300 mm CVD chamber design for metal-organic thin film deposition
First Claim
1. A faceplate for a chemical vapor deposition chamber showerhead assembly, comprising:
- (a) a central monolithic portion comprising an upper face and a lower face and including a plurality of gas outlet holes extending between the upper face and the lower face; and
(b) an annular raised shoulder concentrically disposed about a perimeter of the central monolithic portion and having a substantially planar temperature control plate mounting surface disposed generally parallel to the lower face.
1 Assignment
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Accused Products
Abstract
The present invention relates to plasma-enhanced chemical vapor deposition (PECVD) and related chamber hardware. Embodiments of the present invention include a PECVD system for depositing a film of titanium nitride from a TDMAT precursor. The present invention broadly provides a chamber, a gas delivery assembly, a pedestal which supports a substrate, and a plasma system to process substrates. In general, the invention includes a chamber body and a gas delivery assembly disposed thereon to define a chamber cavity. A pedestal movably disposed within the chamber cavity is adapted to support a substrate during processing. The gas delivery assembly is supported by the chamber body and includes a temperature control plate and a showerhead mounted thereto. Preferably, the interface between the showerhead and temperature control plate is parallel to a radial direction of the gas delivery assembly to accommodate lateral thermal expansion without separation of the showerhead and the temperature control plate. A blocker plate, or baffle plate, may be disposed between the showerhead and temperature control plate to facilitate dispersion of gases delivered thereto.
402 Citations
33 Claims
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1. A faceplate for a chemical vapor deposition chamber showerhead assembly, comprising:
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(a) a central monolithic portion comprising an upper face and a lower face and including a plurality of gas outlet holes extending between the upper face and the lower face; and
(b) an annular raised shoulder concentrically disposed about a perimeter of the central monolithic portion and having a substantially planar temperature control plate mounting surface disposed generally parallel to the lower face. - View Dependent Claims (2, 3, 4, 5, 6, 7, 20, 21)
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8. An apparatus, comprising:
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(a) a chamber body defining a processing cavity;
(b) a substrate support member disposed in the processing cavity; and
(c) a lid assembly disposed at one end of the chamber body, the lid assembly comprising;
(i) a temperature control plate having an annular mounting flange and a lower mounting surface; and
(ii) a faceplate coupled to the temperature control plate, the faceplate comprising;
(1) a perforated portion having an upper face and a lower face; and
(2) a perimeter upper mounting surface in mating abutment with the lower mounting surface of the temperature control plate, wherein the lower mounting surface of the temperature control plate is parallel to the lower face of the faceplate. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 22)
(a) a gas inlet disposed at least partially through the temperature control plate providing fluid communication to the perforated portion of the faceplate; and
(b) one or more cooling channels formed at least partially in the temperature control plate.
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15. The apparatus of claim 8, further comprising a power supply coupled to the faceplate.
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16. The apparatus of claim 8, wherein the faceplate comprises a material selected from the group of aluminum and aluminum alloy.
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17. The apparatus of claim 8, wherein the lid assembly further comprising:
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(a) a lid rim disposed on the chamber body and around the faceplate; and
(b) an isolator ring disposed between the lid rim and the lid assembly and around the faceplate.
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18. The apparatus of claim 8, further comprising one or more mounting bores formed in the faceplate and the temperature control plate.
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19. The apparatus of claim 18, further comprising a fastener disposed through each of the mounting bores to couple the faceplate and the temperature control plate to one another.
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22. The apparatus of claim 8, wherein the temperature control plate comprises a body defining a plurality of fluid channels.
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23. A gas delivery assembly for a semiconductor processing system, comprising:
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(a) a temperature control plate having a substantially planar lower mounting surface; and
(b) a faceplate coupled to the substantially planar lower mounting surface, wherein the faceplate comprises a perforated portion having gas holes formed therein and a perimeter mounting surface in mating abutment with the substantially planar lower mounting surface, and wherein a thermal contact resistance of the faceplate is between about 0.4×
10−
4 m2K/W and about 2.0×
10−
4 m2K/W.- View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
(a) an upper face;
(b) a lower face;
(c) an annular shoulder disposed at a perimeter of the faceplate and having a substantially planar upper mounting surface disposed parallel to the lower face and in mating abutment with the substantially planar lower mounting surface of the temperature control plate; and
(d) a plurality of gas outlet holes extending between the upper face to the lower face.
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27. The gas delivery assembly of claim 23, wherein the substantially planar upper mounting surface and the substantially planar lower mounting surface are parallel to the lower face of the faceplate.
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28. The gas delivery assembly of claim 27, wherein the substantially planar upper mounting surface and the substantially planar tower mounting surface are adapted to accommodate lateral thermal expansion during operation.
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29. The gas delivery assembly of claim 23, further comprising a blocker plate having a plurality of holes formed therein disposed between the faceplate and the temperature control plate.
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30. The gas delivery assembly of claim 23, wherein the temperature control plate comprises:
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(a) a gas inlet disposed at least partially therethrough and providing fluid communication to the perforated portion of the faceplate; and
(b) one or more cooling channels formed at least partially therein.
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31. The gas delivery assembly of claim 23, wherein the faceplate comprises a material selected from the group of aluminum and aluminum alloy.
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32. The gas delivery assembly of claim 23, further comprising one or more mounting bores formed in the faceplate and the temperature control plate.
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33. The gas delivery assembly of claim 32, further comprising a fastener disposed in each of the mounting bores to couple the faceplate and the temperature control plate to one another.
Specification