Multi-band amplifier having multi-tap RF choke

• US 6,356,155 B1
• Filed: 04/11/2001
• Issued: 03/12/2002
• Est. Priority Date: 04/11/2001
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Tropian, Inc. (Panasonic Holdings Corporation)
• Inventors: Judkins, James G.
• Primary Examiner(s): Pascal, Robert
• Assistant Examiner(s): Choe, Henry
• Application Number:
  US09/834,056
• Time in Patent Office: 335 Days
• Field of Search: 330/126, 330/295, 330/297, 330/302, 330/307
• US Class Current: 330/295
• CPC Class Codes: H03F 2200/39 Different band amplifiers are coupled in parallel to broadband the whole amplifying circuit
• CPC Class Codes: H03F 3/191 Tuned amplifiers H03F3/193, H03F3/195 take precedence
• CPC Class Codes: H03F 3/602 Combinations of several amplifiers

Abstract

An amplifier circuit formed on a single semiconductor substrate includes a first amplifier having at least one stage for amplifying signals within a first frequency band; a first amplifier having at least one stage for amplifying signals within a second frequency band; and a tapped coil having one end thereof coupled to a stage of the first amplifier and a tap thereof coupled to a stage of the second amplifier. The amplifier circuit may be an RF amplifier circuit, a first portion of the tapped coil serving as an RF choke for said stage of the first amplifier, and a second portion of the tapped coil serving as an RF choke for said stage of the second amplifier. Sharing the tapped coil between multiple band amplifiers increases integration density.

Claims

1. An amplifier circuit formed on a single semiconductor substrate, comprising:

a first amplifier having at least one stage for amplifying signals within a first frequency band;

a second amplifier having at least one stage for amplifying signals within a second frequency band; and

a tapped coil having a first tap thereof coupled to a stage of the first amplifier and a second tap thereof coupled to a stage of the second amplifier;

wherein the amplifier circuit is an RF amplifier circuit, a first portion of the tapped coil serving as an RF choke for said stage of the first amlifier, and a second portion of the tapped coil serving as an RF choke for said stage of the second amplifier.

2. The apparatus of claim 1, wherein the coil is supported along at least a portion of the length thereof by an airbridge structure.

3. The apparatus of claim 1, wherein the first and second amplifiers each comprise multiple stages.

4. The apparatus of claim 3, wherein the first and second portions of the multi-tap coil serve as RF chokes for respective first stages of the first and second amplifiers.

5. The apparatus of claim 4, wherein multiple amplifier stages each includes a field effect transistor.

6. The apparatus of claim 4, wherein multiple amplifier stages each includes a bipolar transistor.