Structure for mounting radiating plate

• US 6,353,537 B2
• Filed: 12/15/1999
• Issued: 03/05/2002
• Est. Priority Date: 12/17/1998
• Status: Active Grant

• Current Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Original Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Inventors: Egawa, Satoshi
• Primary Examiner(s): Thompson, Gregory
• Application Number:
  US09/461,022
• Publication Number:
  US 20010050844A1
• Time in Patent Office: 811 Days
• Field of Search: 165/80.2, 165/80.3, 165/185, 174/16.3, 257/706-707, 257/712-713, 257/718-719, 257/726-727, 361/707, 361/709-710, 361/715, 361/719-720, 248/505, 248/510
• US Class Current: 361/704
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A radiating-plate mounting structure for mounting a radiating plate on a semiconductor integrated circuit installed on a printed circuit board is arranged to have a pin disposed on the printed circuit board in the neighborhood of the semiconductor integrated circuit and to fix the radiating plate to the semiconductor integrated circuit by pressing the radiating plate with a spring member using a lock part of the pin as a fulcrum. At this time, the middle part of the radiating plate can be reliably fixed to the semiconductor integrated circuit by a hole provided in the spring member for allowing a fin part of the radiating plate to escape through the hole. The structural arrangement effectively eliminates the possibility of having the radiating plate caused to peel off by some impact inflicted thereon.

Claims

1. A semiconductor integrated circuit structure comprising:

(a) a printed circuit board for connecting circuit elements;

(b) a semiconductor integrated circuit installed on said printed circuit board;

(c) a metal radiating plate provided on said semiconductor integrated circuit, said radiating plate having a plurality of fins;

(d) a metal spring member which is formed with a V-shaped tip part and is provided with a hole for allowing at least one of the plurality of fins of said radiating plate to escape through said hole, said tip part pressing and fixing said metal radiating plate to said semiconductor integrated circuit; and

(e) a metal pin member which is attached to said printed circuit board and which supports said metal radiating plate on said printed circuit board by spring force of said spring member.

2. A semiconductor integrated circuit structure according to claim 1, wherein said V-shaped tip part is formed in a center part of said metal spring member, said radiating plate has a base member and with said plurality of fins vertically extending from said base member, and said spring member presses and fixes said base member of said radiating plate on said semiconductor circuit.