Cooling apparatus for electronic devices

• US 6,360,816 B1
• Filed: 12/23/1999
• Issued: 03/26/2002
• Est. Priority Date: 12/23/1999
• Status: Expired due to Fees

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Wagner, Guy R.
• Primary Examiner(s): FLANIGAN, ALLEN J
• Application Number:
  US09/471,835
• Time in Patent Office: 824 Days
• Field of Search: 165/80.37, 165/185, 165/121, 165/122, 361/697, 361/704
• US Class Current: 165/122
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling system for dissipating heat from a heat source has a heat sink associated with an air moving device. The heat sink has a core member having a first surface adapted to contact at least a portion of the heat source. In addition, the core member has at least one outer peripheral surface. At least one cooling fin device having at least one inner peripheral surface and at least one cooling fin is associated with the core member wherein the inner peripheral surface of the cooling fin device is adjacent the outer peripheral surface of the core member. The air moving device is located opposite the first surface of the core member and forces air past the cooling fins in the general direction of the first surface. During operation of the cooling system, heat transfers from the heat source into the core member via the core member first surface. The core member transfers the heat to the outer peripheral surface where it is then transferred to the cooling fins. The cooling fins, in conjunction with the air of the air moving device, convect the heat to the surrounding atmosphere, thus, cooling the heat source.

Claims

1. A heat sink for removing heat from a heat source, said heat sink comprising:

at least one first surface adapted to contact at least a portion of said heat source;

a core member, wherein said at least one first surface is located on said core member;

at least one outer peripheral surface located on said core member;

at least one cooling fin device having at least one inner peripheral surface and at least one cooling fin associated therewith, wherein said at least one inner peripheral surface of said cooling fin device is adjacent said at least one outer peripheral surface of said core member; and

a shroud comprising a first portion and a second portion, wherein said first portion is located adjacent said at least one cooling fin, and wherein said second portion extends beyond said core member.

2. The heat sink of claim 1 wherein said second portion of said shroud has at least one slot formed therein.