Device and method for providing a true semiconductor die to external fiber optic cable connection

• US 6,364,542 B1
• Filed: 05/09/2000
• Issued: 04/02/2002
• Est. Priority Date: 05/09/2000
• Status: Active Grant

• Current Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Original Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Inventors: Deane, Peter, Nguyen, Luu, Tsay, Chen-Hui, Murray, Cade
• Primary Examiner(s): Palmer, Phan T. H.
• Application Number:
  US09/568,094
• Time in Patent Office: 693 Days
• Field of Search: 385/88-94
• US Class Current: 385/92
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures

Abstract

A low cost device that provides a true die to external fiber optic connection. The device includes a semiconductor die having a first surface, an integrate circuit fabricated on the first surface of the semiconductor die and a package encapsulating the semiconductor die. The device also includes a module mounted onto the package and configured to receive an external fiber optic cable. An opto-electric device, housed in the module is optically coupled to the fiber optic cable when the cable is inserted into the module. To provide the direct die to external fiber optic connection, at least one electrical conductor is provided between the integrated circuit fabricated the semiconductor die, through the package and module, and directly to the opto-electrical device.

Claims

1. An apparatus comprising:

a semiconductor die having a first surface;

an integrate circuit fabricated on the first surface of the semiconductor die;

a package encapsulating the semiconductor die;

a module mounted onto the package, the module configured to receive an external fiber optic cable;

an opto-electric device housed in the module; and

at least one electrical conductor coupled between the integrated circuit fabricated on the first surface of the semiconductor die and the opto-electric device housed in the module.

2. The apparatus of claim 1, wherein the module further comprises a base configured to mount the module onto the package encapsulating the die.

3. The apparatus of claim 2, wherein the base further comprises at least one via configured to accommodate the at least one electrical conductor passing through the base.

4. A The apparatus of claim 2, wherein the base comprises an electrically insulative material.

5. The apparatus of claim 2, wherein the base comprises a thermally conductive material.

6. The apparatus of claim 1, wherein the opto-electric device is a transmitter configured to convert electrical signals generated on the integrated circuit and received via the at least one electrical conductor into light signals.

7. The apparatus of claim 6, wherein the transmitter is one of the following types of transmitters:

a light emitting diode, an edge emitting laser, or a vertical carrier surface emitting laser.

8. The apparatus of claim 1, wherein the opto-electric device is a transmitter configured to be optically coupled directly to the external fiber cable when the external fiber cable is inserted into the housing.

9. The apparatus of claim 1, wherein the opto-electric device is a detecter configured to be optically coupled directly to the external fiber cable when the external fiber cable is inserted into the housing.

10. The apparatus of claim 1, wherein the module further comprises an internal chamber configured to house the opto-electric device.

11. The apparatus of claim 10, wherein the module further comprises a second opto-electric device.

12. The apparatus of claim 1, wherein the opto-electric device is a detector configured to convert light signals received at the module into electrical signals and to provide the electrical signals to the semiconductor die via the at least one electrical conductor.

13. The apparatus of claim 12, wherein the detector comprises a band gap element configured to generate free electrons in response to being exposed to light.

14. The apparatus of claim 1, further comprising an adhesive between the base of the module and the package to secure the module to the package.

15. The apparatus of claim 1, wherein the at least one electrical conductor comprises a solder ball formed on the first surface of the semiconductor die.

16. The apparatus of claim 1, further comprising a mirror housed within the module, the mirror configured to direct light signals between the opto-electric device in the module and the external fiber optic cable when inserted into the module.

17. The apparatus of claim 1, further comprising a translucent material substantially occupying a chamber formed within the module.

18. The apparatus of claim 17, wherein the translucent material comprises one of the following types of translucent materials:

plastic, acrylic, polycarbonate, or a transparent plastic.

19. The apparatus of claim 1, wherein module has an external surface comprising an opaque material.

20. The apparatus of claim 1, further comprising a plurality of electrical conductors coupled between the integrated circuit fabricated on the first surface of the die and the opto-electric device housed in the module.

21. The apparatus of claim 1, wherein the module is configured to receive the external fiber optic cable via a pigtail connection.

22. The apparatus of claim 1, wherein the module is configured to receive the external fiber optic cable using an external connector which mounts to the module.

23. A method comprising the steps of:

encapsulating a semiconductor die with an integrated circuit fabricated thereon into a package;

mounting a module housing an opto-electric device onto the package; and

providing a direct electrical connection between the opto-electric device in the module and the integrated circuit fabricated on the semiconductor die by providing an electrical contact between the opto-electric device and the integrated circuit by passing an electrical contact through the module and the package where the module is mounted to the package.

24. The method of claim 23, wherein the step of providing the direct electrical connection further comprises the step of providing an electrically conductive post through the module and package.

25. The method of claim 23, wherein the step of providing the direct electrical connection further comprises the step of providing a conductive post electrically connected to the opto-electric device through the module and providing a solder ball on the surface of the die which contacts the post.