Micro-electro-mechanical optical device

• US 6,366,414 B1
• Filed: 09/03/1999
• Issued: 04/02/2002
• Est. Priority Date: 09/03/1999
• Status: Expired due to Term

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Agere Systems Guardian Corp. (Broadcom, Inc.), Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Aksyuk, Vladimir Anatolyevich, Bishop, David John
• Primary Examiner(s): MACK, RICKY LEVERN
• Application Number:
  US09/390,157
• Time in Patent Office: 942 Days
• Field of Search: 359/223, 359/224, 359/225, 359/226, 359/231, 359/237, 359/822, 359/824
• US Class Current: 359/822
• CPC Class Codes: B81B 3/0062 Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

An electro-mechanical structure which controls the movement of an optical device coupled thereto is disclosed. Both the electro-mechanical structure and the optical device are disposed on a substrate surface. The electro-mechanical structure controls the movement of the optical device by first lifting the optical device a predetermined distance above the plane of the substrate surface. Thereafter, the lifted optical device is moveable relative to the plane of the substrate surface in response to an electrostatic field generated between the electro-mechanical structure and the substrate.

Claims

1. A micro-electro-mechanical optical device, comprising:

a substrate having an optical device and an electro-mechanical structure disposed on a surface thereof wherein the electro-mechanical structure includes a plurality of beams, the beams having a first end coupled to the optical device and a second end coupled to the substrate and wherein the electro-mechanical structure lifts the optical device above the plane of the substrate surface in response to an activation force, and wherein the lifted optical device is movable relative to the plane of the substrate surface in response to the generation of an electrostatic field between the electro-mechanical structure and the substrate.

2. The micro-electro-mechanical optical device of claim 1 wherein the optical device is an optical mirror.

3. The micro-electro-mechanical optical device of claim 2, wherein each beam comprises one or more material layers.

4. The micro-electro-mechanical optical device of claim 3 wherein each beam comprises a first material layer and a second material layer, wherein the first material layer is characterized by a first coefficient of thermal expansion and the second material layer is characterized by a second coefficient of thermal expansion different from the first coefficient of thermal expansion.

5. The micro-electro-mechanical optical device of claim 3 wherein at least one of the one or more material layer has an intrinsic stress.

6. The micro-electro-mechanical optical device of claim 3 wherein the one or more material layers are selected from the group consisting of silicon nitride, polysilicon, silicon dioxide, and metal.

7. The micro-electro-mechanical optical device of claim 3 wherein at least one of the one or more material layers has a stress gradient.

8. The micro-electro-mechanical optical device of claim 1 wherein the electric field is generated by applying a bias voltage between the beams and the surface of the substrate.

9. The micro-electro-mechanical optical device of claim 1 wherein the electric field is generated by applying a bias voltage between the beams and the surface of the substrate.

10. The micro-electro-mechanical optical device of claim 1, wherein the electric field applied to each beam is about equal.

11. The micro-electro-mechanical optical device of claim 1 wherein the electric field applied to each beam is different.

12. An optical communication system, comprising:

a substrate having a micro-electro-mechanical optical device disposed on a surface thereof, wherein the micro-electro-mechanical optical device includes an optical device and a micro-electro-mechanical structure comprising a plurality of beams having a first end coupled to the optical device and a second end coupled to the substrate; and

wherein the micro-electro-mechanical structure lifts the optical device above the plane of the substrate surface in response to an activation force, and wherein the lifted optical device is movable relative to the plane of the substrate surface in response to the generation of an electric field between the micro-electro-mechanical structure and the substrate.

13. A method for moving an optical device, comprising the steps of:

providing a substrate having an optical device and a micro-electro-mechanical structure disposed on a surface thereof, wherein the micro-electro-mechanical structure includes a plurality of beams, wherein each beam has a first end coupled to the optical device and a second end coupled to the substrate;

lifting the optical device above the plane of the substrate surface by applying an activation force to the electro-mechanical structure; and

moving the lifted optical device relative to the plane of the substrate surface by generating an electric field between the micro-electro-mechanical structure and the substrate.

14. The method of claim 13 wherein the optical device is an optical mirror.

15. The method of claim 13 wherein the electric field is generated by applying a bias voltage between the beams and the surface of the substrate.

16. The method of claim 13 wherein each beam comprises one or more material layers.

17. The method of claim 16 wherein each beam comprises a first material layer and a second material layer, wherein the first material layer is characterized by a first coefficient of thermal expansion and the second material layer is characterized by a second coefficient of thermal expansion different from the first coefficient of thermal expansion.

18. The method of claim 16 wherein at least one of the one or more material layers has an intrinsic stress.

19. The method of claim 16 wherein the one or more material layers are selected from the group consisting of silicon nitride, polysilicon, silicon dioxide, and metal.

20. The method of claim 16 wherein at least one of the one or more material layers has a stress gradient.

21. The method of claim 13 wherein the electric field is generated by applying a bias voltage between the beams and an electrode on the surface of the substrate.

22. The method of claim 13 wherein the electric field applied to each beam is about equal.

23. The method of claim 13 wherein the electric field applied to each beam is different.