Controlled bondline thickness attachment mechanism

• US 6,349,465 B1
• Filed: 06/12/1998
• Issued: 02/26/2002
• Est. Priority Date: 03/28/1996
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Brownell, Michael, Turturro, Gregory, McCutchan, Dan
• Primary Examiner(s): Martin-Wallace, Valencia
• Assistant Examiner(s): NGUYEN, BINH AN DUC
• Application Number:
  US09/096,706
• Time in Patent Office: 1,355 Days
• Field of Search: 297/40, 297/41, 297/60, 298/40, 298/41, 174/16.3, 174/52.2, 165/80.3, 165/80.4, 269/903, 257/713, 257/719, 257/722, 361/699, 361/705, 361/707, 361/709, 361/715, 361/764, 361/720
• US Class Current: 29/740
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: Y10S 269/903 Work holder for electrical circuit assemblages or wiring systems
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53183 Multilead component
• CPC Class Codes: Y10T 29/53265 with work-holder for assembly

Abstract

A tool which accurately controls the thickness of a thermal grease applied to an integrated circuit that is mounted to a printed circuit board. The tool includes a bracket that supports the printed circuit board and the integrated circuit. A thermal grease is applied to the top surface of the integrated circuit. A lid is attached to the bracket to capture the printed circuit board. The lid has a platen that is separated from the integrated circuit by a space which has a predetermined thickness. The space defines the thickness of the thermal grease. Any excess thermal grease is pushed out of the space by the lid so that a consistent thickness of thermal grease is applied for each integrated circuit assembly. The bracket, lid, integrated circuit and printed circuit board can be mounted to a motherboard as a single integrated circuit module. Alternatively, the lid can be detached from the base so that the grease covered integrated circuit can be removed from the tool for subsequently assembly.

Claims

1. A tool for applying a thermal grease to an integrated circuit that is mounted to a top surface of a printed circuit board, comprising:

a bracket that supports the printed circuit board and the integrated circuit, said integrated circuit having a first height from said top surface of said printed circuit board; and

,

a lid that is attached to said bracket, said lid having a platen area and a lip area, said lip area contacting said top surface of said printed circuit board, said platen area having a second height from said lip area contacting said top surface of said printed circuit board, said first height of said integrated circuit and said second height of said platen area defining a space between said integrated circuit and said platen area.

2. The tool as recited in claim 1, wherein said lid has a key that cooperates with a ridge of said bracket to limit a movement of the printed circuit board in a plane that is essentially parallel with a top surface of the integrated circuit.

3. The tool as recited in claim 2, wherein said lid has a lip that captures the printed circuit board.

4. The tool as recited in claim 3, further comprising a base and a brace that support said bracket.

5. The tool as recited in claim 4, wherein said lid, said bracket, said base and said brace are coupled together by a plurality of fasteners.

6. The tool as recited in claim 5, wherein said lid has a recess between said lip and said platen area.

7. A method for applying a thermal grease to an integrated circuit that is mounted to a top surface of a printed circuit board, comprising the steps of:

a) placing the printed circuit board and integrated circuit on a bracket, said integrated circuit having a first height from said top surface of said printed circuit board;

b) applying a thermal grease to the integrated circuit; and

,

c) attaching a lid to said bracket, said lid having a platen area and a lip area, said lip area contacting said top surface of said printed circuit board, said platen area having a second height from said lip area contacting said top surface of said printed circuit board, said first height and said second height defining a space between said integrated circuit and said platen area.

8. An integrated circuit module, comprising:

a bracket;

a printed circuit board supported by said bracket, said printed circuit board having a top surface;

an integrated circuit that is mounted to said printed circuit board, said integrated circuit having a first height from said top surface of said printed circuit board;

a lid that is attached to said bracket, said lid having a platen area and a lip area, said lip area contacting said top surface of said printed circuit board, said platen area having a second height from said lip area contacting said top surface of said printed circuit board, said first height and said second height defining a space between said integrated circuit and said platen area; and

,

a thermal grease located within said space between said platen area and said integrated circuit.

9. The module as recited in claim 8, wherein said lid has a key that cooperates with a ridge of said bracket to limit a movement of said printed circuit board in a plane that is essentially parallel with a top surface of said integrated circuit.

10. The module as recited in claim 9, wherein said lid has a lip that captures said printed circuit board.

11. The module as recited in claim 10, wherein said bracket has a recess.

12. The module as recited in claim 11, wherein said lid and said bracket are coupled together by a plurality of fasteners.

13. The module as recited in claim 12, wherein said lid has a recess between said lip and said platen.