×

Low temperature material bonding technique

  • US 6,346,305 B1
  • Filed: 06/17/1998
  • Issued: 02/12/2002
  • Est. Priority Date: 05/16/1996
  • Status: Expired due to Fees
First Claim
Patent Images

1. A composite structure comprising:

  • an impermeable first mating piece;

    an impermeable second mating piece;

    a film comprising a material capable of covalently bonding to the first and second mating pieces at temperatures of 90°

    C. or less, having a thickness of at least one molecular layer, and being disposed between the first and second mating pieces; and

    a channel structure defined by and disposed between the first and second mating pieces.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×