Method for marking packaged integrated circuits

• US 6,359,248 B1
• Filed: 08/02/1999
• Issued: 03/19/2002
• Est. Priority Date: 08/02/1999
• Status: Expired due to Term

• Current Assignee: Xilinx, Inc. (Advanced Micro Devices, Inc.)
• Original Assignee: Xilinx, Inc. (Advanced Micro Devices, Inc.)
• Inventors: Mardi, Mohsen H.
• Primary Examiner(s): Nguyen, Tuan N.
• Application Number:
  US09/366,427
• Time in Patent Office: 960 Days
• Field of Search: 209/572, 209/573, 324/158.1, 257/730, 257/773
• US Class Current: 209/573
• CPC Class Codes: B07C 5/3412 according to a code applied to the object which indicates a property of the object, e.g. quality class, contents or incorrect indication sorting according to size measured by light-responsive means B07C5/10; sorting according to optical properties B07C5/342; for packages B65D79/02; for information carriers G06K7/00
• CPC Class Codes: H01L 2223/54406 comprising alphanumeric information
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15162 Top view

Abstract

The invention provides methods for marking packaged ICs. In a first embodiment, only the minimum performance information is first marked on the package, regardless of the actual performance of the IC. This method avoids a second marking step for all ICs sold as low-performance ICs. In another embodiment, only one inking and curing step is required for all ICs. According to this method, all specified performances are marked on the packaged IC at the first marking. The IC is then tested to determine the actual performance, and all performance markings not applicable to the IC are removed, preferably with a laser. Alternatively, all applicable performance markings are identified (e.g., underlined or enclosed with a laser marking).

Claims

1. A method for marking a packaged IC having an actual performance, the method comprising:

marking a minimum performance on the packaged IC;

testing the packaged IC to determine the actual performance; and

if the actual performance exceeds the minimum performance, marking the actual performance on the packaged IC.

2. The method of claim 1, further comprising:

receiving an order for a packaged IC with a desired performance; and

if the desired performance exceeds the minimum performance but does not exceed the actual performance, supplying the packaged IC in response to the order.

3. The method of claim 1, wherein the step of marking the actual performance comprises marking all applicable performances.

4. The method of claim 1, further comprising marking product tracking information on the packaged IC.

5. The method of claim 1, wherein the minimum performance and actual performance comprise speed grades.