Semiconductor wafer test and burn-in
First Claim
1. A method for testing or burning-in a plurality of integrated circuit product chips having signal I/O, ground, and power pads, the method comprising the steps of:
- a) contacting pads of said plurality of product chips with a test head, wherein said test head comprises a functional test chip;
b) applying power from a power plane in the test head to a first surface of said functional test chip;
c) distributing power from a second surface of said functional test chip to power pads of the product chips; and
d) testing or burning-in the plurality of product chips through said test head.
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Accused Products
Abstract
An apparatus and a method for simultaneously testing or burning in all the integrated circuit chips on a product wafer. The apparatus comprises a glass ceramic carrier having test chips and means for connection to pads of a large number of chips on a product wafer. Voltage regulators on the test chips provide an interface between a power supply and power pads on the product chips, at least one voltage regulator for each product chip. The voltage regulators provide a specified Vdd voltage to the product chips, whereby the Vdd voltage is substantially independent of current drawn by the product chips. The voltage regulators or other electronic means limit current to any product chip if it has a short. The voltage regulator circuit may be gated and variable and it may have sensor lines extending to the product chip. The test chips can also provide test functions such as test patterns and registers for storing test results.
137 Citations
24 Claims
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1. A method for testing or burning-in a plurality of integrated circuit product chips having signal I/O, ground, and power pads, the method comprising the steps of:
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a) contacting pads of said plurality of product chips with a test head, wherein said test head comprises a functional test chip;
b) applying power from a power plane in the test head to a first surface of said functional test chip;
c) distributing power from a second surface of said functional test chip to power pads of the product chips; and
d) testing or burning-in the plurality of product chips through said test head. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method for testing or burning-in a plurality of integrated circuit product chips having signal I/O, ground, and power pads, the method comprising the steps of:
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a) contacting pads of said plurality of product chips with a test head, wherein said test head comprises a functional test chip;
b) applying power from a power supply to a surface of said functional test chip;
c) distributing power from said surface through said functional test chip to power pads of the product chips; and
d) testing or burning-in the plurality of product chips through said test head.
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Specification