Electrical contact having surface coating layer with irregular surface due to hard particles dispersed in the surface coating layer

• US 6,360,437 B1
• Filed: 03/15/2000
• Issued: 03/26/2002
• Est. Priority Date: 03/15/2000
• Status: Expired due to Term

• Current Assignee: Japan Aviation Electronics Industry Limited
• Original Assignee: Japan Aviation Electronics Industry Limited
• Inventors: Fukumoto, Tadashi, Itoh, Shigenori
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US09/527,056
• Time in Patent Office: 741 Days
• Field of Search: 298/25, 298/84, 298/74, 298/78, 428/605, 428/608, 427/123
• US Class Current: 29/874
• CPC Class Codes: C25D 15/02 Combined electrolytic and electrophoretic processes with charged materials
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/605 Surface topography of the layers, e.g. rough, dendritic or nodular layers
• CPC Class Codes: H01R 13/03 characterised by the material, e.g. plating, or coating materials
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49211 of fused material
• CPC Class Codes: Y10T 428/12424 Mass of only fibers
• CPC Class Codes: Y10T 428/12444 Embodying fibers interengaged or between layers [e.g., paper, etc.]

Abstract

In an electrical contact having a contacting portion to be brought into contact with and electrically connected with a terminal member, the contact comprises a metallic body having a body surface and a metallic plated layer formed on the body surface of at least the contacting portion. The metallic plated layer has hard conductive particles dispersed in the layer in order to enable to remove contamination from a surface of the terminal member when the contacting surface is brought into contact with the terminal member. The surface layer has an irregular surface due to presence of the hard conductive particles dispersed therein. When the contacting portion is brought into contact with the terminal member, the contamination is removed by irregular surface.

Claims

1. A method for producing an electrical contact wherein said surface coating layer is a plated metal layer having hard coated particles said method comprising the steps of:

preparing a metal blank by blanking a sheet of elastic metal plate, said metal blank comprising a carrier frame and a plurality of contact blanks extending from the carrier frame to their extending free ends in parallel with each other;

preparing an electroplating bath containing a composite plating solution comprising an electroplating solution of a first metallic acid and hard conductive particles suspended therein;

subjecting said blank to an electroplating process by use of said electroplating bath by holding the carrier above the composite plating solution so that the contact blanks are at least partially dipped in the composite plating solution, to thereby form a first plated layer of the first metal on a surface of a portion of each of the contact blanks dipped in the composite plating solution and, simultaneously, deposit said the hard conductive particles on said surface due to electro-deposition so that the hard conductive particles are dispersed in the first plated layer, said first plated layer has an outer surface with irregularity due to presence of the hard conductive particles dispersed therein; and

separating each of said contact blanks from said carrier frame, after taking out and drying said blank from said electroplating bath, to provide said contact.

2. The method as claimed in claim 1, which further comprises forming each of said contact blanks in a desired shape by bending and/or curving process, before and/or after said cutting.

3. The method as claimed in claim 1, which further comprises subjecting said blank, before cutting each of contact blanks from the carrier frame, to second and/or third plating process to form second and/or third plated layer on the first plated layer.

4. The method as claimed in claim 3, wherein said second plated layer is of the first metal and is directly formed on the first plated layer by use of a second electroplating bath containing the electroplating solution of the first metal acid without the hard conductive particles.

5. The method as claimed in claim 3, wherein said third plated layer is of a second metal different from the first metal and is directly formed on the first plated layer by use of a third electroplating bath containing the electroplating solution of the third metal acid without the hard conductive particles.

6. The method as claimed in claim 3, wherein said second plated layer is of the first metal and is directly formed on the first plated layer by use of a second electroplating bath containing the electroplating solution of the first metal acid without the hard conductive particles, and wherein said third plated layer is of a second metal different from the first metal and is directly formed on the second plated layer by use of a third electroplating bath containing the electroplating solution of the third metal acid without the hard conductive particles.

7. The method of claim 1 and further steps comprising

forming a conductive surface coating layer formed on a body surface of at least the contacting portion of said contact blanks,

said conductive surface coating layer having a predetermined thickness, and said hard conductive particles have an average particle size approximately the predetermined thickness.

8. The method of claim 1 and the further step of forming said elastic metal plate from a metal selected from a group consisting of phosphor bronze and other Cu-base alloys.

9. The method of claim 1 and the further step of selecting said hard conductive particles from a group consisting of TiN, WC, Ni, TiO₂ and Cr₂O₃.

10. The method of claim 1 and the further steps of forming a metal layer comprising said first plated layer containing said conductive hard particles dispersed therein formed on a body surface, and forming a second plated layer on the first plated layer.

11. The method as claimed in claim 10 comprising forming said first plated layer by a primary plated sub-layer made of a first metal and containing the conductive hard particles dispersed therein, and forming a secondary plated sub-layer made of the first metal and formed on the primary plated sub-layer, and forming said second plated layer of a second metal which is different from the first metal and is formed on the secondary plated sub-layer.

12. The method as claimed in claim 10, wherein said first metal is selected form a group consisting of Ni, Cu, and Sn.

13. The method as claimed in claim 11, wherein said second metal is one selected from a group consisting of Au, Au-alloy, Pd, Pd—

Ni alloy, Sn and Sn—

Pb alloy.