Device and method for providing a true semiconductor die to external fiber optic cable connection
First Claim
1. An apparatus comprising:
- a semiconductor die having a first surface;
an integrate circuit fabricated on the first surface of the semiconductor die;
a package encapsulating the semiconductor die;
a module mounted onto the package, the module configured to receive an external fiber optic cable;
an opto-electric device housed in the module; and
at least one electrical conductor coupled between the integrated circuit fabricated on the first surface of the semiconductor die and the opto-electric device housed in the module.
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Accused Products
Abstract
A low cost device that provides a true die to external fiber optic connection. The device includes a semiconductor die having a first surface, an integrate circuit fabricated on the first surface of the semiconductor die and a package encapsulating the semiconductor die. The device also includes a module mounted onto the package and configured to receive an external fiber optic cable. An opto-electric device, housed in the module is optically coupled to the fiber optic cable when the cable is inserted into the module. To provide the direct die to external fiber optic connection, at least one electrical conductor is provided between the integrated circuit fabricated the semiconductor die, through the package and module, and directly to the opto-electrical device.
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Citations
25 Claims
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1. An apparatus comprising:
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a semiconductor die having a first surface;
an integrate circuit fabricated on the first surface of the semiconductor die;
a package encapsulating the semiconductor die;
a module mounted onto the package, the module configured to receive an external fiber optic cable;
an opto-electric device housed in the module; and
at least one electrical conductor coupled between the integrated circuit fabricated on the first surface of the semiconductor die and the opto-electric device housed in the module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method comprising the steps of:
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encapsulating a semiconductor die with an integrated circuit fabricated thereon into a package;
mounting a module housing an opto-electric device onto the package; and
providing a direct electrical connection between the opto-electric device in the module and the integrated circuit fabricated on the semiconductor die by providing an electrical contact between the opto-electric device and the integrated circuit by passing an electrical contact through the module and the package where the module is mounted to the package. - View Dependent Claims (24, 25)
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Specification