Closed-loop dome thermal control apparatus for a semiconductor wafer processing system

• US 6,367,410 B1
• Filed: 10/08/1997
• Issued: 04/09/2002
• Est. Priority Date: 12/16/1996
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Ryan, Robert E., Chen, Jerry C., Driscoll, Timothy, Hatcher, Brian, Remington, Richard E., Yavelberg, Simon, Guenther, Rolf, Qian, Xueyu, Leahey, Patrick
• Primary Examiner(s): Mills, Gregory
• Assistant Examiner(s): Zervigon, Rudy
• Application Number:
  US08/947,174
• Time in Patent Office: 1,644 Days
• Field of Search: 165/39, 118/723.E, 118/725, 438/711, 219/405, 156/345
• US Class Current: 118/723.00I
• CPC Class Codes: H01L 21/67103 mainly by conduction

Abstract

A closed-loop, dome thermal control apparatus containing a high-volume fan, a heat exchange chamber, and an enclosure that encloses the fan and the heat exchange chamber. The fan blows air over a dome of a semiconductor wafer processing system and through the heat exchange chamber to uniformly control the temperature of a dome of a plasma chamber to prevent particle contamination of the wafer. The enclosure recirculates the temperature controlled air to the fan to form a closed-loop apparatus.

Claims

1. Apparatus for thermally controlling the temperature of a dome of a reaction chamber within a semiconductor processing system, the dome including a dome axis, the apparatus comprising:

a fan, mounted proximate the dome, for blowing air over a surface of the dome, wherein said dome defines a lower surface of an enclosed space;

a vortex generator positioned substantially above the dome, the vortex generator generating a vortex flow that is substantially parallel to the dome axis and is directed towards the dome, the vortex generator is mounted between said fan and said dome; and

a heat exchange chamber, within an airflow path of said air being blown by said fan, for altering the temperature of said air.

2. The apparatus of claim 1 further comprising:

an enclosure for enclosing said fan and heat exchange chamber, where said air within said enclosure is recirculated by said fan over said dome and through said heat exchange chamber.

3. The apparatus of claim 1 wherein said vortex generator further comprises a nozzle ring containing a plurality of air directing nozzles.

4. The apparatus of claim 3 wherein each of the air directing nozzles contains an exhaust aperture that is oriented to have a central axis thereof tangent to a circle having a predefined radius, where the circle is centrally located above the dome.

5. The apparatus of claim 1 further comprising a lamp assembly having a plurality of heating lamps, where the intensity of the heating lamps are controlled by a lamp controller.

6. The apparatus of claim 1 wherein said heat exchange chamber contains heat transfer coils connected to a heat transfer fluid supply.

7. The apparatus of claim 6 wherein said heat transfer fluid supply is coupled to a hollow RF antenna coil to provide a coolant flow through said RF antenna coil.

8. The apparatus of claim 5 wherein said heating lamps are supported by the lamp assembly that is coupled to a heat transfer fluid supply for cooling said lamps.

9. The apparatus of claim 1 wherein the vortex generator further comprises a lower stator mounted between said fan and said dome, for generating the vortex flow.

10. The apparatus of claim 9 wherein said air direction generator further comprises a blade mounting ring containing a plurality of air directing stator blades.

11. The apparatus of claim 9 further comprising an upper stator, positioned above said fan, for reducing a back flow of air.

12. The apparatus of claim 9 further comprising a lamp assembly having a plurality of heating lamps, where the intensity of the heating lamps are controlled by a lamp controller.

13. The apparatus of claim 9 wherein said heat exchange chamber contains a plurality of heat transfer tubes coupled to a heat transfer fluid supply.

14. The apparatus of claim 12 wherein said heating lamps are supported by a lamp assembly that is coupled to a heat transfer fluid supply for cooling said lamps.

35. The apparatus of claim 1 wherein said vortex generator further comprises a lower stator comprising a plurality of stationary stator blades that extend about the center aperture.

36. The apparatus of claim 1, wherein the air flow of the vortex flow across the surface of the dome is substantially laminar.

37. The apparatus of claim 1, further comprising a lamp assembly positioned proximate the dome, and extending circumferentially of the dome center, wherein the lamp assembly is mounted between the dome and the vortex generator.

39. The apparatus of claim 1, wherein said vortex generator further comprises an upper stator, the fan is positioned between the dome and the vortex generator, the fan limits a backflow of air from the fan.

15. Apparatus for thermally controlling the temperature of a dome of a reaction chamber within a semiconductor processing system, the dome comprising a dome axis, the apparatus comprising:

a fan, mounted proximate the dome, for blowing air over the dome, wherein said dame defines a lower surface of an enclosed space; and

a vortex generator positioned substantially above the dome, the vortex generator mounted between said fan and said dome, for producing an air vortex over said dome, the air vortex having a vortex flow by is oriented substantially parallel to the dome axis.

16. The apparatus of claim 15 wherein said vortex generator further comprises a nozzle ring containing a plurality of air directing nozzles.

17. The apparatus of claim 16 wherein each of the air directing nozzles contains an exhaust aperture that is oriented to have a central axis thereof tangent to a circle having a predefined radius, where the circle is centrally located above the dome.

18. The apparatus of claim 15 further comprising:

a heat exchange chamber, within an airflow path of said air being blown by said fan, for altering the temperature of said air; and

an enclosure for enclosing said fan and heat exchange chamber, where said air is recirculated by said fan over said dome and through said heat exchange chamber.

40. The apparatus of claim 15, wherein said vortex generator further comprises a lower stator comprising a plurality of stationary stator blades that extend about the center aperture.

41. The apparatus of claim 15, wherein the air flow of the vortex flow across the surface of the dome is substantially laminar.

42. The apparatus of claim 15, further comprising a lamp assembly positioned proximate the dome, and extending circumferentially of the dome center, wherein the lamp assembly is mounted between the dome and the vortex generator.

44. The apparatus of claim 15, wherein said vortex generator further comprises an upper stator, the fan is positioned between the dome and the vortex generator, the fan limits a backflow of air from the fan.

19. Apparatus for thermally controlling the temperature of a dome of a reaction charter within a semiconductor processing system, the dome comprising a dome axis, the apparatus comprising:

a hollow RF antenna coil, mounted proximate said dome, for coupling RF fields into an atmosphere within said reaction chamber;

a vortex generator generating an air vortex having a vortex flow that is substantially parallel to the dome axis and is directed towards the dome, the hollow RF antenna coil is mounted between said vortex generator and said dome, wherein said dome defines a lower surface of an enclosed space; and

a heat transfer fluid supply, coupled to said hollow RF antenna coil, for providing heat transfer fluid to an interior space of said RF antenna coil and thereby altering the temperature of said dome.

20. The apparatus of claim 19 further comprising:

a fan, mounted proximate said dome, for blowing air over the dome;

a heat exchange chamber, within a recirculated airflow path of said air being blown by said fan, for altering the temperature of said air; and

an enclosure for enclosing said fan and heat exchange chamber, the enclosure defining a portion of the recirculated airflow path, where said air is recirculated by said fan after the air has passed over said dome and through said heat exchange chamber.

21. The apparatus of claim 20 wherein said heat exchange chamber further comprises a heat transfer coil coupled to said heat transfer fluid supply.

22. The apparatus of claim 19 further comprising a lamp assembly, mounted proximate said dome, for heating said dome, where said heat transfer fluid supply is coupled to said lamp assembly to cool the lamp assembly.

23. Apparatus for thermally controlling the temperature of a dome of a reaction chamber within a semiconductor processing system, the apparatus comprising:

a fan, mounted proximate the dome, for blowing air over the dome, wherein said dome defines a lower surface of an enclosed space;

a heat exchange chamber, within an airflow path of said air being blown by said fan, for altering the temperature of said air;

an enclosure for enclosing said fan and heat exchange chamber, where a substantial portion of said air is recirculated by said fan over said reaction chamber dome and through said heat exchange chamber;

at least one sensor for measuring operational parameters of the heat exchange chamber and deactivating said semiconductor processing system when said measured operational parameters exceed nominal operational parameters; and

an enclosure sensor, proximate said enclosure, for identifying when said enclosure is improperly aligned or removed, where said enclosure sensor deactivates said semiconductor processing system when said enclosure sensor indicates the enclosure is improperly aligned or removed.

24. The apparatus of claim 23 wherein said sensor is a temperature sensor for measuring air temperature within the enclosure.

25. The apparatus of claim 23 wherein said sensor is an air flow sensor for measuring air flow within the enclosure.

26. Apparatus for thermally controlling the temperature of a dome of a reaction chamber within a semiconductor processing system, the apparatus comprising:

a fan, mounted proximate the dome, for blowing air over the dome, wherein said dome defines a lower surface of an enclosed space;

an air flow director, mounted between said fan and said dome for producing a uniform air flow toward said dome; and

a cowling surrounding said fan.

27. The apparatus of claim 26 wherein said air flow director further comprises a blade mounting ring containing a plurality of air directing stator blades.

28. The apparatus of claim 26 further comprising:

a heat exchange chamber, within an airflow path of said air being blown by said fan, for altering the temperature of said air; and

an enclosure for enclosing said fan and heat exchange chamber, where said air is recirculated by said fan over said dome and through said heat exchange chamber.

29. The apparatus of claim 26 further comprising a stator, positioned above said cowling, for reducing back-flow of air from said fan.

30.The apparatus of claim 28 further comprising:

a heat exchange chamber, within an airflow path of said air being blown by said fan, for altering the temperature of said air; and

an enclosure for enclosing the baffle, lamp assembly, lower stator, fan cowling, fan, upper stator and heat exchange chamber, where said air is recirculated by said fan over said dome and through said heat exchange chamber.

31. The apparatus of claim 26 wherein said heat exchange chamber further comprises a plurality of heat transfer tubes coupled to a heat transfer fluid supply.

45. The apparatus of claim 28 wherein said heat exchange chamber further comprises a plurality of heat transfer tubes coupled to a heat transfer fluid supply.

30. The apparatus of claim 30 wherein said heat exchange chamber circumscribes said baffle, lamp assembly, lower stator, fan cowling, fan, and upper stator, where air flows axially through the baffle, lamp assembly, lower stator, fan cowling, fan, and upper stator, then radially over the dome and vertically through said heat exchange chamber.

32. The apparatus of claim 32 further comprising a lamp assembly, mounted proximate said dome, for heating said dome, where said heat transfer fluid supply is coupled to said lamp assembly to cool the lamp assembly.

33. A method for thermally controlling the temperature of a dome of a reaction chamber within a semiconductor processing system, the dome comprising a dome axis, the method comprising the acts of:

blowing air towards the dome with a fan, wherein said dome defines a lower surface of an enclosed space; and

producing an air vortex over the dome, with a vortex generator that is positioned substantially above the dome, the air vortex having a vortex flow that is oriented substantially parallel to the dome axis.

34. The method of claim 34, further comprising the acts of:

defining a recirculated airflow path including the air flow created by the fan;

altering the temperature of the air in the airflow path; and

enclosing the fan and heat exchange chamber within an enclosure defining a portion of the recirculated airflow path, wherein said air is recirculated by said fan after the air has passed over said dome and through said heat exchange chamber.

38. The apparatus of claim 38, wherein the lamp assembly comprises a central air flow aperture, wherein the vortex flow directed by the vortex generator towards the dome center flows through the central air flow aperture.

43. The apparatus of claim 43, wherein the lamp assembly comprises a central air flow aperture, wherein the vortex flow directed by the vortex generator towards the dome center flows through the central air flow aperture.

46. The apparatus of claim 46 further comprising a lamp assembly, mounted proximate said dome, for heating said dome, where said heat transfer fluid supply is coupled to said lamp assembly to cool the lamp assembly.