Removable large area, low defect density films for led and laser diode growth

• US 6,355,497 B1
• Filed: 01/18/2000
• Issued: 03/12/2002
• Est. Priority Date: 01/18/2000
• Status: Expired due to Term

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Wood, Rose M., Johnson, Noble M., Chua, Christopher L., Romano, Linda T., Krusor, Brent S., Walker, Jack
• Primary Examiner(s): CHRISTIANSON, KEITH ALAN
• Application Number:
  US09/490,286
• Time in Patent Office: 784 Days
• Field of Search: 438/33, 438/39, 438/46, 438/47, 438/455, 438/458, 438/459, 438/479, 438/481, 438/938
• US Class Current: 438/39
• CPC Class Codes: H01L 21/02373 Group 14 semiconducting materials
• CPC Class Codes: H01L 21/0242 Crystalline insulating materials
• CPC Class Codes: H01L 21/02532 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate

Abstract

A technique based on etching a release layer, for separating the nearly lattice matched substrate from a base substrate is disclosed. A nearly lattice matched substrate for the epitaxial growth of Group-III nitride semiconductor devices and method of fabricating the nearly lattice matched substrate and devices is disclosed. Enhanced ELOG methods are used to create low defect density GaN films. The GaN films are used to grow Group-III nitride LEDs and laser diodes.

Claims

1. A method for separating a film from a base substrate, the method comprising:

growing a nucleation layer over the base substrate;

depositing a release layer material above the base substrate for forming a release layer;

growing a film over the release layer; and

,

etching the release layer with an etchant to separate the film from the base substrate.

2. The method for separating a film as set forth in claim 1 wherein the depositing step includes:

depositing the release layer over the nucleation layer.

3. The method for separating a film as set forth in claim 2 wherein the growing step includes:

etching a part of the release layer, for creating windows, exposing portions of the nucleation layer and creating release layer mesas, the mesas having sides adjacent to respective ones of the windows; and

,

growing the film, using the exposed portions of the nucleation layer as seeds.

4. The method for separating a film as set forth in claim 3 further comprising:

growing the film vertically in the windows and laterally and vertically over the release layer mesas.

5. The method for separating a film as set forth in claim 4 further comprising:

stopping lateral and vertical film growth over the release layer mesas before the film growing in windows adjacent to the respective sides of the mesas meet and coalesce.

6. The method for separating a film as set forth in claim 3 wherein the step of etching part of the release layer includes:

creating respective lips on the mesas, adjacent to a first set of window portions.

7. The method for separating a film as set forth in claim 6 wherein the growing step further includes:

growing the film laterally over the release layer from a second set of window portions that are not adjacent to the lips, before growing the film laterally over the release layer from the first set of window portions.

8. The method for separating a film as set forth in claim 7 wherein the growing step further includes:

etching film portions in the windows, for exposing the nucleation layer;

depositing release material in the windows for making the release layer continuous; and

,

continuing film growth from unetched film portions.

15. The method for separating a film as set forth in claim 1 further comprising:

providing a support substrate on top of the film before the step of etching the release layer.

25. The method for fabricating a semiconductor device as set forth in claim 1, further comprising:

providing vias through the base substrate and nucleation layer to provide additional access points for etchant to reach the release layer.

26. The method for fabricating a semiconductor device as set forth in claim 25, wherein the step of providing vias includes:

laser drilling the vias through the base substrate.

9. A method for separating a film from a base substrate, the method comprising:

depositing a material that may be selectively etched with respect to the film selected from silicon dioxide (SiO2), silicon nitride and SiON above the base substrate for forming a release layer;

growing a film over the release layer; and

,

etching the release layer with an etchant to separate the film from the base substrate.

10. The method for separating a film as set forth in claim 9 wherein the step of etching further includes:

etching with Hydrogen Fluoride (HF).

11. A method for separating a film from a base substrate, the method comprising:

depositing a release layer material above the base substrate for forming a release layer;

growing a Group III-nitride film over the release layer; and

,

etching the release layer with an etchant to separate the film from the base substrate.

12. A method for separating a film from a base substrate, the method comprising:

depositing a release layer material above the base substrate for forming a release layer;

growing a GaN film over the release layer; and

,

etching the release layer with an etchant to separate the film from the base substrate.

13. A method for separating a film from a base substrate, the method comprising:

depositing a release layer material above the base substrate for forming a release layer;

growing a film over the release layer;

providing vias in the film, for providing increased access to the release layer for an etchant; and

,

etching the release layer with the etchant to separate the film from the base substrate.

14. A method for separating a film from a base substrate, the method comprising:

providing vias in the base substrate, for providing increased access to the release layer for an etchant;

depositing a release layer material above the base substrate for forming a release layer;

growing a film over the release layer; and

,

etching the release layer with the etchant to separate the film from the base substrate.

16. A method for separating a film from a base substrate, the method comprising:

depositing a release layer material above the base substrate for forming a release layer;

growing a film over the release layer;

providing an electrically conductive support substrate on top of the film before the step of etching the release layer; and

,

etching the release layer with an etchant to separate the film from the base substrate.

17. A method for separating a film from a base substrate, the method comprising:

depositing a release layer material above the base substrate for forming a release layer;

growing a film over the release layer;

providing a thermally conductive support substrate on top of the film before the step of etching the release layer; and

,

etching the release layer with an etchant to separate the film from the base substrate.

18. A method for separating a film from a base substrate, the method comprising:

depositing a release layer material above the base substrate for forming a release layer;

growing a film over the release layer;

providing a silicon support substrate on top of the film before the step of etching the release layer; and

,

etching the release layer with an etchant to separate the film from the base substrate.

19. A method for separating a film from a base substrate, the method comprising:

depositing a release layer material above the base substrate for forming a release layer;

growing a film over the release layer;

providing a support substrate on top of the film,

providing vias in the support substrate adjacent to vias in the film;

etching the release layer with an etchant to separate the film from the base substrate.

20. A method for fabricating a semiconductor device, comprising:

growing a nucleation layer on a base substrate;

depositing a release layer over the nucleation layer;

manipulating the release layer for i) providing points of access to the nucleation layer for uses as a seed crystal for a film, and ii) blocking defects in the nucleation layer from propagating into at least one region of the film;

growing the film, producing a low defect density region in the film sized for use as a substrate for growing a semiconductor device;

growing the semiconductor device on the low defect density region of the film;

removing the base substrate and the nucleation layer;

applying contact metallization; and

,

cleaving the device.

21. The method for fabricating a semiconductor device as set forth in claim 20, wherein the step of applying contacts comprises:

applying a contact to the device, and;

applying an contact to a backside of the film.

22. The method for fabricating a semiconductor device as set forth in claim 20, wherein in the step of removing includes:

selectively etching the release layer.

23. The method for fabricating a semiconductor device as set forth in claim 20, further comprising:

before the step of growing the device, providing a via through the film to expose at least one portion of the release layer;

plugging the via with a photoresist plug;

applying a first contact metallization;

removing the photoresist plug;

depositing photoresist over at least one of the film and the device, none of the photoresist being deposited over the via.

24. The method for fabricating a semiconductor device as set forth in claim 22, further comprising:

depositing a second contact metallization on the backside of the film.

27. The method for fabricating a semiconductor device as set forth in claim 20, wherein the step of applying contact metallization further comprises:

using angle evaporation for applying the contact.

28. The method for fabricating a semiconductor device as set forth in claim 20, further comprising:

before the step of growing the device, providing a via through the film to expose at least one portion of the release layer;

applying a first contact metallization;

depositing photoresist over at least one of the film and the device, none of the photoresist being deposited over the via;

etching metal from within the via.

29. The method for fabricating a semiconductor device as set forth in claim 20 further comprising:

growing a support substrate on a top of the film before the step of removing the base substrate; and

,

growing the semiconductor device on the bottom of the film after the step of removing the substrate.

30. A semiconductor device fabricated according to the method of claim 20.

31. The device of claim 30 comprising a laser diode.

32. The device of claim 30 comprising a light emitting diode.