Cutting machine
First Claim
1. A cutting machine comprising cassette supporting means, disposed in a cassette bearing area, for supporting a cassette accommodating a plurality of workpieces;
- a chuck table disposed substantially horizontally movably between a chucking area and a cutting area;
cleaning means disposed in a cleaning area;
cutting means for cutting the workpiece chucked on the chuck table located in the cutting area; and
workpiece transport means, wherein;
the cassette bearing area, the chucking area, and the cleaning area are placed in this order on a first straight line, which extends in a predetermined direction, in a plan view, while the chucking area and the cutting area are placed on a second straight line, which extends substantially perpendicularly to the first straight line, in the plan view; and
the workpiece accommodated in the cassette is carried out of the cassette to the chucking area by the workpiece transport means, chucked on the chuck table in the chucking area, conveyed to the cutting area together with the chuck table, cut by the cutting means in the cutting area, then returned to the chucking area together with the chuck table, transported from a site on the chuck table to the cleaning means by the workpiece transport means, cleaned by the cleaning means, then transported from the cleaning means to the chucking area by the workpiece transport means, and carried into the cassette by the workpiece transport means.
1 Assignment
0 Petitions
Accused Products
Abstract
A cutting machine comprising cassette supporting means, disposed in a cassette bearing area, for supporting a cassette accommodating a plurality of workpieces; a chuck table disposed substantially horizontally movably between a chucking area and a cutting area; cleaning means disposed in a cleaning area; cutting means for cutting the workpiece chucked on the chuck table located in the cutting area; and workpiece transport means. The cassette bearing area, the chucking area, and the cleaning area are placed in this order on a first straight line extending in a predetermined direction. The chucking area and the cutting area are placed on a second straight line extending substantially perpendicularly to the first straight line.
38 Citations
7 Claims
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1. A cutting machine comprising cassette supporting means, disposed in a cassette bearing area, for supporting a cassette accommodating a plurality of workpieces;
- a chuck table disposed substantially horizontally movably between a chucking area and a cutting area;
cleaning means disposed in a cleaning area;
cutting means for cutting the workpiece chucked on the chuck table located in the cutting area; and
workpiece transport means, wherein;the cassette bearing area, the chucking area, and the cleaning area are placed in this order on a first straight line, which extends in a predetermined direction, in a plan view, while the chucking area and the cutting area are placed on a second straight line, which extends substantially perpendicularly to the first straight line, in the plan view; and
the workpiece accommodated in the cassette is carried out of the cassette to the chucking area by the workpiece transport means, chucked on the chuck table in the chucking area, conveyed to the cutting area together with the chuck table, cut by the cutting means in the cutting area, then returned to the chucking area together with the chuck table, transported from a site on the chuck table to the cleaning means by the workpiece transport means, cleaned by the cleaning means, then transported from the cleaning means to the chucking area by the workpiece transport means, and carried into the cassette by the workpiece transport means. - View Dependent Claims (2, 3, 4, 5, 6, 7)
temporally supporting means for temporally supporting the workpiece is disposed in the chucking area;
the workpiece to be cut, which has been carried out of the cassette, is initially borne on the temporally supporting means, and then transported from a site on the temporally supporting means onto the chuck table; and
the workpiece which has been cut and cleaned is transported from the cleaning means onto the temporally supporting means, and then carried into the cassette.
- a chuck table disposed substantially horizontally movably between a chucking area and a cutting area;
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3. The cutting machine claimed in claim 2, wherein:
the temporally supporting means is composed of a pair of support members placed above the chuck table located in the chucking area, and the pair of support members are movable between an operating position at which the support members are located with a predetermined spacing from each other and the workpiece is borne by the support members in such a manner as to bridge the spacing between the support members, and a non-operating position at which the support members have been moved from the operating position away from each other and the workpiece is allowed to descend through the spacing between the support members.
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4. The cutting machine claimed in claim 2, wherein:
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the workpiece transport means includes first transport means, second transport means, and third transport means;
the first transport means carries the workpiece to be cut, out of the cassette onto the temporally supporting means, and carries the workpiece, which has been transported onto the temporally supporting means after being cut and cleaned, from a site on the temporally supporting means into the cassette;
the second transport means transports the workpiece to be cut, which has been carried out of the cassette and borne on the temporally supporting means, from a site on the temporally supporting means onto the chuck table, and transports the workpiece, which has been cut and cleaned, from the cleaning means onto the temporally supporting means; and
the third transport means transports the workpiece, which has been returned to the chucking area together with the chuck table after being cut, from a site on the chuck table to the cleaning means.
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5. The cutting machine claimed in claim 1, wherein:
the workpiece comprises a semiconductor wafer, and the cutting means dices the semiconductor wafer.
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6. The cutting machine claimed in claim 5, wherein:
the cutting means has a rotating shaft, and a cutting blade mounted on the rotating shaft; and
the rotating shaft extends parallel to the first straight line.
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7. The cutting machine claimed in claim 5, wherein:
the cutting means includes first cutting means and second cutting means;
each of the first cutting means and the second cutting means has a rotating shaft, and a cutting blade mounted on the rotating shaft;
the rotating shafts are located tandem and extend parallel to the first straight line; and
the cutting blades are mounted on ends of the rotating shafts facing each other.
Specification