Electronic components cooling apparatus

• US 6,360,813 B1
• Filed: 05/19/2000
• Issued: 03/26/2002
• Est. Priority Date: 05/20/1999
• Status: Expired due to Term

• Current Assignee: Mizutani Electric Ind. Co., Ltd.
• Original Assignee: TS Heatronics Co., Ltd.
• Inventors: Katoh, Takahiro, Amako, Kiyoo
• Primary Examiner(s): Lazarus, Ira S.
• Assistant Examiner(s): MCKINNON, TERRELL L
• Application Number:
  US09/574,484
• Time in Patent Office: 676 Days
• Field of Search: 165/80.4, 165/104.26, 165/104.33, 361/699, 361/700, 174/15.1, 174/15.2
• US Class Current: 165/104.33
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: H05K 7/20672 within sub-racks for removing heat from electronic boards

Abstract

An electronic component cooling apparatus includes an air-cooled or water-cooled heat radiating portion and a meandering capillary tube heat pipe which carry out heat transfer between a board having electronic components mounted thereon and the heat radiating portion. The heat radiating portion comprises a plate fin type radiator 21 with an outer-shape of a substantially flat plate. The meandering capillary tube heat pipe is a plate type heat pipe 13 with an outer-shape of a substantially flat plate. The meandering capillary 13c is connected along a surface of the heat radiating portion. Since the meandering capillary tube heat pipe has a very large heat transfer capacity and is able to transfer heat over a long distance with low thermal resistance, it is possible to separate the board apart from the heat radiating portion. Accordingly, flexibility in arrangement of the electronic components or the heat radiating portion is so improved that various shaped apparatus can be designed and manufactured.

Claims

1. A cooling apparatus for cooling a plurality of boards having electronic components mounted thereon, the boards being arranged in a row, wherein the apparatus comprises:

a plate fin type air-cooled or liquid-cooled radiator; and

a plate type meandering capillary tube heat pipe that transfers heat between end faces of the boards and the radiator;

wherein the plate type meandering capillary tube heat pipe comprises a first part that is a sidewall of the electronic component cooling apparatus, and a second part that is bent at an end of the sidewall and that is connected along the radiator; and

wherein;

(i) the plate type meandering capillary tube heat pipe comprises a capillary that is sealed off from the outside;

(ii) one part of the capillary acts as a heat radiating portion and another part of the capillary acts as a heat receiving portion;

(iii) the heat receiving portion and the heat radiating portion are alternately arranged, and the capillary meanders between the heat receiving portion and the heat radiating portion;

(iv) a two-phase condensable working fluid is sealed inside the capillary; and

(v) the capillary has a diameter less than a maximum diameter which allows the two-phase condensable working fluid to circulate and move while being sealed inside the capillary.

2. The cooling apparatus according to claim 1, further comprising brackets mounted between the end faces of the boards and the plate type meandering capillary tube heat pipe for securing the boards to the plate type meandering capillary tube heat pipe.

3. The cooling apparatus according to claim 2, wherein the brackets are secured to the plate type meandering capillary tube heat pipe by at least one of a screw and solder.

4. The cooling apparatus according to claim 2, wherein the brackets are secured to the plate type meandering capillary tube heat pipe by both a screw and solder.

5. The cooling apparatus according to claim 1, wherein a thermal resistance at a connection portion between the radiator and the plate type meandering capillary tube heat pipe is between about 0.001°

C./W and about 3.00°

C./W, and a heat flux is between about 0.01 W/cm² and about 30 W/cm².

6. The cooling apparatus according to claim 1, wherein a thermal resistance at a contacting surface between the end faces of the boards and the plate type meandering capillary tube heat pipe is between about 0.001°

C./W and about 3.00°

C./W, and a heat flux is between about 0.01 W/cm² and about 30 W/cm².

7. The cooling apparatus according to claim 1, wherein:

the plate type meandering capillary tube heat pipe is secured to the radiator by a screw;

a threaded screw hole is formed in a lock insert which is mounted in the radiator.

8. A cooling apparatus for an electronic component mounted on a board, comprising:

an air-cooled or liquid-cooled heat radiator; and

a meandering capillary tube heat pipe arranged to transfer heat between the board and the radiator;

wherein the meandering capillary tube heat pipe is attached to the board along a face surface of the board; and

wherein;

(i) the meandering capillary tube heat pipe comprises a capillary that is sealed off from the outside;

(ii) one part of the capillary acts as a heat radiating portion and another part of the capillary acts as a heat receiving portion;

(iii) the heat receiving portion and the heat radiating portion are alternately arranged, and the capillary meanders between the heat receiving portion and the heat radiating portion;

(iv) a two-phase condensable working fluid is sealed inside the capillary; and

(v) the capillary has a diameter less than a maximum diameter which allows the two-phase condensable working fluid to circulate and move while being sealed inside the capillary.

9. A cooling apparatus for an electronic component or a board on which the electronic component is mounted, the apparatus comprising:

an air-cooled or liquid-cooled heat radiator; and

a meandering capillary tube heat pipe arranged to transfer heat between;

(a) the electronic component or the board, and (b) the heat radiator;

wherein;

(i) the meandering capillary tube heat pipe comprises a capillary that is sealed off from the outside;

(ii) one part of the capillary acts as a heat radiating portion and another part of the capillary acts as a heat receiving portion;

(iii) the heat receiving portion and the heat radiating portion are alternately arranged, and the capillary meanders between the heat receiving portion and the heat radiating portion;

(iv) a two-phase condensable working fluid is sealed inside the capillary; and

(v) the capillary has a diameter less than a maximum diameter which allows the two-phase condensable working fluid to circulate and move while being sealed inside the capillary.

10. The cooling apparatus according to claim 9, wherein:

the heat radiator comprises a set of radiation fins, and has an outer-shape of a substantially flat plate; and

the meandering capillary tube heat pipe is a plate type heat pipe having an outer-shape of a substantially flat plate, and is connected along the heat radiator.

11. The cooling apparatus according to claim 10, wherein a thermal resistance at a connecting portion between the heat radiator and the meandering capillary tube heat pipe is between about 0.001°

C./W and about 3.00°

C./W, and a heat flux is between about 0.01 W/cm² and about 30 W/cm².

12. The cooling apparatus according to claim 10, wherein a thermal resistance at a contacting surface between an end surface of the board on which the electronic component is mounted and the meandering capillary tube heat pipe is between about 0.001°

C./W and about 3.00°

C./W, and a heat flux is between about 0.01 W/cm² and about 30 W/cm².

13. The cooling apparatus according to claim 10, wherein:

the meandering capillary tube heat pipe is secured to the heat radiator by a screw;

a threaded screw hole is formed in a lock insert which is mounted in the heat radiator.