Printed wiring board for semiconductor plastic package
First Claim
1. A printed wiring board for a semiconductor plastic package, which printed wiring board has, a double-side copper-clad laminate formed of an insulation layer having a thickness of 0.2 mm or less and having copper foils on both surfaces, one copper foil on one surface and one copper foil on the other surface,wherein the double-side copper-clad laminate has an upper copper foil surface and a lower copper foil surface, the upper copper foil surface has a wire bonding or flip chip bonding terminal for connecting a terminal of a semiconductor chip to said substrate, and has a copper pad in a position where the copper pad can be electrically connected to said wire bonding or flip chip bonding terminal and can be connected to a blind via hole formed in the lower copper surface, the lower copper foil surface has a solder-balls-fixing pad in a position corresponding to said copper pad, the solder-balls-fixing pad has at least 2 blind via holes within itself, and the solder-balls-fixing pad connected to a reverse surface of the copper pad with a conductive material is electrically connected to a conductive material with solder balls which are melted and filled in blind via holes so as to be mounded.
1 Assignment
0 Petitions
Accused Products
Abstract
Printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package. The distortion of the printed wiring board is decreased and the distortion of a semiconductor plastic package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased. The board has at least two blind via holes in one solder-balls-fixing pad.
57 Citations
7 Claims
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1. A printed wiring board for a semiconductor plastic package, which printed wiring board has, a double-side copper-clad laminate formed of an insulation layer having a thickness of 0.2 mm or less and having copper foils on both surfaces, one copper foil on one surface and one copper foil on the other surface,
wherein the double-side copper-clad laminate has an upper copper foil surface and a lower copper foil surface, the upper copper foil surface has a wire bonding or flip chip bonding terminal for connecting a terminal of a semiconductor chip to said substrate, and has a copper pad in a position where the copper pad can be electrically connected to said wire bonding or flip chip bonding terminal and can be connected to a blind via hole formed in the lower copper surface, the lower copper foil surface has a solder-balls-fixing pad in a position corresponding to said copper pad, the solder-balls-fixing pad has at least 2 blind via holes within itself, and the solder-balls-fixing pad connected to a reverse surface of the copper pad with a conductive material is electrically connected to a conductive material with solder balls which are melted and filled in blind via holes so as to be mounded.
Specification