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Electro-statically shielded processing module

  • US 6,356,809 B1
  • Filed: 06/11/1999
  • Issued: 03/12/2002
  • Est. Priority Date: 06/11/1999
  • Status: Expired due to Term
First Claim
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1. A package, comprising:

  • an electro-statically shielded enclosure;

    a processor disposed in the enclosure;

    a communication interface for coupling data between the processor and a processor external to the package with such data passing through the enclosure;

    a power supply for the processor disposed in the enclosure, such power supply being adapted to generate power, for the processor disposed in the enclosure, in response to input energy; and

    , an energy interface for coupling the input energy from a source external to the enclosure through a dielectric transmission media passing through the enclosure.

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