Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof

• US 6,359,233 B1
• Filed: 10/26/1999
• Issued: 03/19/2002
• Est. Priority Date: 10/26/1999
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Lane, Michael J., Joy, Steven C.
• Primary Examiner(s): Paladini, Albert W.
• Assistant Examiner(s): PATEL, ISHWARBHAI B
• Application Number:
  US09/426,758
• Time in Patent Office: 875 Days
• Field of Search: 174/255, 174/261, 174/250, 174/256, 174/52.4, 174/253, 361/792, 361/760, 361/736, 361/737, 361/739, 361/774, 361/779, 361/803, 361/784, 361/790, 361/748, 361/767, 361/762, 428/209, 428/210, 428/901, 439/55, 298/30, 298/31, 298/42, 298/46, 298/47, 298/29, 298/25
• US Class Current: 174/255
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09154 Bevelled, chamferred or tapered edge
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/242 characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
• CPC Class Codes: Y10S 428/901 Printed circuit

Abstract

Disclosed is a printed circuit board multipack, having a plurality of printed circuit boards (for example, a plurality of PCI compliant cards) provided using a common web of substrate material for a printed circuit board. Also disclosed is printed circuit board multipack structure, from which the multipack is formed, and individual printed circuit boards formed from the multipack, and methods of manufacture of each. Printed circuit board structures of the multipack have an internal edge, spaced from the periphery of the web, that is bevelled, and have conductive fingers, e.g., with an electrodeposited gold uppermost layer, extending to the internal edge. The multipack structure includes a common bus bar running adjacent the inner boundary of the printed circuit board structures, and conductive extensions from a conductive base layer of the conductive fingers to the bus bar. Due to the conductive extensions and common bus bar, electrode-position of the gold for the conductive fingers can easily be performed. In forming the multipack from the multipack structure, the structure is bevelled at the inner boundary, using a circular bevelling blade, to both provide the bevelled inner edge and remove the common bus bar and conductive extensions. The bevelling thins the web at the inner edge. The printed circuit boards are separated by snapping an individual printed circuit board apart from a remainder of the web, at the thinned portion of the web.

Claims

1. A printed circuit board multipack, comprising:

a web of material of a printed circuit board substrate, the web having a periphery; and

at least a first printed circuit board structure, including a first region of said web, the first printed circuit board structure having an internal edge spaced from the periphery of the web, wherein the first printed circuit board structure includes electrically conductive fingers which extend in a direction toward said internal edge and terminate at said internal edge.

2. The printed circuit board multipack according to claim 1, further comprising at least a second printed circuit board structure, including a second region of the web, the second printed circuit board structure having an internal edge spaced from the periphery of the web, wherein the second printed circuit board structure includes electrically conductive fingers which extend in a direction toward the internal edge of the second printed circuit board structure and terminate at said internal edge.

3. The printed circuit board multipack according to claim 2, wherein the internal edge of the first printed circuit board structure is the edge of the first printed circuit board structure closest to the internal edge of the second printed circuit board structure, the internal edge of the first printed circuit board structure being spaced from the internal edge of the second printed circuit board structure by a spacing region;

wherein the web has a first thickness, at the first and second regions; and

wherein at said spacing region, a thickness of the web is less than said first thickness.

4. The printed circuit board multipack according to claim 3, wherein the thickness of the web at the spacing region decreases from the internal edges of each of the first and second printed circuit board structures to a midpoint between the internal edges of the first and second printed circuit board structures.

5. The printed circuit board multipack according to claim 3, wherein the first and second printed circuit board structures are first and second peripheral component interconnect compliant card structures, respectively.

6. The printed circuit board multipack according to claim 5, wherein the thickness of the web at the spacing region is less than the thickness of the web at the first and second regions, so as to form a bevel at the internal edges of each of the first and second peripheral component interconnect compliant card structures.

7. The printed circuit board multipack according to claim 1, wherein the electrically conductive fingers include a gold layer.

8. The printed circuit board multipack according to claim 7, wherein the electrically conductive fingers include a laminate of a copper layer adjacent the web, a gold outer layer, and a nickel layer between the gold outer layer and the copper layer.

9. The printed circuit board multipack according to claim 1, wherein the web is a unitary member, and wherein the printed circuit board multipack includes a plurality of printed circuit board structures, each respective printed circuit board structure, of the plurality of printed circuit board structures, having conductive fingers which extend in a direction toward an internal edge of the respective printed circuit board structure and terminate at the internal edge of the respective printed circuit board structure, the internal edge of each respective printed circuit board structure being spaced from the periphery of the web.

10. The printed circuit board multipack according to claim 9, wherein the web extends in a height direction and a length direction;

and wherein the plurality of printed circuit board structures are provided in at least three rows, each row extending in the length direction, and the rows being spaced from each other in the height direction.

11. The printed circuit board multipack according to claim 1, wherein the first printed circuit board structure is a peripheral component interconnect compliant card structure, having the internal edge.

12. The printed circuit board multipack according to claim 11, wherein the internal edge of the peripheral component interconnect compliant card structure is bevelled.

13. The printed circuit board multipack according to claim 1, wherein said material of the web is a reinforced plastic material.

14. The printed circuit board multipack according to claim 1, wherein the first printed circuit board structure additionally includes wiring provided on the first region of the web.

15. The printed circuit board multipack according to claim 1, wherein all of the electrically conductive fingers of the first printed circuit board structure terminate at said internal edge.

16. A printed circuit board multipack structure, comprising:

a web of material of a printed circuit board substrate, the web having a periphery;

at least a first printed circuit board structure, which first printed circuit board structure includes a first region of the web;

a spacing region of the printed circuit board substrate adjacent the first region; and

an electrically conductive bus bar extending on the spacing region,

wherein a first boundary is formed between the first region and the spacing region, the first boundary being spaced from the periphery of the web, and

wherein the first printed circuit board structure includes electrically conductive fingers, extending from the first region to the first boundary and having electrically conductive extensions which are electrically connected from the electrically conductive fingers to the bus bar.

17. The printed circuit board multipack structure according to claim 16, further comprising a second printed circuit board structure, which second printed circuit board structure includes a second region of the web, the second region forming a second boundary with the spacing region, the second boundary being spaced from the periphery of the web, the second boundary being spaced from the first boundary by the spacing region, the second printed circuit board structure having electrically conductive fingers extending to the second boundary, the electrically conductive fingers of the second printed circuit board structure having electrically conductive extensions which extend from the electrically conductive fingers of the second printed circuit board structure to be in electrical contact with said bus bar.

18. The printed circuit board multipack structure according to claim 16, wherein the electrically conductive fingers are a laminate of a copper layer adjacent the web, a gold outer layer, and a nickel layer between the copper layer and the gold outer layer, and wherein the electrically conductive extensions and the bus bar are of copper.

19. The printed circuit board multipack structure according to claim 18, wherein the copper layer, the electrically conductive extensions and the bus bar are integral and made from a same copper layer.

20. The printed circuit board multipack structure according to claim 16, wherein said material of the web is a reinforced plastic material.

21. The printed circuit board multipack structure according to claim 16, wherein the first printed circuit board structure additionally includes wiring provided on the first region of the web.

22. The printed circuit board multipack structure according to claim 16, wherein the bus bar, electrically conductive fingers, and electrically conductive extensions are a unitary structure.

23. The printed circuit board multipack according to claim 16, wherein all of the electrically conductive fingers of the first printed circuit board structure extend from the first region to the first boundary.