Semiconductor manufacturing system

• US 6,354,781 B1
• Filed: 11/01/1999
• Issued: 03/12/2002
• Est. Priority Date: 11/01/1999
• Status: Expired due to Term

• Current Assignee: Chartered Semiconductor Manufacturing Incorporated (GlobalFoundries, Inc.)
• Original Assignee: Chartered Semiconductor Manufacturing Incorporated (GlobalFoundries, Inc.)
• Inventors: Pan, Yang
• Primary Examiner(s): Keenan, James W.
• Application Number:
  US09/431,151
• Time in Patent Office: 862 Days
• Field of Search: 414/217, 414/217.1, 414/222.13, 414/939, 414/940
• US Class Current: 414/217
• CPC Class Codes: H01L 21/67709 using magnetic elements
• CPC Class Codes: H01L 21/67733 Overhead conveying
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber

Abstract

An improved manufacturing system for processing semiconductor wafers which includes a (1) plurality of processing stations, (2) a sealed transport tunnel located directly over the processing stations, (3) a transport to move wafers within the tunnel, (4) interconnection chambers joining the transport tunnel and the processing stations, (5) interface mechanisms in the interconnection chambers to move the wafers to and from the processing stations, and (6) a computer to control the operations of the transport, the interface mechanisms, and the processing equipment at the processing stations.

Claims

1. A manufacturing system for handling and individually processing semiconductor wafers through a plurality of processing stations that perform operations on semiconductor wafers to produce operable integrated circuit semiconductor devices comprising:

a plurality of processing stations, each having an enclosure that is capable of maintaining a controlled clean environment, with at least one processing apparatus contained within each of said enclosures,

a sealed transport tunnel adapted to maintain a controlled clean environment within, said tunnel located directly above said plurality of processing stations,

interconnection chambers that are adapted to maintain a clean environment within, each of said chambers connected to the top of one of said enclosures of said processing stations, and to said transport tunnel,

an interface mechanism within each of said chambers to transfer wafers to and from said processing apparatus within said enclosure, and said transport tunnel,

a means to move wafers to be processed between the said interface mechanisms in said chambers, and through said transport tunnel, and

a means to maintain controlled clean environments in said (1) enclosures of said processing stations, (2) said transport tunnel, and (3) said interconnection chambers.

2. The manufacturing system of claim 1, wherein said processing stations are housed in a manufacturing building having a lower floor and a ceiling, said processing stations are located on a said lower floor of a manufacturing building, and said transport tunnel is located on the said ceiling of said building.

3. The manufacturing system of claim 1, wherein a master control system is provided that tracks each wafer being processed and moves the wafers through the system by activating said (1) means to move wafers through the transport tunnel, (2) the interface mechanisms, and (3) the processing apparatus.

4. The manufacturing system of claim 1, wherein said interface mechanisms each include a (1) buffer to store wafers to be processed at the processing station, and (2) a buffer to store processed wafers from the associated processing apparatus while awaiting removal by said means to move wafers through said transport tunnel.

5. The manufacturing system of claim 4, wherein said buffers to store wafers to be processed, and said buffers to store processed wafers are located in said interconnection chambers.

6. The manufacturing system of claim 5, wherein said means to move wafers is a robot.

7. The manufacturing system of claim 5, wherein said means to move wafers is comprised of (1) a first robot provided to move wafers from said sealed tunnel, to said buffer to store wafers, to said processing apparatus, and (2) a second robot provided to move wafers after being processed from said processing apparatus to said buffers to store processed wafers, to said tunnel.

8. The manufacturing system of claim 7, wherein a system computer is provided to control the operation of the wafer carrier, said first and second robots, and said processing apparatus.

9. The manufacturing system of claim 1, wherein said means to move wafers is comprised of a wafer carrier, and a track in said transport tunnel that has access to all of said processing apparatus of said manufacturing system.

10. The manufacturing system of claim 8, wherein said track is a magnetic track, and said wafer carrier has a plurality of magnets that support the carrier over said magnetic track.

11. The manufacturing system of claim 10, wherein said wafer carrier has a shoulder that provides a support for a wafer on the bottom peripheral area of the wafer.