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Pulsed-mode RF bias for sidewall coverage improvement

  • US 6,344,419 B1
  • Filed: 12/03/1999
  • Issued: 02/05/2002
  • Est. Priority Date: 12/03/1999
  • Status: Expired due to Fees
First Claim
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1. A method of depositing a material on a substrate in a process chamber, comprising:

  • (a) providing a first signal to a support member having the substrate disposed thereon;

    (b) providing a second signal to a target;

    (c) energizing a magnetic field generator disposed in the processing chamber;

    (d) varying the first signal between a first negative voltage portion and a first zero voltage portion relative to ground during a first phase; and

    (e) maintaining the first signal at a constant voltage during a second phase.

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