Integrated circuit inductors
First Claim
1. An inductor comprising:
- a semiconductor substrate having a crystalline structure and a plurality of perforations; and
a highly conductive metal path woven through the plurality of perforations of the semiconductor substrate, and at least partially diffused into the crystalline structure.
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Accused Products
Abstract
The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.
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Citations
24 Claims
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1. An inductor comprising:
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a semiconductor substrate having a crystalline structure and a plurality of perforations; and
a highly conductive metal path woven through the plurality of perforations of the semiconductor substrate, and at least partially diffused into the crystalline structure. - View Dependent Claims (2, 3, 4, 5)
an insulating material partially filling each of the plurality of perforations.
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5. The inductor of claim 4, wherein the insulating material is polyimide.
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6. An inductor comprising:
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a perforated substrate; and
a conductive material interwoven with the perforated substrate and at least partially diffused into the perforated substrate. - View Dependent Claims (7, 8)
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9. An inductor comprising:
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a silicon substrate having a crystalline structure and a plurality of perforations; and
a conductive metal path woven through the plurality of perforations, and the conductive metal path at least partially diffused into the crystalline structure. - View Dependent Claims (10, 11)
an insulating material partially filling each of the plurality of perforations.
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12. An inductor comprising:
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a gallium arsenide substrate having a plurality of perforations; and
a conductive metal path woven through the plurality of perforations. - View Dependent Claims (13, 14)
an insulating material substantially lining each of the plurality of perforations.
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14. The inductor of claim 13, wherein the insulating material comprises polyimide.
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15. An inductor comprising:
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a silicon carbide substrate having a plurality of perforations; and
a conductive metal path woven through the plurality of perforations. - View Dependent Claims (16, 17)
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18. An inductor comprising:
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a perforated substrate; and
gold interwoven with the perforated substrate and at least partially diffused into the perforated substrate. - View Dependent Claims (19, 20)
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21. An inductor comprising:
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a perforated substrate including a plurality of perforations; and
copper filling the plurality of perforations and at least partially diffused into the perforated substrate. - View Dependent Claims (22, 23, 24)
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Specification