Method for producing semiconductor device, method for producing semiconductor laser device, and method for producing quantum wire structure
First Claim
1. A method for producing a semiconductor device comprising:
- growing a compound semiconductor cap layer including no aluminum on a compound semiconductor layer including aluminum;
selectively forming a mask pattern comprising an insulating film on a part of the compound semiconductor cap layer;
immersing the compound semiconductor cap layer having the insulating mask pattern in an ammonium sulfide solution;
selectively etching the compound semiconductor cap layer using a chlorine-containing gas in a reaction chamber to form a groove; and
filling the groove with a compound semiconductor layer grown in the reaction chamber by MOCVD.
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Abstract
In a method for producing a semiconductor device, a compound semiconductor cap layer including no aluminum is grown on a compound semiconductor layer including aluminum, a mask pattern insulating film is formed on a part of the compound semiconductor cap layer, the compound semiconductor wafer with the insulating mask pattern is immersed in an ammonium sulfide solution, the compound semiconductor wafer is selectively etched away using a chlorine containing gas in a reaction chamber, and a groove formed in the etching process is filled with a compound semiconductor layer grown in the reaction chamber by MOCVD. Therefore, a regrowth interface on which no impurity is segregated is attained, improving the quality of the regrown crystal layer.
41 Citations
18 Claims
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1. A method for producing a semiconductor device comprising:
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growing a compound semiconductor cap layer including no aluminum on a compound semiconductor layer including aluminum;
selectively forming a mask pattern comprising an insulating film on a part of the compound semiconductor cap layer;
immersing the compound semiconductor cap layer having the insulating mask pattern in an ammonium sulfide solution;
selectively etching the compound semiconductor cap layer using a chlorine-containing gas in a reaction chamber to form a groove; and
filling the groove with a compound semiconductor layer grown in the reaction chamber by MOCVD. - View Dependent Claims (3)
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2. A method for producing a semiconductor device comprising:
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growing a compound semiconductor cap layer including no aluminum on a compound semiconductor layer including aluminum;
selectively forming a mask pattern comprising an insulating film on a part of the compound semiconductor cap layer;
removing an oxide film the compound semiconductor cap layer in a reaction chamber using one of a hydrogen plasma and exposure to ultraviolet light;
selectively etching the compound semiconductor cap layer using a chlorine-containing gas in a reaction chamber to form a groove; and
filling the groove with a compound semiconductor layer grown in the reaction chamber by MOCVD. - View Dependent Claims (4)
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5. A method for producing a semiconductor device including dry etching an AlxGa1−
- xAs (0≦
x≦
1) layer using a HCl gas, arsine gas, and hydrogen supplied at the same time with a partial pressure of the arsine gas in a range of from 8×
10−
3 Torr to 0.08 Torr and a flow ratio of the arsine gas to the HCl gas in a range of from 0.25 to 2.5.
- xAs (0≦
-
6. A method for fabricating a semiconductor laser comprising:
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growing a plurality of AlxGa1−
xAs (0≦
x≦
1) layers on a {110} surface of a semiconductor substrate to form a laser diode structure;
forming an etching mask comprising an insulating film on a part of the laser diode structure; and
forming an oscillation facet of the laser diode with a {111}B surface perpendicular to the {110} surface of the semiconductor substrate by etching with HCl, arsine, and hydrogen supplied at the same time with a partial pressure of the arsine gas in a range from 8×
10−
3 Torr to 0.08 Torr and a flow ratio of the arsine gas to the HCl gas in a range of from 0.25 to 2.5.
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7. A method for producing a semiconductor device including etching a III-V compound semiconductor layer with a chlorine-containing gas, the etching process comprising:
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placing a III-V compound semiconductor layer in a reactor;
a first step of introducing into the reactor respective pulses of a Group V gas and a chlorine-containing gas so that the duration of a pulse of the chlorine-containing gas is shorter than the duration of a pulse of the Group V gas, the chlorine-containing gas being introduced while the Group V gas in being introduced. to etch the III-V compound semiconductor layer;
a second step of, between pulses of the Group V gas, purging the reactor with hydrogen; and
alternatingly repeating the first and second steps to etch the III-V compound semiconductor layer. - View Dependent Claims (8)
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9. A method for producing a semiconductor device including etching a III-V compound semiconductor with a chlorine-containing gas, the etching process comprising:
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preparing an apparatus having a rotatable discord susceptor with a surface;
partitioning the surface of the susceptor into at least first and second regions using flows of hydrogen;
filling the first region with a gas mixture comprising a Group V hydride gas, a chlorine-containing gas, and hydrogen;
filling the second region with hydrogen;
placing a III-V compound semiconductor layer on the susceptor;
first step of rotating the susceptor to place the III-V compound semiconductor layer in the first region filled with the gas mixture comprising the Group V hydride gas, the chlorine-containing gas, and hydrogen, thereby etching the III-V compound semiconductor layer;
a second step of rotating the susceptor to place the III-V compound semiconductor layer in the second region filled with hydrogen; and
alternatingly repeating the first and second steps to etch the III-V compound semiconductor layer. - View Dependent Claims (10)
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11. A method for producing a quantum wire structure comprising:
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forming a first semiconductor layer having an energy band gap on a semiconductor substrate with a {100} surface orientation;
forming an etching mask on the first semiconductor layer, the etching mask having a stripe-shaped opening extending along an <
011>
direction of the substrate;
etching the first semiconductor layer using HCl gas, arsine gas, and hydrogen introduced into a reactor at the same time with a partial pressure of the arsine gas in a range of from 8×
10−
3 Torr to 0.08 Torr and a flow ratio of the arsine gas to the HCl gas in a range of from 0.25 to 2.5, thereby forming a stripe-shaped V groove with side surfaces that are {111}B planes;
forming a second semiconductor layer having an energy band gap smaller than the energy band gap of the first semiconductor layer in the vicinity of the bottom of the V groove; and
forming a third semiconductor layer having an energy band gap larger than the energy band gap of the second semiconductor layer on the second semiconductor layer.
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12. A method for producing quantum wire structures comprising:
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growing a first high-resistivity layer comprising a first semiconductor having an electron affinity on a semiconductor substrate;
successively growing a second high-resistivity layer comprising a second semiconductor having an electron affinity smaller than the electron affinity of the first semiconductor and a third high-resistivity layer comprising the first semiconductor;
forming alternating projections and recesses in the second high-resistivity layer, so that the cross-section of each recess is an inverted triangles by gas etching using HCl gas, arsine gas, and hydrogen introduced into a reactor at the same time with a partial pressure of the arsine gas in a range of from 8×
10−
3 Torr to 0.08 Torr and a flow ratio of the arsine gas to the HCl gas in a range of from 0.25 to 2.5; and
successively growing a first n type layer comprising the second semiconductor and a second n type layer comprising the first semiconductor.
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13. A method for fabricating a semiconductor laser comprising:
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successively growing at least a first conductivity type AlyGa1−
yAs cladding layer, an AlzGa1−
zAs (0≦
z<
y) active layer, and a second conductivity type AlwGa1−
wAs (z<
w) cladding layer on a first conductivity type GaAs substrate with a {100} surface orientation;
forming a stripe-shaped insulating film pattern extending along a <
011>
direction on a part of the semiconductor substrate after the growing process;
removing an oxide film from the grown semiconductor layers using an ammonium sulfide solution;
using the insulating film pattern as a mask, selectively etching the grown semiconductor layers with a chlorine-containing gas, thereby forming a stripe-shaped ridge structure with side walls that are {111}B planes; and
growing a current blocking layer on opposite sides of the ridge structure. - View Dependent Claims (14, 15)
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16. A method for fabricating a semiconductor laser comprising:
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successively growing at least a first conductivity type AlyGa1−
yAs cladding layer, an AlzGa1−
zAs (0≦
z<
y) active layer, and a second conductivity type AlwGa1−
wAs (z<
w) cladding layer on a first conductivity type GaAs substrate with a {100} surface orientation;
forming a stripe-shaped insulating film pattern extending along a <
011>
direction on a part of the semiconductor substrate after the growing process;
removing an oxide film from the grown layers by cleaning in a reactor using one of a hydrogen plasma and ultraviolet light;
using the insulating film pattern as a mask, selectively etching the grown semiconductor layers with a chlorine-containing gas, thereby forming a stripe-shaped ridge structure with side walls that are {111}B planes; and
growing a current blocking layer on opposite sides of the ridge structure. - View Dependent Claims (17, 18)
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Specification