Wireless article including a plural-turn loop antenna

• US 6,353,420 B1
• Filed: 10/04/1999
• Issued: 03/05/2002
• Est. Priority Date: 04/28/1999
• Status: Expired due to Fees

• Current Assignee: Avante International Technology
• Original Assignee: Amerasia International Technology, Inc.
• Inventors: Chung, Kevin Kwong-Tai
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): Dinh, Trinh Vo
• Application Number:
  US09/411,849
• Time in Patent Office: 883 Days
• Field of Search: 343/895, 343/700.MS, 343/873, 235/488, 235/441, 235/492, 340/572.1, 361/737, 257/679, 257/777, 257/778
• US Class Current: 343/895
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2429/00 Carriers for sound or information
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 3/08 characterised by added members at particular parts layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18
• CPC Class Codes: B32B 33/00 Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
• CPC Class Codes: B32B 37/203 One or more of the layers being plastic
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/0652 : Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06527 : Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06579 : TAB carriers; beam leads
• CPC Class Codes: H01L 2225/06582 : Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06586 : Housing with external bump or bump-like connectors
• CPC Class Codes: H01L 23/055 : the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/4985 : Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5387 : Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01021 : Scandium [Sc]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01055 : Cesium [Cs]
• CPC Class Codes: H01L 2924/01056 : Barium [Ba]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/36 : Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 7/005 : with variable reactance for tuning the antenna
• CPC Class Codes: H05K 1/0393 : Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/113 : Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/165 : incorporating printed inductors
• CPC Class Codes: H05K 2201/0355 : Metal foils
• CPC Class Codes: H05K 2201/0394 : Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2203/1453 : Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• CPC Class Codes: H05K 3/12 : using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
• CPC Class Codes: H05K 3/4069 : for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/423 : characterised by electroplating method

Abstract

A wireless article, such as an identification tag of badge, containing an electronic device includes on a substrate thereof a plural-turn loop antenna for receiving and/or transmitting radio frequency signals. Because the spacing of the loop antenna terminals is greater than the spacing of the contacts to which they are to connect on the electronic device, the electronic device cannot be attached to the same side of the wireless article as is the loop antenna. Electrically conductive material disposed in holes through the substrate of the wireless article connect the antenna terminals to the electronic device contacts.

Claims

1. An article comprising:

a substrate having two spaced apart holes therethrough;

an elongated electrical conductor on one surface of said substrate and having two contacts at the two spaced apart holes of said substrate;

a pattern of electrically-conductive adhesive on a second surface of said substrate and extending into the two spaced apart holes, said electrically-conductive adhesive being electrically connected to the two contacts of said elongated electrical conductor through the two spaced apart holes in said substrate and having at least one contact; and

an electronic device attached to said substrate and having at least one contact electrically connected to the contact of said pattern of electrically-conductive adhesive.

2. The article of claim 1 wherein said elongated electrical conductor includes at least one of a deposited electrically-conductive adhesive and a metal foil.

3. The article of claim 2 wherein said metal foil is laminated to the one surface of said substrate and is patterned to define said elongated electrical conductor.

4. The article of claim 2 wherein metal is built up on said metal foil within the two spaced apart holes through said substrate.

5. The article of claim 4 wherein said built-up metal is coated with an oxidation-resistant metal.

6. The article of claim 2 wherein said elongated electrical conductor includes a spiral conductor having at least one turn.

7. The article of claim 1 wherein said pattern of electrically-conductive adhesive substantially fills the two spaced apart holes of said substrate to provide electrical connection to said elongated electrical conductor.

8. The article of claim 1 further including metal built up in the two spaced apart holes on the two contacts of said elongated electrical conductor, wherein said pattern of electrically-conductive adhesive electrically connects to said built up metal.

9. The article of claim 8 wherein said built-up metal is coated with an oxidation-resistant metal.

10. The article of claim 1 wherein said pattern of electrically-conductive adhesive is formed by one of roll coating, screen printing, stenciling, mask printing, ink jet printing and laminating an electrically conductive adhesive.

11. The article of claim 1 wherein said pattern of electrically-conductive adhesive includes a spiral conductor having at least one turn.

12. The article of claim 1 wherein the at least one contact of said electronic device is electrically connected to the contact of said pattern of electrically conductive adhesive by one of solder and an electrically-conductive adhesive.

13. The article of claim 12 wherein the electrically-conductive adhesive is deposited with said pattern of electrically-conductive adhesive and of the same electrically-conductive adhesive material.

14. The article of claim 12 wherein the electronic device is attached to said substrate while the electrically-conductive adhesive is wet.

15. The article of claim 12 wherein the electronic device is attached to said substrate after the electrically-conductive adhesive is dried or B-staged, and wherein one of said substrate and said electronic device is heated to melt flow said electrically-conductive adhesive.

16. The article of claim 12 further including a metal coating on at least the contact of the pattern of electrically-conductive adhesive to which said solder connects.

17. The article of claim 1 wherein said substrate includes one of poly-vinyl-chloride (PVC), polyimide, poly-ethylene terephthallate (PET), polybutylene terephthallate, polyester, polyester terephthallate, polymer blends, polyphynylene sulfide, polysulfone, polyether sulfone, paper film, dried insulating adhesive, and B-staged insulating adhesive.

18. The article of claim 1 further comprising an insulating adhesive underfill attaching said electronic device to said substrate.

19. An article comprising:

a substrate having at least one hole therethrough;

an elongated electrical conductor on one surface of said substrate and having at least one end at the hole of said substrate;

a pattern of electrically-conductive adhesive on a second surface of said substrate and extending into the at least one hole, said electrically-conductive adhesive being electrically connected to said elongated electrical conductor through the at least one hole in said substrate and having at least one contact; and

an electronic device attached to said substrate and having at least one contact electrically connected to the contact of said pattern of electrically-conductive adhesive, wherein said substrate has at least two second holes in addition to the at least one hole, further comprising a pattern of at least two electrical contacts on the one surface of said substrate, each of said two electrical contacts being at a respective one of the second holes, wherein said electrically-conductive adhesive has at least two additional contacts that are electrically connected to each of said at least two electrical contacts through the at least two second holes, respectively, wherein said electronic device has at least two second contacts electrically connected respectively to the at least two additional contacts of the electrically-conductive adhesive.

20. The article of claim 19 wherein said pattern of electrically-conductive adhesive extends into the at least two second holes of said substrate to provide electrical connection to said two electrical contacts.

21. The article of claim 19 further including metal built up in each of the two second holes on said two electrical contacts, wherein said pattern of electrically-conductive adhesive electrically connects to said built up metal.

22. The article of claim 1 further comprising at least one cover layer laminated to said substrate with insulating adhesive.

23. A wireless article comprising:

a substrate having at least first and second spaced apart holes therethrough and having first and second opposing surfaces;

an elongated electrical conductor forming a spiral having at least one turn on the first surface of said substrate and having respective first and second terminals respectively located at the first and second spaced apart holes of said substrate;

a pattern of electrically-conductive adhesive on the second surface of said substrate defining first and second contacts thereon, said pattern of electrically-conductive adhesive providing respective electrical connections to the first and second terminals of said elongated electrical conductor through the first and second spaced apart holes, respectively, in said substrate; and

an electronic device having first and second contacts attached to said substrate, wherein the first and second contacts of said electronic device are electrically connected to the first and second contacts, respectively, of said pattern of electrically-conductive adhesive.

24. The wireless article of claim 23 wherein said elongated electrical conductor includes at least one of a deposited electrically-conductive adhesive and a metal foil.

25. The wireless article of claim 24 herein said metal foil is laminated to the first surface of said substrate and is patterned to define said elongated electrical conductor.

26. The wireless article of claim 24 wherein metal is built up on said metal foil within the first and second spaced apart holes through said substrate.

27. The wireless article of claim 23 wherein said pattern of electrically-conductive adhesive extends into the first and second holes of said substrate to provide electrical connection to the first and second terminals of said elongated electrical conductor.

28. The wireless article of claim 23 further including metal built up in the first and second holes on said the first and second terminals, respectively, of said elongated electrical conductor, wherein said pattern of electrically-conductive adhesive provides respective electrical connection to the first and second terminals of said elongated electrical conductor via said built up metal.

29. The wireless article of claim 23 wherein said pattern of electrically-conductive adhesive is formed by one of roll coating, screen printing, stenciling, mask printing, ink jet printing and laminating an electrically conductive adhesive.

30. The wireless article of claim 23 wherein said pattern of electrically-conductive adhesive includes a spiral having plural turns.

31. The wireless article of claim 23 wherein the respective electrical connections of the first and second contacts of said electronic device to the first and second contacts of said pattern of eletctrically conductive adhesive each include one of solder and an electrically-conductive adhesive.

32. The wireless article of claim 31 further including a metal coating on at least the first and second contacts of the pattern of electrically-conductive adhesive to which said solder connects.

33. The wireless article of claim 31 wherein the electrical connections of electrically-conductive adhesive are deposited with said pattern of electrically-conductive adhesive and of the same electrically-conductive adhesive material.

34. The wireless article of claim 31 wherein the electronic device is attached to said substrate while the electrical connections of electrically-conductive adhesive are wet.

35. The wireless article of claim 31 wherein the electronic device is attached to said substrate after the electrical connections of electrically-conductive adhesive are dried or B-staged, and wherein one of said substrate and said electronic device is heated to melt flow said electrical connections of electrically-conductive adhesive.

36. The wireless article of claim 23 wherein said substrate includes one of poly-vinyl-chloride (PVC), polyimde, poly-ethylene terephthallate (PET), polybutylene terephthallate, polyester, polyester terephthallate, polymer blends, polyphynylene sulfide, polysulfone, polyether sulfone, paper film, dried insulating thermoplastic adhesive, and B-staged insulating thermosetting adhesive.

37. The wireless article of claim 23 further comprising an insulating adhesive underfill attaching said electronic device to said substrate.

38. The wireless article of claim 23 wherein said substrate has at least third and fourth spaced apart holes therethrough, further comprising a pattern of at least first and second electrical contacts on the first surface of said substrate, each of said first and second electrical contacts on the first surface of said substrate being at a respective one of the third and fourth holes, wherein said pattern of electrically-conductive adhesive defines third and fourth contacts on the second surface of said substrate that are electrically connected respectively to said at least first and second electrical contacts on the first surface of said substrate through the third and fourth holes, respectively, and wherein said electronic device has at least third and fourth contacts electrically connected respectively to the at least third and fourth contacts of the pattern of electrically-conductive adhesive.

39. The wireless article of claim 38 wherein said pattern of electrically-conductive adhesive extends into the at least third and fourth holes of said substrate to provide electrical connection to said first and second electrical contacts.

40. The wireless article of claim 38 further including metal built up in the third and fourth holes on said first and second electrical contacts, wherein said pattern of electrically-conductive adhesive electrically connects to said built up metal.

41. The wireless article of claim 23 wherein the first and second contacts of said electronic device are electrically connected respectively to the first and second contacts of said pattern of electrically conductive adhesive by one of solder and an electrically-conductive adhesive.

42. The wireless article of claim 23 further comprising at least one cover layer laminated to said substrate with insulating adhesive.

43. A wireless article having a radio frequency antenna comprising:

a planar dielectric substrate having at least first and second spaced apart holes therethrough and having first and second opposing surfaces;

an elongated electrical conductor on the first surface of said dielectric substrate including a spiral pattern having more than one turn and having first and second terminals respectively located at the first and second spaced apart holes of said dielectric substrate, wherein said elongated electrical conductor is formed of one of a deposited electrically-conductive adhesive and a metal foil;

a pattern of electrically-conductive adhesive on the second surface of said dielectric substrate defining first and second contacts thereon, said pattern of electrically-conductive adhesive including a spiral conductor having more than one turn and having first and second terminals wherein the first terminal of the spiral conductor is located at the first spaced apart hole of said dielectric substrate to provide an electrical connection to the first terminal of said elongated electrical conductor through the first spaced apart hole, wherein the second terminal of the spiral conductor connects to the first contact, and wherein the second contact connects to the second terminal of said elongated electrical conductor through the second spaced apart hole;

whereby said elongated electrical conductor and said pattern of electrically-conductive adhesive provide the radio frequency antenna; and

an electronic device having first and second contacts attached to said dielectric substrate, wherein the first and second contacts of said electronic device are electrically connected to the first and second contacts, respectively, of said pattern of electrically-conductive adhesive.

44. The wireless article of claim 43 further comprising encapsulating material encapsulating at least said electronic device to said dielectric substrate.

45. The wireless article of claim 44 wherein said encapsulating material covers at least one of said elongated electrical conductor and said pattern of electrically-conductive adhesive.

46. The wireless article of claim 44 wherein said dielectric substrate is formed of a flexible material, and wherein said encapsulating material is as least as flexible as said dielectric substrate.

47. The wireless article of claim 43 wherein said wireless article is employed as one of an identification tag, an identification badge, an access card, a credit card, a debit card, a cash card and phone card.

48. The wireless article of claim 43 further comprising a pattern of at least two external contacts on the first surface of said dielectric substrate located at third and fourth spaced apart holes through said dielectric substrate, wherein said electronic device has third and fourth contacts attached to said dielectric substrate, wherein the third and fourth contacts of said electronic device are electrically connected respectively to the at least two external contacts, respectively, of said pattern of external contacts.

49. The wireless article of claim 43 wherein said dielectric substrate is formed of a flexible material, and wherein said electrically-conductive adhesive is as least as flexible as said dielectric substrate.

50. The wireless article of claim 43 further comprising at least one additional electronic device having first and second contacts attached to said dielectric substrate, wherein the first and second contacts of said at least one additional electronic device are electrically connected to corresponding contacts of said pattern of electrically-conductive adhesive.

51. A method of making a wireless article comprising:

providing a substrate having holes therethrough and an elongated conductor on a first surface thereof having terminals of the elongated conductor extending, at least partially over the holes;

depositing electrically-conductive material in the holes to electrically connect to the elongated conductor;

depositing a pattern of electrically-conductive adhesive on a second surface of the substrate to electrically connect the elongated conductor to first and second contacts; and

attaching first and second contacts of an electronic device to the first and second contacts of the pattern of electrically-conductive adhesive on the substrate.

52. The method of claim 51 wherein said providing a substrate comprises laminating a metal foil and a sheet of substrate material, and patterning the metal foil to form the elongated conductor.

53. The method of claim 51 wherein said providing a substrate comprises depositing a substrate material onto a metal foil, forming first and second holes in the substrate material, and patterning the metal foil to form the elongated conductor.

54. The method of claim 53 including one of drying, B-staging and curing the substrate material prior to said patterning the metal foil.

55. The method of claim 53 wherein said depositing a substrate material includes depositing an insulating adhesive by one of roll coating, screen printing, stenciling, mask printing, ink jet printing and laminating.

56. The method of claim 51 wherein said providing a substrate comprises depositing an elongated conductor on the first surface a sheet of substrate material.

57. The method of claim 56 wherein said depositing an elongated conductor includes depositing a pattern of an electrically-conductive adhesive by one of roll coating, screen printing, stenciling, mask printing, and ink jet printing.

58. The method of claim 51 wherein said depositing electrically-conductive material comprises building up metal in the holes on the terminals of the elongated conductor extending over the holes.

59. The method of claim 51 wherein said depositing electrically-conductive material comprises depositing electrically-conductive adhesive into the holes through the substrate contacting the terminals of the elongated conductor extending over the holes.

60. The method of claim 51 wherein said depositing a pattern of electrically conductive adhesive includes one of roll coating, screen printing, stenciling, mask printing, and ink jet printing.

61. The method of claim 51 wherein said attaching comprises connecting the respective contacts of the electronic device and of the pattern of electrically-conductive adhesive while the electrically-conductive adhesive is wet.

62. The method of claim 51 wherein said attaching comprises drying or B-staging the pattern of electrically-conductive adhesive, heating one of the substrate and electronic device to a melt flow temperature of the electrically-conductive adhesive, and connecting the respective contacts of the electronic device and of the pattern of electrically-conductive adhesive.

63. The method of claim 51 wherein said attaching comprises coating a metal on at least the first and second contacts of the pattern of electrically-conductive adhesive, heating one of the substrate and electronic device to a melt flow temperature of solder, and connecting with solder the respective contacts of the electronic device and of the pattern of electrically-conductive adhesive.

64. A method for making an article comprising:

providing a substrate having two spaced apart holes therethrough and an elongated conductor on a first surface thereof having two terminals of the elongated conductor extending at least partially over the two spaced apart holes;

depositing a pattern of electrically-conductive adhesive on a second surface of the substrate and into the two spaced apart holes to electrically connect to the elongated conductor through the two spaced apart holes and having at least one contact; and

attaching at least one contact of an electronic device to the at least one contact of the pattern of electrically-conductive adhesive on the substrate.

65. The method of claim 64 wherein said providing a substrate comprises laminating a metal foil and a sheet of substrate material, and patterning the metal foil to form the elongated conductor.

66. The method of claim 64 wherein said providing a substrate comprises depositing a substrate material onto a metal foil, forming the two spaced apart holes in the substrate material, and patterning the metal foil to form the elongated conductor.

67. The method of claim 66 including one of drying, B-staging and curing the substrate material prior to said patterning the metal foil.

68. The method of claim 66 wherein said depositing a substrate material includes depositing an insulating adhesive by one of roll coating, screen printing, stenciling, mask printing, ink jet printing and laminating.

69. The method of claim 64 wherein said providing a substrate comprises depositing an elongated conductor on the first surface a sheet of substrate material.

70. The method of claim 69 wherein said depositing an elongated conductor includes depositing a pattern of an electrically-conductive adhesive by one of roll coating, screen printing, stenciling, mask printing, and ink jet printing.

71. The method of claim 64 further comprising depositing electrically-conductive metal in the two spaced apart holes on the two terminals of the elongated conductor extending over the two spaced apart holes.

72. The method of claim 64 wherein said depositing electrically-conductive adhesive comprises depositing electrically-conductive adhesive into and substantially filling the two spaced apart holes through the substrate contacting the two terminals of the elongated conductor extending over the two spaced apart holes.

73. The method of claim 64 wherein said depositing a pattern of electrically conductive adhesive includes one of roll coating, screen printing, stenciling, mask printing, and ink jet printing.

74. The method of claim 64 wherein said attaching comprises connecting the at least one contact of the electronic device and of the pattern of electrically-conductive adhesive while the electrically-conductive adhesive is wet.

75. The method of claim 64 wherein said attaching comprises drying or B-staging the pattern of electrically-conductive adhesive, heating one of the substrate and electronic device to a melt flow temperature of the electrically-conductive adhesive, and connecting the respective at least one contact of the electronic device and of the pattern of electrically-conductive adhesive.

76. The method of claim 64 wherein said attaching comprises coating a metal on at least the at least one contact of the pattern of electrically-conductive adhesive, heating one of the substrate and electronic device to a melt flow temperature of solder, and connecting with solder the respective at least one contact of the electronic device and of the pattern of electrically-conductive adhesive.

77. A combination contact and wireless article comprising:

a substrate having first and second opposed surfaces and having at least first, second and third spaced-apart holes therethrough;

an elongated electrical conductor providing an antenna on the first surface of said substrate and having at least one terminal at the first hole through said substrate;

a pattern of at least two electrical contacts on the first surface of said substrate, each of said two electrical contacts being at a one of the second and third holes through said substrate;

a pattern of electrically-conductive adhesive on the second surface of said substrate, said pattern of electrically-conductive adhesive defining first, second and third contacts that are electrically connected to said elongated electrical conductor and said two electrical contacts through the first, second and third holes, respectively, through said substrate; and

an electronic device attached to the second surface of said substrate and having at least three contacts electrically connected to the first, second and third contacts, respectively, of said pattern of electrically-conductive adhesive.

78. A wireless article comprising:

a substrate having at least one hole therethrough;

an elongated electrical conductor forming an antenna on one surface of said substrate and having a terminal at the at least one hole of said substrate;

a pattern of electrically-conductive adhesive on a second surface of said substrate and extending into the at least one hole,

said electrically-conductive adhesive being electrically connected to the terminal of said elongated electrical conductor through the at least one hole in said substrate, and

said electrically-conductive adhesive defining at least one contact on the second surface of said substrate; and

a flip-chip electronic device attached to the second surface of said substrate in a flip-chip manner,

said flip-chip electronic device having at least one contact facing the second surface of said substrate and electrically connected to the contact of said pattern of electrically-conductive adhesive on the second surface of said substrate.

79. A method for making a wireless article comprising:

providing a substrate having at least one hole therethrough and an elongated conductor forming an antenna on a first surface there of having a terminal of the elongated conductor extending at least partially over the at least one hole;

depositing a pattern of electrically-conductive adhesive on a second surface of the substrate and into the at least one hole to electrically connect to the terminal of the elongated conductor through the at least one hole,

said deposited pattern of electrically-conductive adhesive defining at least one contact; and

attaching at least one contact of a flip-chip electronic device to the at least one contact of the pattern of electrically-conductive adhesive on the second surface of the substrate in a flip-chip manner,

said attaching comprising one of;

pressing the at least one contact of the electronic device against the contact of the pattern of electrically-conductive adhesive while the electrically-conductive adhesive is wet, and

heating one of the substrate and electronic device to a melt flow temperature of the electrically-conductive adhesive and pressing the respective at least one contact of the electronic device against the at least one contact of the pattern of electrically-conductive adhesive.