×

Three-dimensional packaging technology for multi-layered integrated circuits

  • US 6,355,976 B1
  • Filed: 07/27/1998
  • Issued: 03/12/2002
  • Est. Priority Date: 05/14/1992
  • Status: Expired due to Fees
First Claim
Patent Images

1. A module subassembly comprising:

  • an element having a planar surface and at least an edge portion which is transparent to electromagnetic radiation;

    a plurality of active circuit devices disposed in juxtaposition with said planar surface and spaced from said an edge portion; and

    encoding means extending from a portion of said plurality of active circuit devices and terminating at the outer edge of said at least an edge portion.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×