Thermosettable adhesive
First Claim
1. Thermosettable adhesive comprising a thermosettable polymer component, a thermoformable polymer component, an effective amount of heat-activatable or photoactivatable curing system or combinations thereof for curing the thermosettable polymer component, and from 0.5-20 wt. % of one or more compounds selected from hydroxides of Al, Mg and Zr;
- hydroxyoxides of Al, Mg and Zr;
or combinations thereof, wherein all weight percentages are based on a total weight of the thermosettable adhesive.
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Abstract
The invention relates to a thermosettable adhesive comprising a thermosettable polymer component, a thermoformable polymer component, an effective amount of a heat-activatable and/or photoactivatable curing system for curing the thermosettable polymer component, and from 0.5-20 wt. % with respect to the mass of the thermosettable adhesive of one or more hydroxides and/or hydroxyoxides of Al, Mg and/or Zr.
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Citations
20 Claims
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1. Thermosettable adhesive comprising a thermosettable polymer component, a thermoformable polymer component, an effective amount of heat-activatable or photoactivatable curing system or combinations thereof for curing the thermosettable polymer component, and from 0.5-20 wt. % of one or more compounds selected from hydroxides of Al, Mg and Zr;
- hydroxyoxides of Al, Mg and Zr;
or combinations thereof, wherein all weight percentages are based on a total weight of the thermosettable adhesive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 11, 12, 13, 14)
- hydroxyoxides of Al, Mg and Zr;
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10. A thermosettable adhesive comprising:
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(i) a thermosettable polymer selected from the group consisting of epoxy resins, epoxy monomers, and epoxy oligomers;
(ii) a thermoformable polymer selected from polyacrylate homopolymers and copolymers;
(iii) an effective amount of a curing agent for the thermosettable polymer; and
(iv) 0.1 to 20 weight percent of one or more compounds selected from the group consisting of aluminum hydroxides and aluminum hydroxyoxides, based on a total weight of the thermosettable adhesive. - View Dependent Claims (15, 16)
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17. A thermosettable adhesive comprising a reaction product formed by photopolymerization of an adhesive precursor comprising:
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(i) from about 25 to 60 wt. % of a photopolymerizable, optionally partly prepolymerized mixture comprising at least one acrylic acid ester of a non-tertiary alcohol, and at least one reinforcing, copolymerizable monomer;
(ii) from about 8 to 60 wt. % of one or more first compounds selected from epoxy monomers, epoxy oligomers, epoxy resins, or combinations thereof, wherein the one or more first compounds contain no photopolymerizable groups;
(iii) from 0 to 15 wt. % of one or more additional thermoformable polymers selected from polyvinylacetate, poly(ethylene vinyl acetate), polyacetals, polyesters, poly(caprolactones), or combinations thereof;
(iv) from about 0.1 to 10 wt. % of a heat-activatable curing system for the epoxy component (ii);
(v) from about 0.005 to 3 wt. % of a photoinitiator for the acrylate components (i); and
(vi) from about 0.1 to 20 wt. % of one or more second compounds selected from hydroxides of Al;
hydroxyoxides of Al;
or combinations thereof;
wherein all weight percentages are based on the total weight of the thermosettable adhesive. - View Dependent Claims (18, 19, 20)
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Specification