Method and structure of manufacturing a high-Q inductor with an air trench

• US 6,355,535 B2
• Filed: 06/01/2001
• Issued: 03/12/2002
• Est. Priority Date: 08/07/1998
• Status: Expired due to Term

• Current Assignee: Winbond Electronics Corporation
• Original Assignee: Winbond Electronics Corporation
• Inventors: Liou, Ping
• Primary Examiner(s): Pham, Long
• Application Number:
  US09/873,133
• Publication Number:
  US 20010028098A1
• Time in Patent Office: 284 Days
• Field of Search: 438/381, 438/421
• US Class Current: 438/381
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01L 21/764 Air gaps H01L21/76264 takes precedence
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The structure of a high-Q inductor applied in a monolithic circuit according to the invention comprises a plurality of spiral metal lines and a plurality of dielectric layers, each dielectric layer formed between two adjacent spiral metal lines. Furthermore, via plugs are formed in each dielectric layer to electrically connect two adjacent spiral metal lines. A spiral air trench is formed along the spacing of the spiral metal lines in the dielectric layers. Therefore, the 3D-structure of the inductor of the invention can greatly reduce the series resistance thereof without widening the spiral metal lines. In addition, the spiral air trench, filled with air which has a lower dielectric constant, can efficiently reduce the parasitic capacitance between the spacing of the spiral metal lines. As a result, the inductor of the invention has a higher quality factor at a proper RF operating frequency region.

Claims

1. A method of manufacturing an inductor with an air trench, which is applied in monolithic circuit processing, the method comprising the steps of:

(a) providing a substrate having at least one insulator formed thereon;

(b) forming a lower metal line, serving as a first connective line, on the insulator;

(c) forming a lower dielectric layer, which has at least one via hole, on the lower metal line, wherein the via hole is filled with a first via plug for connecting the lower metal line;

(d) forming a spiral metal line, one end of which is electrically connected to the first via plug, on the lower dielectric layer;

(e) forming a dielectric layer, which has at least one via hole, on the spiral metal line, wherein the via hole is filled with a second via plug for connecting the spiral metal line;

(f) repeating steps (a)-(e) to form a spiral inductor structure;

(g) forming an upper spiral metal line having a second connective line, which is aligned with and electrically connected to the spiral inductor structure, over the substrate;

(h) forming an upper dielectric layer on the upper spiral metal line and over the substrate;

(i) forming a mask on the upper dielectric layer with only the part just above the spacing of the spiral inductor exposed; and

(j) forming a spiral air trench in the upper dielectric layer and the dielectric layer by etching until the lower dielectric layer is exposed.

2. The method as recited in claim 1, wherein the lower metal line, the upper spiral metal line and the spiral metal line are made of aluminum by sputtering.

3. The method as recited in claim 1, wherein the lower dielectric layer and the dielectric layer are made of silicon oxide by chemical vapor deposition.

4. The method as recited in claim 1, wherein the via plug is a tungsten plug.

5. The method as recited in claim 4, wherein the steps of forming the via plug comprise:

forming a tungsten layer, which completely fills the via hole, on the dielectric layer; and

removing part of the tungsten layer to form a tungsten plug in the via hole.

6. The method as recited in claim 5, wherein the step of removing part of the tungsten layer is performed by chemical mechanical polishing.

7. The method as recited in claim 5, wherein the step of removing part of the tungsten layer is performed by etch back.

8. The method as recited in claim 1, wherein the upper dielectric layer consists of a silicon oxide layer and a silicon nitride layer, which are formed by chemical vapor deposition.

9. The method as recited in claim 8, further comprising forming a silicon nitride layer on the inner surface of the spiral air trench to cover the sidewalls and bottom thereof after the spiral air trench is formed.

10. The method as recited in claim 1, wherein the upper dielectric layer is a silicon oxide layer.

11. The method as recited in claim 10, further comprising forming a silicon nitride layer on the inner surface of the spiral air trench to cover the sidewalls and bottom thereof after the spiral air trench is formed.