EMI/RFI filter including a ferroelectric/ferromagnetic composite

• US 6,346,865 B1
• Filed: 04/29/1999
• Issued: 02/12/2002
• Est. Priority Date: 04/29/1999
• Status: Expired due to Fees

• Current Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Callewaert, Clyde Maynord, Dungan, Dennis Forest, Manning, Edward Patrick, Musick, Steven A, Phillips, William Thomas Jr., Messuri, Dominic Anthony, Mantese, Joseph Vito, Micheli, Adolph Louis, Schubring, Norman William
• Primary Examiner(s): Bettendorf, Justin P.
• Application Number:
  US09/302,104
• Time in Patent Office: 1,020 Days
• Field of Search: 333/181, 333/184, 333/185, 361/270, 336/200
• US Class Current: 333/185
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters

Abstract

An EMI filter (10) that makes use of a ferroelectric-ferromagnetic composite, member, or slab (12) in connection with capacitive and inductive elements. The geometrical structure of the filter (10) is such that the mutually orthogonal electric fields and magnetic fields generated by the capacitive and inductive elements penetrate the volume of the composite (12). In some designs, capacitive plates (14, 18, 32, 34) are split to avoid setting up eddy currents in the plates (14, 18, 32, 34) which oppose the penetration of magnetic flux through the composite (12). Various structural designs can be provided to define the capacitive elements and the inductive elements in different configurations relative to the composite to satisfy the desirable requirements. One particular low-pass design includes providing a slab (12) of the composite with plates (14, 18, 32, 34) on opposite sides of the slab (12) that define capacitors, and a conductive strip (20) wrapped around the slab (12) and electrically connected to the hot capacitive plates (14, 18) that define the inductor. This basic configuration can be extended to a cylinder (52) made of the composite, where a ground plane (56) is provided on one surface (54) of the cylinder (52), and the hot capacitor plates (60, 64) are provided on the other surface (62) of the cylinder (52), where a conductive strip (70) on the other surface (62) defines the coil. A multi-layer filter (76) can be provided that includes layered substrates (78) where metallized vias (80) extending through the substrates (78) define a coil, and ground planes (124) and capacitive plates (112, 114) on alternating substrates (78) define the capacitive elements.

Claims

1. An EMI filter comprising:

a ferroelectric-ferromagnetic composite member exhibiting both capacitive and inductive properties;

a ground plate formed on a first surface of the member;

a capacitor plate pair having a first capacitor plate and a second capacitor plate, the capacitor plate pair formed on a second surface of the member, wherein the combination of the first capacitor plate and the ground plate separated by the member defines a first capacitor and the combination of the second capacitor plate and the ground plate separated by the member defines a second capacitor; and

an inductive coil having at least one metallic winding formed on the member, the coil being in electrical contact with the first capacitor plate and the second capacitor plate, the coil disposed between the first and second capacitors, the area of the coil disposed laterally outward from the ground plate being substantially less than the area of the capacitor plate pair disposed laterally outward from the ground plate.

2. The filter according to claim 1 wherein the first and second capacitors define an electric field and the coil defines a magnetic field, the electric and magnetic fields penetrating the member and disposed orthogonal to each other.

3. The filter according to claim 1 wherein the composite member comprises about 30% to about 70% by volume of a ferroelectric material, and about 30% to about 70% by volume of a ferromagnetic material.

4. The filter according to claim 3 wherein the ferromagnetic material comprises an AB₂O₄ material where A is selected from the group consisting of Cu, Mg, Zn, Ni and Mn, and B includes primarily Fe.

5. The filter according to claim 3 wherein the ferromagnetic material comprises Cu_0.2Mg_0.4Zn_0.5Fe₂O₄.

6. The filter according to claim 3 wherein the member has a closed pore porosity ranging from about 0% to about 10% by volume of the dielectric member.

7. The filter according to claim 6 wherein the member includes a copper-based ferrite.

8. The filter according to claim 3 wherein the member includes grains of a ferroelectric material and grains of a ferromagnetic material which are combined, intermixed and consolidated to form the member such that the ferroelectric and ferromagnetic grains substantially retain their respective discrete electromagnetic properties.

9. The filter according to claim 3 wherein the ferroelectric portion of the member is selected from the group consisting of barium strontium titanate, barium strontium niobate, barium copper tantalate and barium titanate.

10. An EMI filter comprising:

a ferroelectric-ferromagnetic composite member exhibiting both capacitive and inductive properties;

a ground plate pair having a first ground plate and a second ground plate, the ground plate pair formed on a first surface of the member;

a capacitor plate pair having a first capacitor plate and a second capacitor plate, the capacitor plate pair formed on a second surface of the member, wherein the combination of the first capacitor plate and the first ground plate separated by the member defines a first capacitor and the combination of the second capacitor plate and the second ground plate separated by the member defines a second capacitor;

an inductive coil having at least one metallic winding formed on the member, the coil being in electrical contact with the first capacitor plate and the second capacitor plate, the coil disposed between the first and second capacitors; and

wherein the member is a slab, the first surface is a bottom surface, the second surface is a top surface, and wherein the coil is wrapped around the slab and extends between the first and second ground plates upon the bottom surface flush with the first and second ground plates.

11. An EMI filter comprising:

a ferroelectric-ferromagnetic composite member exhibiting both capacitive and inductive properties;

a ground plate formed on a first surface of the member;

a capacitor plate pair having a first capacitor plate and a second capacitor plate, the capacitor plate pair formed on a second surface of the member, wherein the combination of the first capacitor plate and the ground plate separated by the member defines a first capacitor and the combination of the second capacitor plate and the ground plate separated by the member defines a second capacitor;

an inductive coil having at least one metallic winding formed on the member, the coil being in electrical contact with the first capacitor plate and the second capacitor plate, the coil disposed between the first and second capacitor plates; and

;

wherein the member is a hollow tube, the first surface is an inner surface of the tube, the second surface is an outer surface of the tube, the ground plate is a cylindrical ground plate, the first and second capacitor plates are formed on opposite ends of the outer surface of the tube, and wherein said coil is wrapped around a center portion of the outer surface of the tube between the first and second capacitor plates.

12. An EMI filter comprising:

a ferroelectric-ferromagnetic member that includes a composite material exhibiting both capacitive and inductive properties, said member including a first surface and an opposing second surface;

at least one metallic ground plate formed on the first surface of the member;

a first capacitor plate and a second capacitor plate formed on the second surface of the member, wherein the combination of the first capacitor plate and the ground plate defines a first capacitor and the combination of the second capacitor plate and the ground plate defines a second capacitor;

a metallic strip formed on the member and being an inductive coil, said strip being electrically connected to both the first capacitor plate and the second capacitor plate; and

wherein the member is a composite slab and the at least one ground plate is a first ground plate and a second ground plate formed on the first surface of the slab and the first and second capacitor plates are formed on the second surface of the slab, and wherein the strip is wrapped around the slab and extends between and is flush with the first and second ground plates.

13. A method of providing EMI filtering, said method comprising the steps of:

providing a ferroelectric-ferromagnetic member that is a composite material exhibiting both capacitive and inductive properties wherein the member is a slab;

forming at least one metallic ground plate on the slab, wherein the at least one ground plate is a first ground plate and a second ground plate formed on one surface of the slab;

forming a plurality of capacitor plates on the slab in a manner so that each one of the plurality of capacitor plates and one of the at least one ground plate defines a respective capacitor of a plurality of capacitors, and wherein the step of forming a plurality of capacitor plates includes forming a first and a second capacitor plate on an opposite surface of the slab so that the strip is wrapped around the slab and extends flush between the first and second ground plates; and

forming at least one metallic strip on the slab to provide an inductive coil where the metallic strip is in electrical contact with the plurality of capacitor plates.

14. An EMI filter comprising:

a bottom substrate;

a top substrate disposed above the bottom substrate;

at least one capacitor substrate disposed between the top and bottom substrates;

at least one ground substrate stacked alternately with the at least one capacitor substrates and between the top and bottom substrates, the top substrate, the bottom substrate, the at least one capacitor substrate and the at least one ground substrate are made of a ferroelectric-ferromagnetic composite exhibiting both capacitive and inductive properties;

a metallic ground plate formed on an upper surface of each respective one of the at least one ground substrates;

a first capacitor plate formed on an upper surface of each respective one of the at least one capacitor substrates;

a second capacitor plate formed on the upper surface of each respective one of the at least one capacitor substrates, the first capacitor plate isolated electrically from the second capacitor plate;

a coil having at least one metallic winding, each winding having a slanted top metallic strip disposed on an upper surface of the top substrate, a counter-slanted bottom metallic strip disposed on an upper surface of the bottom substrate and a plurality of front and back-edge coil vias aligned vertically and laterally penetrating the top substrate, the at least one capacitor substrates and the at least one ground substrates to interconnect the respective front and back ends of the top strips to the front and back ends of the bottom strips, the coil being in electrical contact with one of the first capacitor plates and one of the second capacitor plates and the coil being isolated electrically from the ground plates; and

wherein each of the at least one ground substrates and each of the at least one capacitor substrates have a first and a second capacitor plate tab and via, the tab projecting from and co-planar to the respective capacitor plate, the first capacitor plate vias interconnected electrically and laterally to distal ends of the first capacitor plate tabs, the second capacitor plate vias interconnected electrically and laterally to distal ends of the second capacitor plate tabs.

15. The filter according to claim 14 wherein the first capacitor plates are aligned vertically to one another and the second capacitor plates are aligned vertically to one another.

16. The filter according to claim 15 wherein the first capacitor plate vias are vertically aligned to one another and the second capacitor plate vias are vertically aligned to one another.

17. The filter according to claim 16 wherein the first and second capacitor plate vias are disposed at opposite corners of both the at least one capacitor substrate and the at least one ground substrate.

18. The filter according to claim 17 wherein each ground plate has a ground tab projecting from and co-planar to the ground plate, and wherein each of the at least one ground substrates and each of the at least one capacitor substrates have at least one ground plate via electrically interconnecting the distal ends of the ground tabs of the ground plates.

19. The filter according to claim 18 wherein the at least one ground plate vias are aligned vertically to one another.

20. The filter according to claim 19 wherein the ground plates are aligned vertically to one another.

21. The filter according to claim 20 wherein the at least one ground plate vias are two ground plate vias disposed at opposite corners of the at least one ground substrate and the at least one capacitor substrate not containing the first and second capacitor plate vias.

22. A multi-layered EMI filter comprising a plurality of magnetic-dielectric substrates including a top substrate, a bottom substrate, a plurality of capacitor substrates, and a plurality of ground substrates, the capacitor and ground substrates disposed alternately between the top and bottom substrates, each of the plurality of substrates includes a plurality of metallic vias having a plurality of back and a plurality of front edge vias and the top substrate and the bottom substrate include metallic strip portions that interconnect each respective one of the plurality of back and front edge vias to define an inductive coil, and each one of the plurality of capacitor substrates include at least one capacitor plate and each one of the plurality of ground substrates includes a ground plate, wherein each one of the at least one capacitor plate of each one of the plurality of capacitor substrates are each connected to the coil by a plurality of common vias of the plurality of vias and each of the plurality of ground plates are electrically isolated from the coil;

the ground plate from each one of the plurality of ground substrates having a tab projecting from and co-planar to the ground plate, the ground plates being stackably engaged electrically by a plurality of common vias of the plurality of vias projecting laterally from either side of a distal end of the ground tabs; and

each one of the at least one capacitor plates having a tab projecting from and co-planar to the respective capacitor plate, the plurality of capacitor plates being stackably engaged electrically by a plurality of common vias projecting laterally from either side of a distal end of the capacitor tabs.

23. The filter according to claim 22 wherein the at least one capacitor plate from each one of the plurality of capacitor substrates includes a first capacitor plate interconnected by a plurality of common metallic vias through each one of the plurality of substrates and a second capacitor plate interconnected by another plurality of common vias through each one of the plurality of substrates.

24. The filter according to claim 22 wherein the at least one capacitor plate and the coil define an electric field and a magnetic field, respectively, that are orthogonal to each other and penetrate the substrates.

25. The filter according to claim 22 wherein the at least one capacitor plate from each one of the plurality of capacitor substrates includes a first and second capacitor plate connected to varying metallic vias to define a distributed filter system.

26. The filter according to claim 25 wherein the plurality of vias are formed through the plurality of substrates along opposite edges of the plurality of substrates.

27. The filter according to claim 26 wherein a first and a second diagonally opposing corner capacitor plate vias are electrically connected to the respective first and second capacitor plates and the coil, and another set of diagonally opposing corner ground plate vias are connected to the ground plates.