Identification card utilizing an integrated circuit

• US 6,357,664 B1
• Filed: 05/24/2001
• Issued: 03/19/2002
• Est. Priority Date: 05/24/2001
• Status: Expired due to Fees

• Current Assignee: Identicard Wisconsin Corporation
• Original Assignee: IDenticard Systems, Inc. (Brady Corporation)
• Inventors: Zercher, John Michael
• Primary Examiner(s): Pitts, Harold I.
• Application Number:
  US09/864,699
• Time in Patent Office: 299 Days
• Field of Search: 235/488, 235/487, 235/492
• US Class Current: 235/488
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07716 the record carrier comprising means for customization, e.g. being arranged for personalization in batch
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00

Abstract

The present invention provides an improved identification card having an integrated circuit. The identification card has a first outer layer having printed material on an outer surface and a second outer layer positioned between a laminated sleeve. The second outer layer has an integrated circuit and an antenna on an inner surface and printed material on an outer surface. The first outer layer may be optionally printed at a customer location and inserted into a subassembly having the second outer layer and an inner blocking layer positioned in the sleeve prior to final lamination.

Claims

1. An identification card comprising:

a first outer layer being formed of a substrate having printed material on an outer surface;

a second outer layer being formed of a substrate having an antenna printed on an inner surface utilizing conductive ink, and an integrated circuit being electrically connected to the antenna also on the inner surface; and

an outer sleeve surrounding the outer layers and secured thereon by a lamination process.

2. The identification card of claim 1 further comprising an inner blocking layer positioned between the first and second outer layers.

3. The identification card of claim 2 wherein the first outer layer and the inner layer are positioned into the outer sleeve to form a subassembly prior to the lamination process.

4. The identification card of claim 3 wherein the inner layer is removed and replaced by the second outer layer prior to the lamination process.

5. The identification card of claim 1 wherein the first outer layer substrate is formed from TESLIN.

6. The identification card of claim 1 wherein the second outer layer substrate is formed from TESLIN.

7. An identification card subassembly comprising:

an inner layer formed of TESLIN material having an antenna printed on an inner surface utilizing conductive ink and an integrated circuit chip also on the inner surface in electrical communication with the antenna;

an inner blocking layer positioned over the inner surface of the first layer; and

an outer sleeve having a hinged end for receiving the layers and for securing them temporarily during shipment.

8. A method of making an identification card subassembly comprising the steps of:

supplying a substrate to an antenna print station;

printing an antenna on an inner surface of the substrate;

applying an integrated circuit chip to the inner surface, the integrated circuit chip being in electrical contact with the antenna;

applying an inner blocking layer over the inner surface of the substrate; and

inserting the substrate and inner blocking layer into a lamination sleeve.

9. The method of claim 8 wherein the substrate is supplied to the antenna print station in a sheet.

10. The method of claim 9 wherein the substrate sheets are trimmed after application of the integrated circuit chip to the antennas.

11. The method of claim 8 further comprising the steps of removing the inner blocking layer and replacing the inner blocking layer with a second outer layer.

12. The method of claim 11 wherein the subassembly is laminated.