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Substrate coupling method

  • US 6,361,389 B1
  • Filed: 09/30/1999
  • Issued: 03/26/2002
  • Est. Priority Date: 09/30/1999
  • Status: Expired due to Fees
First Claim
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1. A method of adhering substrates together, the steps comprising:

  • introducing a primary substrate having a first surface and at least one outer peripheral edge;

    applying a bonding element to the first surface in proximity to the outer peripheral edge;

    introducing a secondary substrate having a second surface;

    placing the secondary substrate adjacent the primary substrate and seating the secondary substrate upon the bonding element in a first surface to second surface relationship to thereby form a bonded substrate, the bonded substrate having a cell bounded by the substrate'"'"'s peripheries and the first surface and the second surface;

    introducing at least one injector;

    inserting the injector into and through the bonding element at a first opening comprising a bottom of the bonded substrate, the injector in fluid-flow communication with the cell;

    thereby forming at least one injection port;

    inserting a means for exhausting into and through the bonding element at a second opening of the bonded substrate, the means for exhausting in communication with the cell;

    providing a means for optically cohering and introducing the means for optically cohering to the injector;

    injecting the means for optically cohering in to the cell and ejecting any gas within the cell through the means for exhausting; and

    filling the cell with the means for optically cohering.

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