Patch antenna with embedded impedance transformer and methods for making same
First Claim
1. A method for constructing an antenna, comprising the following steps:
- (a) fabricating a patch element onto a first substrate surface;
(b) fabricating a ground plane onto a second substrate surface;
(c) embedding an impedance transformer between abutting substrate layers between the patch element and the ground plane;
(d) connecting a first end of the impedance transformer to a feed point on the patch element; and
(e) connecting the outer conductor of a coaxial feed to the ground plane and the inner conductor of the coaxial feed to a second end of the impedance transformer.
9 Assignments
0 Petitions
Accused Products
Abstract
An antenna is described that comprises an antenna having a patch element fabricated onto a substrate, a ground plane, and an impedance transformer between the patch element and the ground plane. The patch element electrically connected to a first end of the impedance transformer, and a feed line is electrically connected to a second end of the impedance transformer through the ground plane. The use of the impedance transformer allows impedance matching to be accomplished without being limited by the physical limitations of the patch element. According to a further aspect of the invention, a patch element is fabricated onto a first substrate surface and a ground plane is fabricated onto a second substrate surface, the ground plane separated from the patch element by a plurality of substrate layers. An impedance transformer is embedded between abutting substrate layers between the patch element and the ground plane, and an electrically conductive via connects a first end of the impedance transformer to a feed point on the patch element. The antenna further includes a coaxial feed having an outer conductor electrically connected to the ground plane and an inner conductor electrically connected to a second end of the impedance transformer, such that a signal is carried between the coaxial feed and the patch element through the impedance transformer.
36 Citations
8 Claims
-
1. A method for constructing an antenna, comprising the following steps:
-
(a) fabricating a patch element onto a first substrate surface;
(b) fabricating a ground plane onto a second substrate surface;
(c) embedding an impedance transformer between abutting substrate layers between the patch element and the ground plane;
(d) connecting a first end of the impedance transformer to a feed point on the patch element; and
(e) connecting the outer conductor of a coaxial feed to the ground plane and the inner conductor of the coaxial feed to a second end of the impedance transformer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
(f) using the impedance transformer to match the impedance between the via and the coaxial feed.
-
-
3. The method of claim 1, wherein step (d) includes:
using a via to connect a first end of the impedance transformer to a feed point on the patch element, the via extending through the substrate.
-
4. The method of claim 1, wherein step (e) includes mounting the coaxial feed perpendicular to the ground plane.
-
5. The method of claim 4, wherein step (e) includes centering the coaxial feel underneath the patch element.
-
6. The method of claim 1 wherein:
-
step (a) includes fabricating the patch element onto an upper surface of the first substrate;
step (b) includes fabricating the ground plane onto the lower surface of a second substrate;
step (c) includes embedding the impedance transformer between a lower surface of the first substrate and an upper surface of a second substrate; and
step (d) includes using a via to electrically connect one end of the impedance transformer with a feed point on the patch element, the via extending through the first substrate.
-
-
7. The method of claim 1, wherein step (a) includes:
fabricating a patch element onto a first substrate surface, the substrate including first and second layers.
-
8. The method of claim 7, wherein step (c) includes:
-
fabricating an upper portion of the impedance transformer onto a lower surface of the second layer of the first substrate; and
fabricating a lower portion of the impedance transformer onto the upper surface of the second substrate.
-
Specification