×

Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes

  • US 6,357,594 B1
  • Filed: 06/30/1998
  • Issued: 03/19/2002
  • Est. Priority Date: 06/30/1998
  • Status: Expired due to Fees
First Claim
Patent Images

1. A carrier tape system for receiving, retaining and quickly releasing small components, the system comprising:

  • a. a longitudinally elongated punched carrier tape frame having a front side, a back side and a plurality of spaced apart aperture cavities for respectively accommodating said small components;

    b. a pair of elongated pressure sensitive adhesive tapes, each tape having a longitudinal linear side portion, a longitudinal sinusoidal shaped side portion and an adhesive surface;

    c. said pair of pressure sensitive adhesive tapes adjustably located and longitudinally aligned in parallel with a longitudinal gap therebetween and having said each adhesive surface facing into said each aperture cavity of said carrier tape frame; and

    d. said linear side portion of said each pressure sensitive adhesive tape affixed to said back side of said carrier tape frame and having said sinusoidal shaped side portion of said each pressure sensitive adhesive tape overlapping into said each aperture cavity for minimizing the adhesion to a back side of said each small component to be retained in said each aperture cavity of said carrier tape frame and for facilitating the removal of said each small component within said each aperture cavity;

    e. whereby said small components are respectively retained within said plurality of aperture cavities by said sinusoidal shaped side portion of said each pressure sensitive adhesive tape which also facilitates the removal of said small components from said aperture cavities.

View all claims
  • 6 Assignments
Timeline View
Assignment View
    ×
    ×