Inter-circuit encapsulated packaging for power delivery

• US 6,356,448 B1
• Filed: 11/02/1999
• Issued: 03/12/2002
• Est. Priority Date: 11/02/1999
• Status: Expired due to Fees

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: INCEP Technologies, Inc. (KOCH Industries Incorporated)
• Inventors: Hartke, David, DiBene, Joseph Ted II
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Chervinsky, Boris L.
• Application Number:
  US09/432,878
• Time in Patent Office: 861 Days
• Field of Search: 361/688-690, 361/697, 361/704, 361/707-711, 361/715, 361/719-721, 361/784, 361/790, 174/16.1, 174/16.3, 174/52.2, 174/52.1, 165/80.2, 165/80.3, 165/185
• US Class Current: 361/721
• CPC Class Codes: G06F 1/18 Packaging or power distribution
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: G06F 1/189 Power distribution
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 4/64 Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/10325 Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2201/10704 Pin grid array [PGA]
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 7/1092 with built-in components, e.g. intelligent sockets

Abstract

An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.

Claims

1. A printed circuit board assembly, comprising:

a first printed circuit board;

a second printed circuit board; and

a mechanical coupler, comprising an inner conductive standoff an outer conductive standoff arranged coaxially with the inner conductive standoff and comprising a unitary standoff extending from the first printed circuit board to the second printed circuit board, the mechanical coupler providing a power path and a ground path from the first circuit board to the second circuit board.

2. The printed circuit board assembly of claim 1, wherein the first circuit board includes a power converter.

3. The printed circuit board assembly of claim 2, wherein:

the first printed circuit board includes a first circuit board first standoff pad coupled to a power output of the power converter via a first printed circuit board first trace;

the first printed circuit board includes a first printed circuit board second standoff pad coupled to a ground via a first printed circuit board second trace;

the second printed circuit board includes a second printed circuit board first standoff pad coupled to a device mounted on the second printed circuit board via a second printed circuit board first trace;

the second printed circuit board includes a second printed circuit board second standoff pad coupled to the ground via a second printed circuit board second trace; and

the mechanical coupler couples the first printed circuit board first standoff pad to the second printed circuit board first standoff pad and the first printed circuit board second standoff pad to the second printed circuit board second standoff pad.

4. The printed circuit board assembly of claim 3, wherein:

the inner conductive standoff couples the first printed circuit board first standoff pad to the second printed circuit board first standoff pad and the outer conductive standoff couples the fist printed circuit board second standoff pad to the second printed circuit board second standoff pad.

5. The printed circuit board assembly of claim 4, wherein the outer conductive standoff is greater in cross section than the first circuit board second trace.

7. The printed circuit board assembly of claim 4, wherein the mechanical coupler is disposed proximate the device.

8. The printed circuit board assembly of claim 3, wherein the first standoff pad is disposed within the second standoff pad.

9. The printed circuit board assembly of claim 8, wherein the first standoff pad is and the second standoff pad are concentric.

10. The printed circuit board assembly of claim 3, wherein the first circuit board further comprises a plurality of signal traces and the first circuit board trace is of lower impedance than the each of the plurality of signal traces.

11. The printed circuit board assembly of claim 3, wherein the second circuit board further comprises a plurality of signal traces and the second circuit board trace is of lower impedance than each of the plurality of signal traces.

12. The printed circuit board assembly of claim 1, wherein the power converter is thermally coupled to a heatsink.

6. The printed circuit board assembly of clam 4, wherein the outer conductive standoff is greater in cross section than the second circuit board second trace.

13. A mechanical coupler for physically coupling a first circuit board and a second circuit board, the mechanical coupler composing;

an outer conductive standoff;

an inner conductive standoff disposed within the outer conductive standoff, wherein the mechanical coupler provides a power path and a ground path from a first circuit board to a second circuit board and

wherein the outer conductive standoff is arranged coaxially with the inner conductive standoff and comprises a unitary standoff extendable from the first printed circuit board to the second printed circuit board.

14. The mechanical coupler of claim 13, wherein the first circuit board includes a power converter.

15. The mechanical coupler of claim 13, wherein:

the first circuit board includes a first circuit board first standoff pad coupled to a power output of the power converter via a first circuit board first trace;

the first circuit board includes a first circuit board second standoff pad coupled to a ground via a first circuit board second trace;

the second circuit board includes a second circuit board first standoff pad coupled to a device mounted on the second circuit board via a second circuit board first trace;

the second circuit board includes a second circuit board second standoff pad coupled to the ground via a second circuit board second trace; and

the mechanical coupler couples the first circuit board first standoff pad to the second circuit board first standoff pad and the first circuit board second standoff pad to the second circuit board second standoff pad.

16. The mechanical couplet of claim 15, wherein:

the inner conductive standoff couples the first circuit board first standoff pad to the second circuit board first standoff pad and the outer conductive standoff couples the first circuit board second standoff pad to the second circuit board second standoff pad.

17. The mechanical coupler of claim 16, wherein the outer conductive standoff is greater in cross section than the first circuit board second trace.

18. The mechanical coupler of claim 16, wherein the outer conductive standoff is greater in cross section than the second circuit board second trace.

19. The mechanical coupler of claim 16, wherein the mechanical coupler is disposed proximate the device.

20. The mechanical coupler of claim 15, wherein the first standoff pad is disposed within the second standoff pad.

21. The mechanical coupler of claim 15, wherein the first standoff pad and the second standoff pad are concentric.

22. The mechanical coupler of claim 15, wherein the first circuit board further comprises a plurality of signal traces and the first circuit board trace is of lower impedance than each of the plurality of signal traces.

23. The mechanical coupler of claim 13, wherein the first circuit board further comprises a plurality of signal traces and the second circuit board trace is of lower impedance than each of the plurality of signal traces.

24. The mechanical coupler of claim 13, wherein the power converter is thermally coupled to a heatsink.