101 : Neon [Ne]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01018 : Argon [Ar]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12043 : Photo diode
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H05K 1/0274 : Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/14 : Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00

Abstract

Opto-electrical systems having electrical and optical interconnections formed in thin layers with thin-film active devices are disclosed. In one embodiment, optical connections are made between the edge of one substrate and the surface of another substrate with the use of photorefractive materials. In another embodiment, the optical connection is made by separating a optical film from the first substrate and coupling the first substrate and the optical film to separate receptacles located on the second substrate. Film optical link modules employing aspects of the invention are also disclosed.

Claims

1. An apparatus having optical and electrical interconnections, comprising:

a first substrate having a first polymeric waveguide formed therein and integrally formed with at least one opto-electronic device, said first waveguide having a first end which extends to a first edge of said first substrate;

a second substrate having a second polymeric waveguide formed therein;

a first vertical optical coupler formed in said second substrate and optically coupled to said second waveguide in said second substrate;

wherein said first edge of said first substrate abuts a surface of said second substrate and is aligned such that the first end of said first waveguide of said first substrate is aligned with said first vertical optical coupler in said second substrate, and wherein an amount of photo-refractive material is disposed between first end of said first waveguide and the first vertical coupler and is adhered to the first edge of said first substrate and to said surface of the second substrate.

2. The apparatus of claim 1, wherein at least a portion of at least one of said substrates is formed by a build-up process.

3. The apparatus of claim 1, wherein at least a portion of at least one of said substrates is formed by a lamination process.

4. The apparatus of claim 1 wherein said second substrate has a major surface, wherein said second waveguide in said second substrate has a first portion which conveys light in a direction that is parallel to the major surface and a second portion which conveys light in a direction that is perpendicular to the major surface, said first portion of the second waveguide having a first end optically coupled to said first vertical optical coupler and a second end, said second portion of the second waveguide having a first end optically coupled to said first vertical optical coupler and a second end disposed at the major surface.

5. The apparatus of claim 4, wherein at least a portion of at least one of said substrates is formed by a build-up process.

6. The apparatus of claim 1, further comprising:

at least one additional substrate, each additional substrate having a polymeric waveguide formed therein; and

a second vertical optical coupler formed in one of said additional substrates and optically coupled to the waveguide in said additional substrate.

7. The apparatus of claim 5 wherein at least a portion of at least one of said substrates is formed by a build-up process.

8. The apparatus of claim 6, wherein one of said additional substrates has a major surface, wherein said waveguide in said one of said additional substrates has a first portion which conveys light in a direction that is parallel to the major surface and a second portion which conveys light in a direction that is perpendicular to the major surface, said first portion of said waveguide having a first end optically coupled to said second vertical optical coupler and a second end, said second portion of said waveguide having a first end optically coupled to said second vertical optical coupler and a second end disposed at the major surface.

9. The apparatus of claim 8 wherein each of said first and second substrates is formed by depositing and patterning a plurality of polymer layers to integrally form said substrates.

10. The apparatus of claim 1, further comprising:

at least one additional substrate having polymeric waveguides formed therein;

an additional vertical optical coupler formed in one of the additional substrates and optically coupled to a waveguide in said one of the additional substrates;

wherein said one of the additional substrates is stacked face-to-face with one of said first and second substrates and optically coupled thereto by said additional vertical optical coupler.

11. An apparatus having optical and electrical connections, comprising:

a first substrate having a first major surface, first edge, a first area on the first major surface which is disposed alone the first edge, and a second area on the first major surface;

a polymer layer attached to the second area of said first major surface and separated from the first area of said first major surface, said polymer layer comprising a first edge parallel with the first edge of the first substrate and a first polymeric waveguide formed within said polymer layer, said first waveguide having a first end which extends to the first edge of said polymer layer;

a second substrate having a second polymeric waveguide formed therein, a first surface, a second surface, a first receptacle located at said first surface, and a second receptacle located at said first surface;

a first vertical optical coupler formed in said second substrate and optically coupled to a said second waveguide in said second substrate; and

wherein the first edge of said first substrate abuts the first receptacle, and wherein the first edge of the polymer layer abuts the second receptacle and is aligned thereto such that the first end of said first waveguide is aligned with said first vertical optical coupler in said second substrate.

12. The apparatus of claim 11, wherein optical glue is disposed between said first vertical optical coupler and said first end of said first waveguide.

13. The apparatus of claim 11, wherein a photo-refractive layer is disposed between said first vertical optical coupler and said first end of said first waveguide.

14. The apparatus of claim 11, wherein at least a portion of at least one of said substrates and said polymer layer is formed by a build-up process.

15. The apparatus of claim 11, further comprising:

at least one additional substrate, each additional substrate having polymeric waveguides formed therein;

an additional vertical optical coupler formed in said at least one additional substrate and optically coupled to a waveguide in said at least one additional substrate.

16. The apparatus of claim 15, wherein at least a portion of one of said substrates is formed by a build-up process.

17. The apparatus of claim 11, further comprising:

at least one additional substrate having polymeric waveguides formed therein;

an additional vertical optical coupler formed in one of the additional substrates and optically coupled to a waveguide in said one of the additional substrates;

wherein said one of the additional substrates is stacked face-to-face with one of said first and second substrates and optically coupled thereto by said additional vertical optical coupler.

18. The apparatus of claim 17 wherein at least a portion of one of said substrates is formed by a build-up process.

19. The apparatus of claim 18, wherein adjacent portions of the substrates which are stacked face-to-face are formed and stacked together by a build-up process.

20. The apparatus of claim 11 further comprising:

a second vertical optical coupler formed in said second substrate and optically coupled to said second waveguide in said second substrate;

a third substrate having a third polymeric waveguide formed therein, said third waveguide have a first end which extends to a first edge of said third substrate; and

wherein said first edge of said third substrate abuts the second surface of said second substrate and is aligned such that the first end of said third waveguide of said third substrate is aligned with said second vertical optical coupler in said second substrate.

21. A film optical link module, comprising:

a polymer substrate portion having a first set of polymeric waveguides integrally formed therein;

a flexible polymer coupling portion having a second set of polymeric waveguides integrally formed therein, said flexible polymer coupling portion and said polymer substrate portion having a common integrally-formed polymer layer, said common polymer layer having formed within it at least some of the polymeric waveguides of said first set and at least some of the polymeric waveguides of said second set; and

wherein at least a part of said first set and said second set of polymeric waveguides are optically coupled; and

wherein said flexible polymer coupling portion comprises a plurality of flexible polymer ribbon segments connected at one end to at least one edge of said first substrate portion, each said ribbon segment having a set of polymeric waveguides formed integrally therein and optically coupled to a corresponding set of waveguides in said substrate portion; and

at least one optical connector coupling the free ends of said plurality of ribbon segments into a two-dimensional array of waveguides.

22. A film optical link module, comprising:

a polymer substrate portion having a first set of polymeric waveguides integrally formed therein;

a flexible polymer coupling portion having a second set of polymeric waveguides integrally formed therein, said flexible polymer coupling portion and said polymer substrate portion having a common integrally-formed polymer layer, said common polymer layer having formed within it at least some of the polymeric waveguides of said first set and at least some of the polymeric waveguides of said second set; and

wherein at least a part of said first set and said second set of polymeric waveguides are optically coupled; and

wherein said substrate portion further comprises a plurality of optical couplers and active devices integrally formed in said substrate portion and configured for opto-electronic communication with at least one chip disposed above the polymer substrate portion.

23. The optical link module of claim 22, further comprising at least one additional opto-electronic substrate with active devices coupled to at least one surface of said substrate portion.

24. A film optical link module, comprising:

a polymer substrate portion having a first set of polymeric waveguides integrally formed therein;

a flexible polymer coupling portion having a second set of polymeric waveguides integrally formed therein, said flexible polymer coupling portion and said polymer substrate portion having a common integrally-formed polymer layer, said common polymer layer having formed within it at least some of the polymeric waveguides of said first set and at least some of the polymeric waveguides of said second set; and

wherein at least a part of said first set and said second set of polymeric waveguides are optically coupled;

wherein a plurality of said second set of polymeric waveguides have free ends for coupling to one or more optical connectors; and

wherein the waveguide mode sizes of said plurality of polymeric waveguides in said flexible polymer coupling portion are adjusting along the lengths of the waveguides to improve the optical coupling of signals from their free ends to the substrate portion.

25. A film optical link module, comprising:

a first set of polymeric waveguides provided by a two-dimensional fiber array or fiber imaging guide;

a polymer substrate separate from said two-dimensional fiber array or fiber imaging guide and having a second set of polymeric waveguides integrally formed therein, a major surface, and a location on said major surface over which said two-dimensional fiber array or fiber imaging guide is positioned; and

a plurality of vertical couplers disposed in said polymer substrate in said location and optically coupled to at least some of the polymeric waveguides of the second set thereof formed in said polymer substrate, and further located to optically couple to at least some of the polymeric waveguides of the first set thereof.

26. The optical link module of claim 25, wherein said polymer substrate further comprises a plurality of optical couplers and active devices for opto-electronic communication with at least one chip.