Printed wiring board
First Claim
Patent Images
1. A printed wiring board comprising:
- a plurality of metal foils;
a substrate composed of at least one substrate material;
an electrical connection means comprising a conductive material for electrically connecting a plurality of electric circuits formed in said plurality of metal foils which extends through a through hole or a blind hole which is formed in said substrate; and
a prevention means provided on an inner wall of said through hole or blind hole for preventing said conductive material from dispersing or permeating into an interior of said substrate or over a surface thereof;
wherein said substrate comprises a composite material of woven fiber or non-woven fiber, and a resin;
wherein a major constituent of said woven fiber or non-woven fiber is organic fiber material; and
wherein said prevention means comprises a layer of metamorphic substance made by transmuting one or more constituent elements of said substrate.
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Accused Products
Abstract
In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.
25 Citations
7 Claims
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1. A printed wiring board comprising:
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a plurality of metal foils;
a substrate composed of at least one substrate material;
an electrical connection means comprising a conductive material for electrically connecting a plurality of electric circuits formed in said plurality of metal foils which extends through a through hole or a blind hole which is formed in said substrate; and
a prevention means provided on an inner wall of said through hole or blind hole for preventing said conductive material from dispersing or permeating into an interior of said substrate or over a surface thereof;
wherein said substrate comprises a composite material of woven fiber or non-woven fiber, and a resin;
wherein a major constituent of said woven fiber or non-woven fiber is organic fiber material; and
wherein said prevention means comprises a layer of metamorphic substance made by transmuting one or more constituent elements of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification
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Current AssigneeMatsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
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Original AssigneeMatsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
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InventorsNakai, Izuru, Okada, Toshiharu, Nakamura, Shinji, Hayashi, Hidenori, Nishii, Toshihiro, Yamane, Shigeru, Fujimoto, Toru
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Primary Examiner(s)Tolin, Michael A.
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Application NumberUS09/248,020Publication NumberTime in Patent Office1,147 DaysField of Search174/261, 174/262, 174/263, 174/264, 174/265, 174/266, 298/30, 298/46, 298/52, 219/121.7, 219/121.71, 428/901, 156/272.8US Class Current174/264CPC Class CodesH05K 1/0366 reinforced, e.g. by fibres,...H05K 2201/0278 Polymeric fibersH05K 2201/0355 Metal foilsH05K 2201/09581 Applying an insulating coat...H05K 2203/1136 Conversion of insulating ma...H05K 2203/1461 Applying or finishing the c...H05K 3/0017 Etching of the substrate by...H05K 3/0032 of organic insulating materialH05K 3/4069 for via connections in orga...Y10T 29/49165 by forming conductive walle...
