Method and apparatus for wireless transfer of chemical-mechanical planarization measurements

• US 6,352,466 B1
• Filed: 08/31/1998
• Issued: 03/05/2002
• Est. Priority Date: 08/31/1998
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Moore, Scott E.
• Primary Examiner(s): Banks, Derris H.
• Assistant Examiner(s): NGUYEN, GEORGE BINH MINH
• Application Number:
  US09/144,756
• Time in Patent Office: 1,282 Days
• Field of Search: 451/5, 451/6, 451/41, 451/285-289, 451/9, 451/10, 451/11, 438/692, 438/693
• US Class Current: 451/5
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 49/00 Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the planarizing machine. The apparatus further comprises a display spaced apart from the sensor and a wireless communication link coupled between the sensor and the display to transmit a signal from the sensor to the display. The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor may also detect light reflected from a reflective surface of a substrate that is used to calibrate the planarizing machine.

Claims

1. An apparatus for transmitting signals from a planarizing device, the planarizing device having a support structure, a platen assembly connected to the support structure, and a carrier supported over the platen assembly and coupled to the support structure, the carrier being movable relative to the platen assembly and the support structure to remove material from a semiconductor substrate positioned between the carrier and the platen assembly, the apparatus comprising:

a force sensor connected to the carrier, the carrier being further comprised of a mounting member removably coupled to the support structure, and an engaging member to engage the semiconductor substrate, the force sensor being connected between the mounting member and the engaging member to generate a signal corresponding to a force transmitted therebetween;

an electronic device spaced apart from the sensor; and

a wireless communication link coupled between the sensor and the electronic device to transmit the signal from the sensor to the electronic device.

2. The apparatus of claim 1 wherein the electronic device includes a display.

3. The apparatus of claim 1 wherein the electronic device includes a feedback device to change the value of the force.

4. The apparatus of claim 1 wherein the force sensor includes a steady state force sensor.

5. The apparatus of claim 1 wherein the force sensor is configured to measure a varying force.

6. The apparatus of claim 2 wherein the display is generally fixed relative to the support.

7. The apparatus of claim 1 wherein the wireless communication link includes at least one optical transmitting transducer attached to the carrier, the wireless communication link further including an optical receiving transducer spaced apart from the optical transmitting transducer, the at least one optical transmitting transducer moving relative to the optical receiving transducer while the semiconductor substrate is planarized.

8. The apparatus of claim 1 wherein the wireless communication link includes a transmitting transducer attached to the carrier, the communication link further including a receiving transducer spaced apart from the transmitting transducer, the transmitting transducer being movable relative to the receiving transducer while the semiconductor substrate is planarized, further comprising a force controller coupled to the planarizing device to change the value of the force when the value differs from a selected value.

9. The apparatus of claim 1, further comprising a power supply attached to the carrier and coupled to the force sensor to supply power thereto.

10. The apparatus of claim 1 wherein the wireless communication link includes a plurality of transmitting transducers connected to the sensor and at least one receiver spaced apart from the transmitting transducers, the transmitting transducers moving relative to the at least one receiver when the semiconductor substrate is planarized.

11. The apparatus of claim 1 wherein the signal is an analog signal and the wireless communication link includes an analog transmitting transducer and an analog receiving transducer spaced apart from the analog transmitting transducer.

12. The apparatus of claim 1 wherein the signal is a digital signal and the wireless communication link includes a digital transmitting transducer and a digital receiving transducer spaced apart from the digital transmitting transducer.

13. The apparatus of claim 1, further comprising a memory device coupled to the force sensor to receive the sensor signal and store the sensor signal for a selected period of time.

14. An apparatus for transmitting wireless signals from a planarizing device, the planarizing device having a support, a platen, and a carrier supported over the platen assembly and coupled to the support structure, the carrier being movable relative to the support and the platen to planarize a semiconductor substrate engaged by the carrier as the carrier moves relative to the platen, the apparatus comprising:

a force sensor coupled to the carrier, the carrier being further comprised of a mounting member removably coupled to the support structure, and an engaging member to engage the semiconductor substrate, the force sensor being connected between the mounting member and the engaging member to generate a signal corresponding to a force transmitted therebetween;

a transmitter coupled to the sensor to receive the sensor signal and transmit a wireless transmitter signal corresponding to the sensor signal; and

a receiver spaced apart from the transmitter to receive the wireless transmitter signal, the receiver being generally fixed relative to the support.

15. The apparatus of claim 14 wherein the transmitter includes a frequency modulating transducer for transmitting the wireless transmitter signal.

16. The apparatus of claim 14 wherein the transmitter includes an amplitude modulating transducer for transmitting the wireless transmitter signal.

17. The apparatus of claim 14 wherein the transmitter includes an optical transmitting transducer and the receiver includes an optical receiving transducer.

18. The apparatus of claim 14, further comprising a memory device coupled to the sensor to receive the sensor signal and store the sensor signal for a selected period of time.

19. The apparatus of claim 18, further comprising:

an output device; and

a communication link operatively coupled between the memory device and the output device to transfer the signal from the memory device to the output device.

20. The apparatus of claim 19 wherein the communication link comprises a cable coupled between the memory device and the output device.

21. The apparatus of claim 19 wherein the output device is selected from a display, a chart recorder and a printer.

22. The apparatus of claim 19 wherein the communication link includes a transmitter and a receiver spaced apart from the transmitter, the transmitter moving relative to the receiver to transfer a wireless signal from the memory device to the output device while the semiconductor substrate is planarized.

23. The apparatus of claim 22 wherein the transmitter includes an optical transmitting transducer and the receiver includes an optical receiving transducer.

24. An apparatus for transmitting signals from a planarizing device, the planarizing device having a support structure, a platen assembly connected to the support structure, and a carrier having a mounting member removably coupled to the support structure and an engaging member to engage a semiconductor substrate, the carrier being coupled to the support structure and supported over the platen assembly to move relative to the platen assembly and the support structure to remove material from the semiconductor substrate positioned between the carrier and the platen assembly, the apparatus comprising:

a force sensor connected between the mounting member and the engaging member to generate a signal corresponding to the force transmitted therebetween;

an electronic device spaced apart from the sensor; and

a wireless communication link coupled between the sensor and the electronic device to transmit the signal from the sensor to the electronic device.

25. The apparatus of claim 24 wherein the electronic device includes a display.

26. The apparatus of claim 24 wherein the electronic device includes a feedback device to change the value of the force when the value differs from a selected value.

27. The apparatus of claim 24 wherein the force sensor includes a steady state force sensor.

28. The apparatus of claim 24 wherein the force sensor is configured to measure a varying force.