Surface-mount type emitting diode and method of manufacturing same

• US 6,345,903 B1
• Filed: 09/01/2000
• Issued: 02/12/2002
• Est. Priority Date: 09/01/2000
• Status: Active Grant

• Current Assignee: Citizen Electronics Company Limited
• Original Assignee: Citizen Electronics Company Limited
• Inventors: Koike, Akira, Murano, Yoshio, Fukasawa, Koichi
• Primary Examiner(s): O'Shea, Sandra
• Assistant Examiner(s): DELGIZZI, RONALD ERNEST
• Application Number:
  US09/654,262
• Time in Patent Office: 529 Days
• Field of Search: 362/249, 362/800, 362/84, 362/255, 362/256, 362/267, 362/293, 362/307, 362/310, 362/311, 362/230, 362/231, 313/512
• US Class Current: 362/241
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

Disclosed herein is a surface-mount type light emitting diode wherein a reflection frame is placed around a light emitting diode element mounted on an upper surface of a glass epoxy substrate, a first resin encapsulator mixed with a wavelength-converting material is charged into the reflection frame to seal the light emitting diode element, a second resin encapsulator and a third resin encapsulator used as a surface layer are stacked on an upper portion of the glass epoxy substrate including the reflection frame in layer form to seal the entirety of the first resin encapsulator, and an ultraviolet absorbent is mixed into at least a third resin encapsulator. A wavelength-converting material such as a luminescent material or the like becomes hard to be affected by externally-incoming ultraviolet radiation or the like, whereby the aging of the wavelength-converting material can be controlled.

Claims

1. A surface-mount type light emitting diode, comprising:

a light emitting diode element placed on an upper surface of a glass epoxy substrate and having electrodes;

a pair of electrodes formed on the glass epoxy substrate; and

a resin encapsulator for sealing an upper portion of the glass epoxy substrate;

said electrodes and said pair of electrodes being connected to one another;

a reflection frame placed around said light emitting diode element;

a first resin encapsulator mixed with a wavelength-converting material, said first resin encapsulator being charged into said reflection frame to seal said light emitting diode element;

a second resin encapsulator;

a third resin encapsulator used as a surface layer; and

an ultraviolet absorbent mixed into at least said third resin encapsulator; and

wherein said second resin encapsulator and said third resin encapsulator are superimposed over the glass epoxy substrate including said reflection frame in layer form to seal the entirety of said first resin encapsulator.

2. A surface-mount type light emitting diode according to claim 1, wherein an upper surface of said first resin encapsulator is placed in a position below an upper edge of said reflection frame.

3. A surface-mount type light emitting diode according to claim 1, wherein the wavelength-converting material mixed into said first resin encapsulator is a luminescent material comprising a fluorescent dye or fluorescent pigment.

4. A surface-mount type light emitting diode according to claim 1, wherein said second resin encapsulator is mixed with a diffusing agent for diffusing wavelength-converted light.

5. A surface-mount type light emitting diode according to claim 1, wherein said third resin encapsulator covers the entirety of said second resin encapsulator and is shaped in the form of a cap whose outer peripheral portion is bonded and fixed to the upper surface of said glass epoxy substrate.

6. A surface-mount type light emitting diode according to claim 1, wherein a condenser lens portion is formed on an upper surface of said third resin encapsulator.

7. A surface-mount type light emitting diode according to claim 1, wherein said light emitting diode element is a blue light emitting element comprised of a gallium-nitride system compound semiconductor or a silicon-carbide system compound semiconductor.

8. A method of manufacturing a surface-mount type light emitting diode, comprising the following steps:

a step for bonding and fixing a reflection-frame assembler to an upper surface of a glass epoxy assembled substrate with a pair of electrodes formed thereon;

a step for placing light emitting diode elements inside reflection frames respectively and connecting electrodes of the light emitting diode elements and respective pairs of electrodes formed on the glass epoxy assembled substrate respectively;

a step for charging a first resin encapsulator mixed with a wavelength-converting material into each of the reflection frames to thereby seal each of the light emitting diode elements;

a step for sealing an upper portion of the glass epoxy assembled substrate including each reflection frame with a second resin encapsulator mixed with a diffusing agent;

a step for sealing an upper surface of the second resin encapsulator with a third resin encapsulator mixed with an ultraviolet absorbent; and

a step for cutting the glass epoxy assembled substrate along cut lines supposed thereon every sizes of substrates constituting light emitting diodes to thereby divide it into each individual light emitting diodes.