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Method and apparatus for removing known good die

  • US 6,360,940 B1
  • Filed: 11/08/2000
  • Issued: 03/26/2002
  • Est. Priority Date: 11/08/2000
  • Status: Expired due to Fees
First Claim
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1. An apparatus for removing an integrated circuit from a substrate where said integrated circuit is attached to said substrate by a plurality of solder connection points, comprising:

  • a pallet having a cavity into which the substrate and integrated circuit fit, said pallet having a plurality of air channels formed in said pallet;

    a heating plate, onto which the pallet, substrate and integrated circuit are placed to increase the temperature of the plurality of solder connection points to a reflow temperature; and

    fluidic pulling means applied to the integrated circuit through the pallet plurality of air channels to remove the integrated circuit from the substrate after the plurality of solder connection points achieve a reflow temperature, said fluidic pulling means also maintaining the integrated circuit in the pallet cavity.

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