Method to eliminate shorts between adjacent contacts due to interlevel dielectric voids

• US 6,365,464 B1
• Filed: 05/25/1999
• Issued: 04/02/2002
• Est. Priority Date: 05/25/1999
• Status: Expired due to Term

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Wu, James, Lee, Yu-Hua, Chiang, Ming-Hsiung
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Le, Dung Anh
• Application Number:
  US09/318,470
• Time in Patent Office: 1,043 Days
• Field of Search: 438/299, 438/546, 438/586, 438/639, 438/571, 438/396, 438/672, 438/947
• US Class Current: 438/279
• CPC Class Codes: H01L 21/76831 in via holes or trenches, e.g. non-conductive sidewall liners
• CPC Class Codes: H01L 21/76897 Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665

Abstract

A method to form contacts in an integrated circuit device comprising to eliminate shorting between adjacent contacts due to dielectric layer voids is achieved. A substrate is provided. Narrowly spaced conductive lines are provided on the substrate. A dielectric layer is deposited overlying the conductive lines and the substrate. The dielectric layer is etched through to the top surface of the substrate in areas defined by lithographic mask to form contact openings between adjacent narrowly spaced conductive lines. An insulating layer is deposited overlying the dielectric layer and filling the contact openings wherein the insulating layer forms a lining layer inside the contact openings and fills any voids in the dielectric layer extending out of the contact openings. The insulating layer is etched through to expose the top surface of the substrate. A conductive layer is deposited overlying the dielectric layer and filling the contact openings. The conductive layer is etched as defined by lithographic mask. A passivation layer is deposited overlying the conductive layer and the dielectric layer. The integrated circuit device is completed.

Claims

1. A method to form contacts in an integrated circuit device comprising:

providing a semiconductor substrate;

providing narrowly spaced conductive lines on said semiconductor substrate;

depositing a dielectric layer overlying said conductive lines and said semiconductor substrate wherein a void is formed in said dielectric layer between planned contact openings;

etching through said dielectric layer to the top surface of said semiconductor substrate in areas defined by lithographic mask to thereby form said contact openings wherein said contact openings are between adjacent said narrowly spaced conductive lines and wherein said void horizontally intersects said contact openings;

depositing an insulating layer overlying said dielectric layer and filling said contact openings wherein said insulating layer forms a lining layer inside said contact openings and wherein said insulating layer fills said void in said dielectric layer horizontally intersecting said contact openings;

etching through said insulating layer to expose said top surface of said semiconductor substrate;

depositing a conductive layer overlying said dielectric layer and filling said contact openings;

etching said conductive layer as defined by lithographic mask;

depositing a passivation layer overlying said conductive layer and said dielectric layer; and

completing said integrated circuit device.

2. The method according to claim 1 wherein said narrowly spaced conductive lines are comprised of one of the group containing:

polysilicon, aluminum, copper, alloys of aluminum, and alloys of copper.

3. The method according to claim 1 wherein said narrowly spaced conductive lines are spaced not more than about 0.25 microns apart.

4. The method according to claim 1 wherein said dielectric layer is a plasma enhanced oxide deposited using tetraethyl orthosilicate as a silicon source.

5. The method according to claim 1 wherein said dielelectric layer is deposited to a thickness of between about 5,000 Angstroms and 12,000 Angstroms.

6. The method according to claim 1 wherein said insulating layer is a low-pressure deposited silicon oxide using tetraethyl orthosilicate as a silicon source.

7. The method according to claim 1 wherein said insulating layer is deposited to a thickness of between about 200 and 1000 Angstroms.

8. The method according to claim 1 wherein said etching through of said insulating layer is by a reactive ion etching process using a chemistry comprising CHF₃ and CF₄ gases.

9. The method according to claim 1 wherein said etching through of said insulating layer removes between about 400 and 1500 Angstroms of said insulating layer.

10. A method to form contacts in an integrated circuit device comprising:

providing a semiconductor substrate containing narrowly spaced MOS transistor gates, sources, and drains;

depositing a dielectric layer overlying said MOS transistor gates and said semiconductor substrate wherein a void is formed in said dielectric layer between said MOS transistor gates;

etching through said dielectric layer to the top surface of said semiconductor substrate in areas defined by lithographic mask to form contact openings wherein said contact openings are between adjacent said narrowly spaced MOS transistor gates and wherein said void horizontally intersects said contact openings;

depositing an insulating layer overlying said dielectric layer and filling said contact openings wherein said insulating layer forms a lining layer inside said contact openings and wherein said insulating layer fills said void in said dielectric layer horizontally intersecting said contact openings;

etching through said insulating layer to expose said top surface of said semiconductor substrate;

depositing a conductive layer overlying said dielectric layer and filling said contact openings;

etching said conductive layer as defined by lithographic mask;

depositing a passivation layer overlying said conductive layer and said dielectric layer; and

completing said integrated circuit device.

11. The method according to claim 10 wherein said narrowly spaced MOS transistor gates are spaced not more than about 0.25 microns apart.

12. The method according to claim 10 wherein said dielectric layer is a plasma enhanced oxide deposited using tetraethyl orthosilicate as a silicon source.

13. The method according to claim 10 wherein said dielectric layer is deposited to a thickness of between about 5,000 Angstroms and 12,000 Angstroms.

14. The method according to claim 10 wherein said insulating layer is a low-pressure deposited silicon oxide using tetraethyl orthosilicate as a silicon source.

15. The method according to claim 10 wherein said insulating layer is deposited to a thickness of between about 200 and 1000 Angstroms.

16. The method according to claim 10 wherein said etching through of said insulating layer is by a reactive ion etching process using a chemistry comprising CHF₃ and CF₄ gases.

17. The method according to claim 10 wherein said etching through of said insulating layer removes between about 400 and 1500 Angstroms of said insulating layer.

18. A method to form contacts in an integrated circuit device comprising:

providing a semiconductor substrate containing narrowly spaced MOS transistor gates, sources, and drains wherein said narrowly spaced MOS transistor gates are spaced not more than 0.25 microns;

depositing a dielectric layer overlying said MOS transistor gates and said semiconductor substrate wherein a void is formed in said dielectric layer between said MOS transistor gates;

etching through said dielectric layer to the top surface of said semiconductor substrate in areas defined by lithographic mask to form contact openings wherein said contact openings are between adjacent said narrowly spaced MOS transistor gates and wherein said void horizontally intersects said contact openings;

depositing an insulating layer overlying said dielectric layer and filling said contact openings wherein said insulating layer forms a lining layer inside said contact openings and wherein said insulating layer fills said void in said dielectric layer horizontally intersecting said contact openings and wherein said insulating layer is silicon oxide;

etching through said insulating layer to expose said top surface of said semiconductor substrate wherein said etching through is by reactive ion etching;

depositing a conductive layer overlying said dielectric layer and filling said contact openings;

etching said conductive layer as defined by lithographic mask;

depositing a passivation layer overlying said conductive layer and said dielectric layer; and

completing said integrated circuit device.

19. The method according to claim 18 wherein said insulating layer is deposited to a thickness of between about 200 and 1000 Angstroms.

20. The method according to claim 18 wherein said etching through of said insulating layer removes between about 400 and 1500 Angstroms of said insulating layer.