Automated packaging

• US 6,349,526 B1
• Filed: 07/07/1999
• Issued: 02/26/2002
• Est. Priority Date: 09/12/1997
• Status: Expired due to Fees

• Current Assignee: Paul Bernard Newman
• Original Assignee: Paul Bernard Newman
• Inventors: Newman, Paul Bernard
• Primary Examiner(s): Hughes, S. Thomas
• Assistant Examiner(s): COMPTON, ERIC B
• Application Number:
  US09/297,923
• Time in Patent Office: 965 Days
• Field of Search: 531/42, 531/43, 535/44, 534/46, 53/54, 534/98, 535/01, 534/25, 535/00, 535/02, 535/04
• US Class Current: 53/446
• CPC Class Codes: B07C 5/10 measured by light-responsive means sorting according to colour B07C5/342
• CPC Class Codes: B07C 5/342 according to optical properties, e.g. colour according to radiation transmittivity B07C5/3416
• CPC Class Codes: B65B 25/06 Packaging slices or specially-shaped pieces of meat, cheese, or other plastic or tacky products
• CPC Class Codes: B65B 35/58 Turning articles by positively-acting means, e.g. to present labelled portions in uppermost position
• CPC Class Codes: B65B 57/12 and operating to control, or stop, the feed of wrapping materials, containers, or packages

Abstract

As a substrate (10) is carried on a conveyor (20), an image analysis system (40) detects its presence and derives the various data, at least indicative of the footprint. The footprint data are used in selecting appropriate packaging components. Data may also indicate the transverse location and/or orientation and/or alignment of a substrate, and be used to control position adjustors for adjusting one or more of these. Data may also serve for categorizing the substrate, e.g., in terms of size or color. Such data may be used to control rejection of products, or categorization, e.g., by selection of distinguishable packaging.

Claims

1. A method of packaging a substrate comprising (i) conveying the substrate on a conveyor into the field of view of an image analysis system and obtaining an image of the substrate on the conveyor from said system, (ii) comparing the image of the substrate against standard images held in a database, and thereby identifying the substrate and optionally its orientation, (iii) analysing the substrate image and, with reference to the database if necessary, determining the footprint dimensions of the substrate, (iv) selecting a package or a first package component of dimensions based on the footprint dimensions of the substrate, (v) transferring the substrate to the package or component, (vi) providing further components of the package if necessary, and integrating said further components with the package or the first component, and (vii) sealing the package or the first component.

2. A method according to claim 1 including the step of analysing the image of the identified substrate on the conveyor to determine the location of the substrate transverse to the conveying direction.

3. A method according to claim 1 including a step of analysing the substrate image to determine the alignment of the substrate relative to the conveying direction.

4. A method according to claim 1 including a step of analysing the substrate image to obtain information about the position and/or conformation of the substrate on the conveyor, and a step of altering the position and/or conformation dependent on said information.

5. A method according to claim 1 which is conducted substantially within a cavity delimited by walls and provided with a plurality of UV sources distributed around the walls and directed radially, inwardly such that UV radiation from the UV sources maintains substantially aseptic conditions within the cavity throughout the process.

6. A method according to claim 1 which further comprises obtaining the weight of the substrate, and wherein said selecting step (iv) is also carried out dependent on said weight.

7. A method according to claim 1 wherein said database also contains details of customer specifications and said selecting step (iv) is also carried out dependent on a comparison of said specifications with data determined for the substrate.

8. A method according to claim 1 including a step of analysing the substrate image to obtain data relating to substrate colour.

9. A packaging line which comprises:

conveying means;

an image analysis system suitable for obtaining images of substrates while they are being conveyed on the conveying means;

means for comparing said images against standard images held in a database and on the basis of this comparison (i) recognizing each substrate, (ii) estimating the footprint of each substrate, and optionally (iii) determining the orientation of said substrate;

a placement module;

a controller or coordinator, able to direct the action of a placement module to select a first package component or a package of dimensions based on said footprint and arrange for the selected component or package to receive the substrate on transfer to the placement module and a final package assembler.

10. A packaging line according to claim 9 which is contained substantially within a cavity delimited by walls, said cavity being provided with a plurality of UV sources distributed around the walls and directed radially inwardly.

11. A packaging line according to claim 9 wherein the image analysis system is arranged to determine the location of a substrate transverse to the conveying direction.

12. A packaging line according to claim 9 wherein the image analysis system is arranged to determine the alignment of the substrate relative to the conveying direction.

13. A packaging line according to claim 9 wherein the final package assembler is provided with means for dispensing a modified atmosphere during at least part of the assembly of the final package before sealing the final package.

14. A packaging line according to claim 9 which is equipped with reject mechanisms which are arranged to be triggered by the image analysis system if it does not recognise the object or recognises the object but it is outside a pre-set quality or dimensional criterion.

15. A packaging line according to claim 9 further provided with means for positional adjustment of a recognized substrate.

16. A packaging line according to claim 15 wherein said means for positional adjustment is under the control of the image analysis system, either directly or indirectly via a separate microprocessor controller or programmable logic controller.

17. A packaging line according to claim 15 wherein the conveying means has a conveying surface and said means for positional adjustment comprise a plurality of retractable arms provided with blades, said blades being arranged such that the lowermost surface of each blade is close to, but does not touch, the conveying surface.

18. A packaging line according to claim 15 having positional adjusters sited on either side of the conveying means so as to be able to act cooperatively in effecting positional adjustment.

19. A packaging line according to claim 9 wherein said conveying means comprises variable speed multi-section conveyors operable to effect alignment of the substrates.

20. A packaging line according to claim 9 for packaging poultry drumsticks, wherein the conveying means, comprises a chute and a primary conveyor, said chute comprising a conically shaped entry head leading to a tubular section with walls which gradually taper to a chute exit;

and wherein said image analysis system is positioned so as to obtain an image of a poultry drumstick while the drumstick is on the primary conveyor.

21. A packaging line according to any of claims 9 to 20 including means for weighing substrates.

22. A method of packaging a substrate, said method comprising:

conveying the substrate to be packaged on a conveyor into a field of view of an image analysis system;

using the image analysis system to obtain an image of the substrate on the conveyor;

comparing the image of the substrate so obtained with standard images maintained in a database so as to identify the substrate;

analyzing the substrate image to determine footprint dimensions of the substrate;

selecting a package of dimensions based on the footprint dimensions so determined;

transferring the substrate to the package so selected for packaging therein; and

sealing the package with the substrate packaged therein.

23. A method according to claim 22 wherein the package comprises package components, wherein the substrate is transferred to a first package component and wherein at least one further package component is integrated with the first package prior to sealing the package.