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Graphite-fiber enhanced molded plastic for electronic enclosures

  • US 6,365,076 B1
  • Filed: 06/05/2000
  • Issued: 04/02/2002
  • Est. Priority Date: 06/04/1998
  • Status: Expired due to Fees
First Claim
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1. A method of forming an enclosure for housing an electronic component, said method comprising:

  • adding a resin and an additive material to a mold, said mold to form said enclosure; and

    varying an amount of said additive material during said adding to provide a varying concentration of said additive material along a thickness of said enclosure, said varying concentration being higher along an interior surface of said enclosure and lower along an exterior surface of said enclosure, said higher concentration of additive material being approximately 50% by volume.

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