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Method and apparatus for electroless plating a contact pad

  • US 6,346,151 B1
  • Filed: 12/16/1999
  • Issued: 02/12/2002
  • Est. Priority Date: 02/24/1999
  • Status: Expired due to Fees
First Claim
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1. A sequential, liquid phase treatment apparatus, comprising:

  • a tank having a lower compartment, an upper first compartment, and an upper second compartment adjacent to and separated from the upper first compartment by a barrier, wherein the lower compartment extends beneath and is open to the upper first compartment and the upper second compartment;

    a cleaning solution held in the upper first compartment;

    a siliconizing solution held in the lower compartment; and

    a plating solution held in the upper second compartment.

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