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Structure for mounting radiating plate

  • US 6,353,537 B2
  • Filed: 12/15/1999
  • Issued: 03/05/2002
  • Est. Priority Date: 12/17/1998
  • Status: Active Grant
First Claim
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1. A semiconductor integrated circuit structure comprising:

  • (a) a printed circuit board for connecting circuit elements;

    (b) a semiconductor integrated circuit installed on said printed circuit board;

    (c) a metal radiating plate provided on said semiconductor integrated circuit, said radiating plate having a plurality of fins;

    (d) a metal spring member which is formed with a V-shaped tip part and is provided with a hole for allowing at least one of the plurality of fins of said radiating plate to escape through said hole, said tip part pressing and fixing said metal radiating plate to said semiconductor integrated circuit; and

    (e) a metal pin member which is attached to said printed circuit board and which supports said metal radiating plate on said printed circuit board by spring force of said spring member.

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