Power electronic component including cooling means

• US 6,344,686 B1
• Filed: 11/23/1999
• Issued: 02/05/2002
• Est. Priority Date: 11/27/1998
• Status: Expired due to Term

• Current Assignee: Alstom Holdings (Alstom SA)
• Original Assignee: Alstom Holdings (Alstom SA)
• Inventors: Schaeffer, Christian, Mermet-Guyennet, Michel
• Primary Examiner(s): Lee, Eddie
• Assistant Examiner(s): CHU, CHRIS C
• Application Number:
  US09/447,832
• Time in Patent Office: 805 Days
• Field of Search: 257/712, 257/714, 257/706, 257/772, 257/779, 257/780, 257/781
• US Class Current: 257/712
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The power electric component comprises first and second heat transfer and electrical insulation composite structures and at least one power semiconductor circuit which has connecting terminals. The first composite structure includes respective conductive or semiconductor layers adjacent to the semiconductor circuit and conductive or semiconductor layers opposite to the semiconductor circuit. The connecting terminals are attached on the side opposite the first composite structure to a plane array of mutually insulated conductive members, wherein the array is integrated into the second composite structure which includes a conductive or semiconductor layer opposite to the semiconductor circuit. The opposite layer of at least the first composite structure or the second composite structure includes flow passages for a heat transfer fluid so that the component can be cooled from its top and bottom faces.

Claims

1. A power electronic component comprising:

a first heat transfer and electrical insulation composite structure including first and second conductive or semiconductive layers and an insulative layer interposed between said first and second conductive or semiconductive layers;

at least one power semiconductor circuit disposed on said first conductive or semiconductive layer of said first composite structure, said power semiconductor circuit including a plurality of connecting terminals located on a side opposite said first composite structure; and

a second heat transfer and electrical insulation composite structure including a plane array of mutually insulated conductive members, a third conductive or semiconductive layer and a second insulative layer interposed between said plane array and said third conductive or semiconductive layer, wherein said connecting terminals are attached said plane array of mutually insulated conductive members, and at least one of the second conductive or semiconductive layer of the first composite structure or the third conductive or semiconductive layer of the second composite structure comprises flow means for a heat transfer fluid.

2. A component according to claim 1, wherein said at least one of said second and third conductive or semiconductive layers is made of a semiconductor material.

3. A component according to claim 2, wherein said at least one of said second and third conductive or semiconductive layers comprises first and second wafers assembled together, at least one of the first and second wafers having grooves, and wherein the heat transfer fluid flow means comprises through passages formed by said grooves when said first and second wafers are assembled together.

4. A component according to claim 3, wherein said first and second wafers have respective series of grooves and the passages are formed by co-operation of shapes between said grooves on respective opposite sides of a junction plane of the first and second wafers.

5. A component according to claim 4, wherein said passages have a hexagonal cross-section.

6. A component according to claim 1, wherein said at least one of said second and third conductive or semiconductive layers is made of a metallic material.

7. A component according to claim 6, wherein said heat transfer fluid flow means open onto a distal face of said at least one of said second and third conductive or semiconductive layers.

8. A component according to claim 7, wherein said flow means comprises at least one passage extending over at least a portion of at least one dimension of said at least one of said second and third conductive or semiconductive layers.

9. A component according to claim 1, wherein said terminals are attached to said plane array of the second composite structure by soldering at least one tin-lead-silver boss.

10. A component according to claim 9, wherein said terminals are separated from the at least one tin-lead-silver boss by a coating adhering to the at least one tin-lead-silver boss.