Testing memory modules on a solder-side adaptor board attached to a PC motherboard

• US 6,357,022 B1
• Filed: 10/11/2000
• Issued: 03/12/2002
• Est. Priority Date: 04/08/1998
• Status: Expired due to Term

• Current Assignee: Kingston Technology Company (Kingston Technology Corporation)
• Original Assignee: Kingston Technology Company (Kingston Technology Corporation)
• Inventors: Le, Ngoc, Chou, Benjamin E., Nguyen, Thang
• Primary Examiner(s): LE, DIEU MINH T
• Application Number:
  US09/686,044
• Time in Patent Office: 517 Days
• Field of Search: 714/42, 714/29, 714/54, 714/718, 714/767, 711/115, 711/170, 711/173, 710/102, 710/103
• US Class Current: 714/42
• CPC Class Codes: G01R 31/01 Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station testing of cables continuously passing the testing apparatus G01R31/59; testing dielectric strength or breakdown voltage G01R31/12
• CPC Class Codes: G01R 31/31713 Input or output interfaces for test, e.g. test pins, buffers for scan test G01R31/318572
• CPC Class Codes: G01R 31/31905 Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
• CPC Class Codes: G11C 2029/5004 Voltage
• CPC Class Codes: G11C 29/028 with adaption or trimming of parameters
• CPC Class Codes: G11C 29/56 External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
• CPC Class Codes: G11C 29/56016 Apparatus features
• CPC Class Codes: G11C 5/04 Supports for storage elements , e.g. memory modules; Mounting or fixing of storage elements on such supports
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence

Abstract

Memory modules such as SIMMs and DIMMs are automatically tested by a target-system motherboard such as a PC motherboard. An automated SIMM/DIMM handler is connected to a handler adaptor board that is mounted to the back or solder-side of the PC motherboard. The relatively flat surface of the solder-side of the PC motherboard allows close mounting of the handler. One or more of the SIMM sockets on the motherboard is removed to provide mounting holes for the handler adaptor board. The handler adaptor board provides electrical connection from the module-under-test (MUT) in the handler to the removed SIMM socket on the PC motherboard. The handler adaptor board provides a slight spacing or offset from the solder-side surface of the PC motherboard'"'"'s substrate, allowing the handler to be plugged directly into tester-connectors on the handler adaptor board. Since the offset of the adaptor board is slight, the length of electrical connections to the handler is short, minimizing the load on the PC'"'"'s memory bus. A handler controller card that controls the handler is plugged into the PCI or ISA bus on the PC motherboard. Power to the handler adaptor board is cut when a new module is moved into position in the handler, reducing memory-bus upset.

Claims

1. An automated test apparatus for testing high-speed memory modules, the automated test apparatus comprising:

a target-system motherboard having components including a microprocessor, memory, and expansion-bus connectors mounted on a component-side of the target-system motherboard, the memory including memory modules inserted into memory-module sockets mounted on the component-side;

a test adaptor board having adaptor pins protruding out a first side and having a test socket mounted on a second side opposite the first side,

wherein at least one of the memory-module sockets has been removed;

wherein the adaptor pins connect to the target-system motherboard on a solder-side of the target-system motherboard immediately opposite a location where the at least one memory-module sockets have been removed; and

wherein the test socket on the test adaptor board is for connecting signals from a memory module under test to a memory bus on the target-system motherboard,

whereby the memory module under test is electrically connected to the target-system motherboard.

2. The automated test apparatus of claim 1 wherein the memory-module sockets include mounting pins, the mounting pins fitting through holes in the target-system motherboard, the memory-module sockets mechanically and electrically connected to the target-system motherboard by solder on the mounting pins and holes on the solder-side, and

wherein the adaptor pins fit through the holes for the at least one memory-module socket that was removed, the adaptor pins soldered to the solder-side of the target-system motherboard.

3. The automated test apparatus of claim 1 wherein the memory-module sockets include mounting pins, the mounting pins fitting through holes in the target-system motherboard, the memory-module sockets mechanically and electrically connected to the target-system motherboard by solder on the mounting pins and holes on the solder-side;

and further comprising;

female pins on the target-system motherboard, the female pins mounted through the holes for the at least one memory-module socket that was removed, the female pins soldered to the solder-side of the target-system motherboard,

wherein the adaptor pins fit into the female pins when the test adaptor board is connected to the target-system motherboard.

4. The automated test apparatus of claim 1 wherein the target-system motherboard is a personal computer PC motherboard and wherein the expansion-bus connectors are either ISA-bus connectors or PCI-bus connectors.

5. The automated test apparatus of claim 1 wherein the memory modules are single-inline memory module SIMMs or dual-inline memory module DIMMs or RAMBUS modules.

6. The automated test apparatus of claim 1 wherein the test adaptor board is located on an opposite side of the motherboard from the memory-module socket that was removed.

7. The automated test apparatus of claim 6 wherein the motherboard is directly connected to the test adaptor board by plugging connectors together without using a flexible cable.

8. A memory-module tester comprising:

a motherboard having a microprocessor, expansion-bus sockets, and memory-module sockets mounted on a component side, the motherboard having holes for a missing memory-module socket, the holes between the component side and a solder side opposite the component side;

a test adaptor board having adaptor pins on one side and a test connector on an opposite side, the test adaptor board electrically connecting adaptor pins to the test connector;

wherein the adaptor pins connect the test adaptor board to the motherboard using the holes for the missing memory-module socket;

wherein the test connector connects the test adaptor board to a memory module under test; and

a test program executing on the microprocessor on the motherboard, the test program for writing and reading back test patterns to the memory module under test

whereby memory modules are automatically tested by the motherboard.